Abstract: A power module includes: a base plate having a first surface; electrode plate provided at the first surface; a wire connected to a semiconductor chip and the electrode plate; a metal member connected to the electrode plate; a terminal plate; a first resin layer, a connection portion of the wire and the semiconductor chip being disposed inside the first resin layer; and a second resin layer provided on the first resin layer and having a lower elastic modulus than the first resin layer. The terminal plate includes a bonding portion contacting an upper surface of the metal member, a curved portion curved upward from the bonding portion. The curved portion is disposed inside the second resin layer, and a length from the first surface of a lower surface of the bonding portion is greater than a length from the first surface of the connection portion.

Abstract: A semiconductor device according to one embodiment includes a first leadframe, a second leadframe, a semiconductor chip, and a conductive member. The second leadframe has a first face provided with a recess and is separated from the first leadframe. The semiconductor chip is mounted on the first leadframe. The conductive member has a second face connected to the first face with a conductive adhesive, the second face provided with a protrusion housed in the recess at least partially, and the conductive member electrically connected the semiconductor chip and the second leadframe to each other. The recess and the protrusion are longer in a first direction in which the first face extends than in a second direction along the first face and orthogonal to the first direction.

Abstract: A semiconductor device according to one embodiment includes a first leadframe, a second leadframe, a semiconductor chip, and a conductive member. The second leadframe has a first face provided with a recess and is separated from the first leadframe. The semiconductor chip is mounted on the first leadframe. The conductive member has a second face connected to the first face with a conductive adhesive, the second face provided with a protrusion housed in the recess at least partially, and the conductive member electrically connected the semiconductor chip and the second leadframe to each other. The recess and the protrusion are longer in a first direction in which the first face extends than in a second direction along the first face and orthogonal to the first direction.

Abstract: A power module includes: a base plate having a first surface; electrode plate provided at the first surface; a wire connected to a semiconductor chip and the electrode plate; a metal member connected to the electrode plate; a terminal plate; a first resin layer, a connection portion of the wire and the semiconductor chip being disposed inside the first resin layer; and a second resin layer provided on the first resin layer and having a lower elastic modulus than the first resin layer. The terminal plate includes a bonding portion contacting an upper surface of the metal member, a curved portion curved upward from the bonding portion. The curved portion is disposed inside the second resin layer, and a length from the first surface of a lower surface of the bonding portion is greater than a length from the first surface of the connection portion.

Abstract: According to one embodiment, a thermoelectric device is provided with thermoelectric elements and formed of a material capable of exhibiting the thermoelectric effect and a first electrode located at end portions of the thermoelectric elements. The first electrode includes an electrode member, a soaking member having electrical conductivity, located between the electrode member and the thermoelectric elements, and including facing portions facing the thermoelectric elements and folded portions folded back at peripheral edges of the facing portions so as to lie on the opposite side to the thermoelectric elements, and an elastic member located on the opposite side of the facing portions to the thermoelectric elements, at least a part of the peripheral edge of the elastic member being held between the folded portions and the facing portions of the soaking member.

Abstract: According to one embodiment, a thermoelectric module includes a housing and a power generation member. The housing has a first temperature layer and a second temperature layer, the first temperature layer and the second temperature layer being stacked, the housing further having a cylindrical through-hole provided so as to penetrate the first temperature layer and the second temperature layer. The power generation member has thermoelectric materials stacked such that current flows in one direction in the power generation member, the power generation member being provided in the through-hole so that opposite ends of each of the thermoelectric materials are positioned at the first temperature layer and the second temperature layer, respectively.

Abstract: According to one embodiment, a thermoelectric module includes a housing and a power generation member. The housing has a first temperature layer and a second temperature layer, the first temperature layer and the second temperature layer being stacked, the housing further having a cylindrical through-hole provided so as to penetrate the first temperature layer and the second temperature layer. The power generation member has thermoelectric materials stacked such that current flows in one direction in the power generation member, the power generation member being provided in the through-hole so that opposite ends of each of the thermoelectric materials are positioned at the first temperature layer and the second temperature layer, respectively.

Abstract: According to one embodiment, a thermoelectric device is provided with thermoelectric elements and formed of a material capable of exhibiting the thermoelectric effect and a first electrode located at end portions of the thermoelectric elements. The first electrode includes an electrode member, a soaking member having electrical conductivity, located between the electrode member and the thermoelectric elements, and including facing portions facing the thermoelectric elements and folded portions folded back at peripheral edges of the facing portions so as to lie on the opposite side to the thermoelectric elements, and an elastic member located on the opposite side of the facing portions to the thermoelectric elements, at least a part of the peripheral edge of the elastic member being held between the folded portions and the facing portions of the soaking member.

