Patents by Inventor Jun Kumazawa

Jun Kumazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor integrated device having parallel signal lines
    Patent number: 5523622
    Abstract: For taking a characteristic impedance matching of signal transmission lines in a package which carries thereon a semiconductor chip with a very high-speed LSI formed thereon, there is provided a semiconductor integrated circuit device wherein one ends of signal transmission lines formed on a main surface of a package substrate are extended up to the position just under pads formed on a main surface of the semiconductor chip and are connected to the pads on the chip electrically through bump electrodes, while opposite ends of the signal transmission lines are extended to the outer peripheral portion of the main surface of the package substrate and outer leads are bonded thereto.
    Type: Grant
    Filed: September 25, 1995
    Date of Patent: June 4, 1996
    Assignees: Hitachi, Ltd., Hitachi ULSI Engineering Corp.
    Inventors: Takashi Harada, Kazuhiro Yoshihara, Kazutaka Masuzawa, Kiyoshi Hayashi, Jun Kumazawa, Kenji Nagai, Masahiko Nishiuma, Chiyoshi Kamada