Patents by Inventor Jun-Liang Lai

Jun-Liang Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10295567
    Abstract: A probe module, which supports loopback test and is provided between a PCB and a DUT, includes an adapter, two probes, two inductive components provided at the adapter, and a capacitive component. The adapter has two connecting circuits. An end of each of the probes is connected to one of the connecting circuits, while another end thereof, which is a tip, contacts the DUT. Each of the inductive components has an end electrically connected to one of the connecting circuits, and another end electrically connected to the PCB through a conductive member, which is provided at the adapter, wherein two ends of the capacitive component are electrically connected to one of the connecting circuits, respectively. Whereby, the signal paths are changed by the differences between frequencies of signals, and the transmission path of high-frequency signals is effectively shortened.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: May 21, 2019
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Hao Wei, Jun-Liang Lai, Chih-Hao Ho
  • Patent number: 10070512
    Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with two first pads, two second pads, and two first sub-circuits. The first pads and the second pads are electrically connected to the first sub-circuits. The second substrate has a top surface, a bottom surface, a lateral edge, and two openings. The bottom surface of the second substrate is attached to the top surface of the first substrate. The openings extend from the top surface to the bottom surface of the second substrate. The first pads of the first substrate are in the opening of the second substrate; the second pads of the first substrate are not covered by the second substrate. The second substrate is further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: September 4, 2018
    Inventors: Wei-Cheng Ku, Jun-Liang Lai, Chih-Hao Ho
  • Patent number: 10067163
    Abstract: A probe card which is capable of transmitting high-frequency signals provided by a DUT, and the DUT includes an output pin group and an input pin group for sending and receiving the high-frequency signals respectively. The probe card includes a first signal pin group, a second signal pin group, and a band circuit. The first signal pin group is made of a conductive material, and is used to contact the output pin group; the second signal pin group is made of a conductive material too, and is used to contact the input pin group; the band circuit is electrically connected to the first signal pin group and the second signal pin group to allow signals within a first bandwidth and a second bandwidth to pass therethrough.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: September 4, 2018
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Jun-Liang Lai
  • Patent number: 9835651
    Abstract: A high-frequency cantilever type probe card includes a base board, a probe base provided on the base board, two probes, and a capacitor having opposite ends electrically connected to the probes respectively. The probe base is made of an insulating material, and the probes are made of a conductive material. Each of the probes has an arm and a tip, wherein the arm is connected to the probe base, and the tip is adapted to contact a pad of a DUT. When the DUT generates a testing signal with a high frequency, and the testing signal is transmitted to one of the probes, the capacitor, and the other one of the probes in sequence, and then transmitted back to the DUT.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: December 5, 2017
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Hao Wei, Jun-Liang Lai, Chih-Hao Ho
  • Publication number: 20170150592
    Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with two first pads, two second pads, and two first sub-circuits. The first pads and the second pads are electrically connected to the first sub-circuits. The second substrate has a top surface, a bottom surface, a lateral edge, and two openings. The bottom surface of the second substrate is attached to the top surface of the first substrate. The openings extend from the top surface to the bottom surface of the second substrate. The first pads of the first substrate are in the opening of the second substrate; the second pads of the first substrate are not covered by the second substrate. The second substrate is further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.
    Type: Application
    Filed: February 3, 2017
    Publication date: May 25, 2017
    Applicant: MPI corporation
    Inventors: WEI-CHENG KU, JUN-LIANG LAI, CHIH-HAO HO
  • Patent number: 9658249
    Abstract: A probe card which is capable of transmitting high-frequency signals provided by a DUT, and the DUT includes an output pin group and an input pin group for sending and receiving the high-frequency signals respectively. The probe card includes a first signal pin group, a second signal pin group, and a multiband circuit. The first signal pin group is made of a conductive material, and is used to contact the output pin group; the second signal pin group is made of a conductive material too, and is used to contact the input pin group; the multiband circuit is electrically connected to the first signal pin group and the second signal pin group to allow signals within a first bandwidth and a second bandwidth to pass therethrough.
