Patents by Inventor Jun-kwan PARK

Jun-kwan PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250109496
    Abstract: A film depositing composition including a Group 4 metal element-containing precursor compound and a method for forming a Group 4 metal element-containing film using same is described. The use of the film depositing composition including a Group 4 metal element-containing precursor compound achieves self-limiting film growth of ALD over a wide temperature range from low to high temperatures, enabling the formation of a Group 4 metal element-containing film for various purposes at various process temperatures. Particularly, according to the method for forming a Group 4 metal element-containing film of this invention, the growth per cycle (GPC) of ALD is consistent over a broad temperature range, thus making it possible to form a Group 4 metal element-containing film of uniform thickness even on surfaces with large aspect ratio trenches. Thus, the method can be advantageously utilized in manufacturing various semiconductor devices, such as DRAM, 3D NAND flash memory, and the like.
    Type: Application
    Filed: May 11, 2023
    Publication date: April 3, 2025
    Inventors: Byung Kwan KIM, Jin Sik KIM, Myeong Ho PARK, Sung Woo AHN, Da Som YU, Jun Hwan CHOI
  • Patent number: 12237253
    Abstract: A semiconductor package includes an interposer having a pad insulating film, a first lower pad exposed from a lower surface of the pad insulating film, the first lower pad including a first extension and a second extension spaced apart from each other and extending side by side in a first direction, and a first connection extending in a second direction intersecting the first direction and connecting the first extension and the second extension, and a redistribution structure that covers an upper surface of the pad insulating film, first interposer bumps on a lower surface of the interposer and spaced apart from each other, at least a part of each of the first and second extensions being connected to one of the first interposer bumps, and a first semiconductor chip on an upper surface of the interposer and electrically connected to the redistribution structure.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: February 25, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun Hyeong Park, Jin Young Kim, Young Kwan Seo
  • Publication number: 20150325200
    Abstract: Provided are a source driver configured to drive a display panel and a display device including the same. A source driver configured to drive a source line of a display panel includes a digital circuit configured to receive and store digital pixel data, and an analog circuit configured to convert the stored digital pixel data into an analog-signal-type gradation voltage and output the analog-signal-type gradation voltage. A static current of the analog circuit is reduced in response to a value of a timing signal corresponding to a non-driving section of the display panel.
    Type: Application
    Filed: May 7, 2015
    Publication date: November 12, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ho-hak RHO, Gyu-sung PARK, Seung-jung LEE, Jun-kwan PARK