Abstract: The present invention discloses a method of making a printed circuit board comprising the steps of forming a sublayer comprising a combination of alternating copper and insulating layers, which has a first through-hole the internal wall of which is copper electroplated, forming a sublayer attaching structure comprising a hardened (cured) epoxy layer and adhesive films on top of both surfaces of said epoxy layer, which has q second through-hole filled with conducting ink, and (c) laying the sublayer attaching structure in contact between the upper sublayer and lower sublayer in such a way that said first through-hole is aligned with said second through-hole, and performing a complete hardening (curing) process.