Patents by Inventor Jun-Kyum Kim

Jun-Kyum Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor devices and methods of fabricating the same
    Patent number: 11476327
    Abstract: A semiconductor device includes a gate electrode extending in a first direction, on a substrate, first outer spacers extending along side surfaces of the gate electrode, a first active pattern extending in a second direction, which intersects the first direction, to penetrate the gate electrode and the first outer spacers, epitaxial patterns on the first active pattern and on side surfaces of the first outer spacers, second outer spacers between the first outer spacers and the epitaxial patterns and inner spacers between the substrate and the first active pattern and between the gate electrode and the epitaxial patterns, wherein in a cross section that intersects the second direction, at least parts of the second outer spacers are on side surfaces of the first active pattern and side surfaces of the inner spacers.
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: October 18, 2022
    Inventors: Dong Hyuk Yeom, Kwan Heum Lee, Jun Kyum Kim, Seong Hwa Park, So Hyun Seo
  • SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
    Publication number: 20220020849
    Abstract: A semiconductor device includes a gate electrode extending in a first direction, on a substrate, first outer spacers extending along side surfaces of the gate electrode, a first active pattern extending in a second direction, which intersects the first direction, to penetrate the gate electrode and the first outer spacers, epitaxial patterns on the first active pattern and on side surfaces of the first outer spacers, second outer spacers between the first outer spacers and the epitaxial patterns and inner spacers between the substrate and the first active pattern and between the gate electrode and the epitaxial patterns, wherein in a cross section that intersects the second direction, at least parts of the second outer spacers are on side surfaces of the first active pattern and side surfaces of the inner spacers.
    Type: Application
    Filed: February 16, 2021
    Publication date: January 20, 2022
    Inventors: Dong Hyuk YEOM, Kwan Heum LEE, Jun Kyum KIM, Seong Hwa PARK, So Hyun SEO
  • Semiconductor devices
    Patent number: 10700074
    Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: June 30, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun-Kyum Kim, Jung-Woo Seo, Sung-Un Kwon
  • SEMICONDUCTOR DEVICES
    Publication number: 20200176455
    Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
    Type: Application
    Filed: February 5, 2020
    Publication date: June 4, 2020
    Inventors: Jun-Kyum KIM, Jung-Woo SEO, Sung-Un KWON
  • Semiconductor devices having contact plugs overlapping associated bitline structures and contact holes
    Patent number: 10573653
    Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: February 25, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun-Kyum Kim, Jung-Woo Seo, Sung-Un Kwon
  • SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS OVERLAPPING ASSOCIATED BITLINE STRUCTURES AND CONTACT HOLES
    Publication number: 20190386009
    Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
    Type: Application
    Filed: August 28, 2019
    Publication date: December 19, 2019
    Inventors: Jun-Kyum KIM, Jung-Woo SEO, Sung-Un KWON
  • Method of manufacturing semiconductor devices having contact plugs overlapping associated bitline structures and contact holes
    Patent number: 10446558
    Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: October 15, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-Kyum Kim, Jung-Woo Seo, Sung-Un Kwon
  • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS OVERLAPPING ASSOCIATED BITLINE STRUCTURES AND CONTACT HOLES
    Publication number: 20190131307
    Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
    Type: Application
    Filed: December 27, 2018
    Publication date: May 2, 2019
    Inventors: Jun-Kyum Kim, Jung-Woo Seo, Sung-Un Kwon
  • Method of manufacturing semiconductor devices having contact plugs overlapping associated bitline structures and contact holes
    Patent number: 10177155
    Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: January 8, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-Kyum Kim, Jung-Woo Seo, Sung-Un Kwon
  • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS OVERLAPPING ASSOCIATED BITLINE STRUCTURES AND CONTACT HOLES
    Publication number: 20180019246
    Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
    Type: Application
    Filed: September 26, 2017
    Publication date: January 18, 2018
    Inventors: Jun-Kyum KIM, Jung-Woo SEO, Sung-Un KWON
  • Method of manufacturing semiconductor devices having contact plugs overlapping associated bitline structures and contact holes
    Patent number: 9786672
    Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: October 10, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-Kyum Kim, Jung-Woo Seo, Sung-Un Kwon
  • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS OVERLAPPING ASSOCIATED BITLINE STRUCTURES AND CONTACT HOLES
    Publication number: 20170025419
    Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
    Type: Application
    Filed: October 7, 2016
    Publication date: January 26, 2017
    Inventors: Jun-Kyum Kim, JUNG-WOO SEO, SUNG-UN KWON
  • Semiconductor devices having contact plugs overlapping associated bitline structures and contact holes and method of manufacturing the same
    Patent number: 9490256
    Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: November 8, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-Kyum Kim, Jung-Woo Seo, Sung-Un Kwon
  • SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS OVERLAPPING ASSOCIATED BITLINE STRUCTURES AND CONTACT HOLES AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160056159
    Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
    Type: Application
    Filed: June 29, 2015
    Publication date: February 25, 2016
    Inventors: Jun-Kyum Kim, Jung-Woo Seo, Sung-Un Kwon