Abstract: According to one embodiment, there is provided a printed-wiring board with a component in which an electronic component is mounted on a pattern-forming surface of a base material. In the printed-wiring board, a guiding path for guiding, to the outside, a void formed in mounting the electronic component is formed on the pattern-forming surface.

Abstract: According to one embodiment, a printed wiring board includes a plurality of pads to which bumps are to be bonded respectively. The pads are each formed with a plurality of conductors, the conductors are separate from each other and correspond to one of the bumps, and the plurality of conductors define a gap therebetween, the gap being capable of receiving part of the one of the bumps.

Abstract: According to one embodiment, in a method of inspecting a printed wiring board, the printed wiring board which is provided with an outer-layer surface and an inner-layer surface is prepared for inspection. The printed wiring board includes a land provided on the outer-layer surface, a via ranging from the land to the inner-layer surface, and an inner layer pattern provided on the inner-layer surface, wherein the inner layer pattern is electrically connected to the via when a via shift in the printed wiring board is within a tolerance range. A conduction state between the land and the inner layer pattern is detected.

Abstract: According to one embodiment, there is provided a multilayered printed-wiring board, which includes a first wiring layer and a second wiring layer each of which forms an outer layer, a plurality of third wiring layers which are disposed between the first wiring layer and the second wiring layer to form an inner layer structure, first vias disposed in the first and second wiring layers, second vias disposed in the third wiring layers and connected to the first vias, and a third via disposed in an innermost third wiring layer in the inner layer structure and connected to the second vias, the third via having a diameter larger than those of the first and second vias.

Abstract: According to one embodiment, a printed wiring board includes a first layer, a flexible sheet member disposed at a part on a surface of the first layer, and a second layer which is disposed on the first layer and the flexible sheet member, a part of the second layer which corresponds to the flexible sheet member including an opening region.

Abstract: According to one embodiment, a component-embedded printed wiring board includes a base including a component mounting surface, a pair of conductive patterns which is disposed on the component mounting surface of the base, and a circuit component which is mounted on the base so as to be in close contact with the component mounting surface between the conductive patterns and electrically connected to the conductive patterns.

Abstract: According to one embodiment, a printed wiring board includes a first layer which has a plurality of grooves disposed in a bent area, and each length direction of the plurality of grooves intersects to a bending direction, and a second layer which is disposed on a face of a side opposed to a face with the grooves of the first layer disposed thereon.

Abstract: An image pickup apparatus includes a first connector arranged on a wiring board, a second connector including an optical lens and being engageable with the first connector, and a photoelectric conversion module on which light is incident from the optical lens, the photoelectric conversion module being fixedly held when the photoelectric conversion module is clamped by the first and second connectors in a state where the first and second connectors are in engagement and coupled relatively to each other.

Abstract: According to one embodiment, a printed-wiring board with a built-in component includes a first base material including a component mounting surface. A circuit component is mounted on the component mounting surface of the first base material. A stress relaxation material covers the circuit component. A second base material is stacked on the first base material by interposing, between the first base material and the second base material, an insulating layer covering the stress relaxation material.

Abstract: According to one embodiment, there is provided a printed-wiring board with a component in which an electronic component is mounted on a pattern-forming surface of a base material. In the printed-wiring board, a guiding path for guiding, to the outside, a void formed in mounting the electronic component is formed on the pattern-forming surface.

Abstract: According to one embodiment, there is provided a printed-wiring board with a built-in component including a first base material including a pattern forming surface on which a plurality of conductive patterns are formed. A circuit component is mounted on the pattern forming surface of the first base material, and is connected to the conductive patterns of the first base material. A filling material is stacked on the pattern forming surface of the first base material, and fills in a gap between the circuit component and the pattern forming surface. A second base material is stacked on the pattern forming surface of the first base material by interposing the filling material between the pattern forming surface and the second base material.

Abstract: An image pickup apparatus includes a first connector arranged on a wiring board, a second connector including an optical lens and being engageable with the first connector, and a photoelectric conversion module on which light is incident from the optical lens, the photoelectric conversion module being fixedly held when the photoelectric conversion module is clamped by the first and second connectors in a state where the first and second connectors are in engagement and coupled relatively to each other.