Patents by Inventor Jun Katsuragawa

Jun Katsuragawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6958748
    Abstract: With objectives of providing a transparent board with conductive multi-layer antireflection, under condition of high transmissivity not only on a glass substrate but also on a non-glass transparent substrate with property of conductivity and demanded resistance at most exterior surface, laminating at least three layer thin films on a transparent substrate provides with an effect of high transmissivity by suppressing reflection from interference of optical waves, in which the transparent first dielectric layer thin film on the substrate that has a higher refractive index than the substrate has, the transparent second dielectric layer thin film next to the first-layer film that has a lower refractive index than the substrate has, and the most exterior transparent third conductive-layer thin film.
    Type: Grant
    Filed: April 20, 2000
    Date of Patent: October 25, 2005
    Assignees: Matsushita Electric Industrial Co., Ltd., Nidek Co., Ltd.
    Inventors: Toshiharu Fukui, Akira Nakanishi, Hiroshi Moroi, Jun Katsuragawa
  • Patent number: 6727566
    Abstract: With objectives of providing with a transparent board with conductive multi-layer antireflection thin films, under condition of high transmissivity not only on a glass substrate but also on a non-glass transparent substrate with property of demanded electrical resistance at the most exterior surface, this invention laminates at least three layers of thin films on a transparent substrate, in which the transparent dielectric 1st-layer thin film on the substrate that has a higher refractive index than the substrate has, the transparent dielectric 2nd-layer thin film next to the 1st layer that has a lower refractive index than the substrate has, and the most exterior transparent conductive transparent thin film that includes weight percentage no less than 20% of SnO2.
    Type: Grant
    Filed: October 10, 2002
    Date of Patent: April 27, 2004
    Assignees: Matsushita Electric Industrial Co., Ltd., Nidek Co., Ltd.
    Inventors: Toshiharu Fukui, Akira Nakanishi, Hiroshi Moroi, Jun Katsuragawa
  • Patent number: 6657271
    Abstract: A transparent substrate with a multilayer antireflection film having electrical conductivity is disclosed. On a polycarbonate substrate (a refractive index of 1.58) with a hard coat, a first thin-film layer whose main component is SiO2 is formed with a thickness of 142.5 nm (approx. &lgr;/4 for a wavelength of 550 nm). A second thin-film layer whose main component is TiO2 is formed with a thickness of 124.0 nm on the first thin-film layer. Furthermore, a third thin-film layer whose main component is indium tin oxide (ITO) is formed with a thickness of 150.0 nm on the second thin-film layer.
    Type: Grant
    Filed: April 24, 2002
    Date of Patent: December 2, 2003
    Assignee: Nidek Company, Limited
    Inventor: Jun Katsuragawa
  • Publication number: 20020197824
    Abstract: A transparent substrate with a multilayer antireflection film having electrical conductivity is disclosed. On a polycarbonate substrate (a refractive index of 1.58).with a hard coat, a first thin-film layer whose main Component is SiO2 is formed with a thickness of 142.5 nm (approx. &lgr;/4 for a wavelength of 550 nm). A second thin-film layer whose main component is TiO2 is formed with a thickness of 124.0 nm on the first thin-film layer. Furthermore, a third thin-film layer whose main component is indium tin oxide (ITO) is formed with a thickness of 150.0 nm on the second thin-film layer.
    Type: Application
    Filed: April 24, 2002
    Publication date: December 26, 2002
    Applicant: NIDEK CO., LTD.
    Inventor: Jun Katsuragawa