    Type: Grant
    Filed: December 24, 2013
    Date of Patent: May 23, 2017
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Jun-Liang Lai
  • Patent number: 9622348
    Abstract: A multilayer circuit board includes a plurality of stacked substrates, a plurality of first conductive lands, and a plurality of second conductive lands. A surface at a side of each of the substrates has an exposed portion which is not covered by the neighboring substrate, wherein each of the first conductive lands is respectively provided on each of the exposed portions. Each of the second conductive lands is provided on the exposed portion of the outermost substrate, wherein each of the substrates has a conductor pattern to be electrically connected to one of the first conductive lands and to one of the second conductive lands.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: April 11, 2017
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Jun-Liang Lai, Chun-Chung Huang, Jing-Zhi Hung, Yung Nan Wu, Chih-Hao Ho
  • Patent number: 9596769
    Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with a first pad, a second pad, and a first sub-circuit. The first pad and the second pad are electrically connected to the first sub-circuit. The second substrate has a top surface, a bottom surface, and an opening. The bottom surface of the second substrate is attached to the top surface of the first substrate. The opening extends from the top surface to the bottom surface of the second substrate. The first pad of the first substrate is in the opening of the second substrate; the second pad of the first substrate is not covered by the second substrate. The second substrate further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: March 14, 2017
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Jun-Liang Lai, Chih-Hao Ho
  • Publication number: 20170059613
    Abstract: A probe card which is capable of transmitting high-frequency signals provided by a DUT, and the DUT includes an output pin group and an input pin group for sending and receiving the high-frequency signals respectively. The probe card includes a first signal pin group, a second signal pin group, and a band circuit. The first signal pin group is made of a conductive material, and is used to contact the output pin group; the second signal pin group is made of a conductive material too, and is used to contact the input pin group; the band circuit is electrically connected to the first signal pin group and the second signal pin group to allow signals within a first bandwidth and a second bandwidth to pass therethrough.
    Type: Application
    Filed: November 9, 2016
    Publication date: March 2, 2017
    Inventors: Wei-Cheng KU, Jun-Liang LAI
  • Patent number: 9545002
    Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate has a first pad, and a first circuit, wherein the first circuit is embedded in the first substrate, and the first pad is electrically connected to the first circuit. The second substrate has a first through hole, a second pad, and a second circuit, wherein the first through hole is opened at both sides of the second substrate, and the first pad of the first substrate is in the first through hole; the second circuit is embedded in the second substrate, and the second pad is electrically connected to the second circuit. The pads on each substrate are exposed by the through hole(s) of the above substrate(s) to shorten the null sections of the interconnectors and reduce the interference from the null sections.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: January 10, 2017
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Jun-Liang Lai, Chih-Hao Ho
  • Publication number: 20170003319
    Abstract: A probe module, which supports loopback test and is provided between a PCB and a DUT, includes an adapter, two probes, two inductive components provided at the adapter, and a capacitive component. The adapter has two connecting circuits. An end of each of the probes is connected to one of the connecting circuits, while another end thereof, which is a tip, contacts the DUT. Each of the inductive components has an end electrically connected to one of the connecting circuits, and another end electrically connected to the PCB through a conductive member, which is provided at the adapter, wherein two ends of the capacitive component are electrically connected to one of the connecting circuits, respectively. Whereby, the signal paths are changed by the differences between frequencies of signals, and the transmission path of high-frequency signals is effectively shortened.
    Type: Application
    Filed: June 3, 2016
    Publication date: January 5, 2017
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, HAO WEI, JUN-LIANG LAI, CHIH-HAO HO
  • Patent number: 9500675
    Abstract: A probe module, which supports loopback test and is provided between a PCB and a DUT, includes a substrate, a probe base, two probes, two signal path switchers, and a capacitor. The substrate has two first connecting circuits and two second connecting circuits, wherein an end of each first connecting circuit is connected to the PCB. The probe base is provided between the substrate and the DUT with the probes provided thereon, wherein an end of each probe is exposed and electrically connected to one second connecting circuit, while another end thereof is also exposed to contact the DUT. Each signal path switcher is provided on the probe base, and respectively electrically connected to another end of one first and one second connecting circuits. The capacitor is provided on the probe base with two ends electrically connected to the two signal path switchers.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: November 22, 2016
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Jun-Liang Lai, Wei Chen, Hsin Hsiang Liu, Kuang Chung Chou, Chan Hung Huang
  • Publication number: 20160305981
    Abstract: A probe card for transmitting power signals from a tester to two devices under test (DUTs) is provided, which includes two signal pins, two power conducting circuits, and at least a matching part. The signal pins are made of conductive materials, wherein one end of the signal pin contacts one of the DUTs. The two power conducting circuits are electrically connected to the two signal pins respectively to transmit the power signals to the DUTs. One of two ends of the power conducting circuits is connected to the signal pins; the other end of the power conducting circuits is electrically connected to the tester. The matching part is electrically connected to the power conducting circuit in parallel to lower a resistance of the power conducting circuit below a predetermined value, or to lower a percentage error of resistance of the power conducting circuit below a predetermined percentage error.
