Abstract: An improved load lock chamber is provided. The load lock chamber includes a gas vent port, a first compartment configured to receive a wafer for loading into and unloading from a main vacuum chamber, and a second compartment partitioned from the first compartment. The second compartment is configured to receive gas through the gas vent port. The load lock chamber also includes a flow attenuation path connecting the first compartment and the second compartment. The flow attenuation path is configured to route the gas from the second compartment to the first compartment and to attenuate gas flow.

Abstract: A vacuum chamber system comprises a supporting structure configured to support an object to be thermally stabilized, a plate, having a first surface facing the object, positioned such that the first surface is located within a predetermined distance from the object when the object is placed on the supporting structure, the plate being thermally coupled to a heat conduction source, and a chamber enclosing the supporting structure and the plate.

Abstract: Systems and structures for venting and flow conditioning operations in charged particle beam systems. In some embodiments, a system may include a chamber configured to provide a vacuum environment; a vent valve; and a mass flow controller coupled to the chamber on a first side of the mass flow controller and to the vent valve on a second side of the mass flow controller.