    Type: Application
    Filed: April 13, 2016
    Publication date: October 20, 2016
    Applicant: MPI Corporation
    Inventors: Wei-Cheng Ku, Jun-Liang Lai, Chih-Hao Ho, Hao Wei
  • Patent number: 9442134
    Abstract: A probe card, which is between a tester and a device under test (DUT), includes two first electrical lines, two second electrical lines, two inductive elements, and a capacitor. The first electrical lines are electrically connected to the probes respectively. The second electrical lines are electrically connected to the first electrical lines respectively. The inductive elements are electrically connected to the first electrical lines and the tester respectively; and the capacitor has opposite ends connected to the second electrical lines respectively.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: September 13, 2016
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Jun-Liang Lai, Chun-Chung Huang, Wei Chen, Hsin-Hsiang Liu, Kuang-Chung Chou
  • Publication number: 20160139179
    Abstract: A high-frequency cantilever type probe card includes a base board, a probe base provided on the base board, two probes, and a capacitor having opposite ends electrically connected to the probes respectively. The probe base is made of an insulating material, and the probes are made of a conductive material. Each of the probes has an arm and a tip, wherein the arm is connected to the probe base, and the tip is adapted to contact a pad of a DUT. When the DUT generates a testing signal with a high frequency, and the testing signal is transmitted to one of the probes, the capacitor, and the other one of the probes in sequence, and then transmitted back to the DUT.
    Type: Application
    Filed: February 11, 2015
    Publication date: May 19, 2016
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, HAO WEI, JUN-LIANG LAI, CHIH-HAO HO
  • Publication number: 20160143141
    Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate first substrate a first pad, and a first circuit, wherein the first circuit is embedded in the first substrate, and the first pad is electrically connected to the first circuit. The second substrate has a first through hole, a second pad, and a second circuit, wherein the first through hole is opened at both sides of the second substrate, and the first pad of the first substrate is in the first through hole; the second circuit is embedded in the second substrate, and the second pad is electrically connected to the second circuit. The pads on each substrate are exposed by the through hole(s) of the above substrate(s) to shorten the null sections of the interconnectors and reduce the interference from the null sections.
    Type: Application
    Filed: February 11, 2015
    Publication date: May 19, 2016
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, JUN-LIANG LAI, CHIH-HAO HO
  • Publication number: 20160128176
    Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with a first pad, a second pad, and a first sub-circuit. The first pad and the second pad are electrically connected to the first sub-circuit. The second substrate has a top surface, a bottom surface, and an opening. The bottom surface of the second substrate is attached to the top surface of the first substrate. The opening extends from the top surface to the bottom surface of the second substrate. The first pad of the first substrate is in the opening of the second substrate; the second pad of the first substrate is not covered by the second substrate. The second substrate further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.
    Type: Application
    Filed: February 11, 2015
    Publication date: May 5, 2016
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, JUN-LIANG LAI, CHIH-HAO HO
  • Patent number: 9316685
    Abstract: A probe card, which is used to transmit power signals and test signals from a tester to a DUT, includes a pin base, a plurality of signal pins, a signal conducting circuit and at least one power conducting circuit. The signal pins are made of conductive materials, and each contacts the DUT with an end thereof; the signal conducting circuit has a first resistance, and electrically connects the tester and the other end of one of the signal pin to transmit the test signals to the DUT; the power conducting circuit has a second resistance which is much less than the first resistance, and electrically connects the tester and the other end of one of the signal pin which is not connected with the signal conducting circuit to transmit the power signals to the DUT.
    Type: Grant
    Filed: November 11, 2013
    Date of Patent: April 19, 2016
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Jun-Liang Lai
  • Publication number: 20160018439
    Abstract: A probe card includes a connecting circuit board, a connector, and a probe. The connecting circuit board includes a substrate having a signal via and a plurality of ground vias, a signal feeding structure disposed on the substrate, and a connecting layer having the connector disposed thereon. The signal feeding structure includes a signal feeding pad and a ground pad, which is connected to the ground via, and has a matching compensation opening having a first side and a second side wider than the first side. The signal feeding pad does not contact the ground pad, and has a first end and a second end wider than the first end. The second end is connected to the signal via. The connecting layer has a signal connecting portion connected to the signal via, and a ground connecting portion connected to the ground vias. The probe is connected to the first end.
    Type: Application
    Filed: July 13, 2015
    Publication date: January 21, 2016
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, HAO WEI, JUN-LIANG LAI, CHIH-HAO HO
  • Publication number: 20160018441
    Abstract: A probe card includes a connecting circuit board, a connector, and a probe. The connecting circuit board includes a substrate having a signal via and a plurality of ground vias, a signal feeding structure disposed on the substrate, and a connecting layer having the connector disposed thereon. The signal feeding structure includes a signal feeding pad and a ground pad, which is connected to the ground via, and has a matching compensation opening having a first side and a second side wider than the first side. The signal feeding pad does not contact the ground pad, and has a first end and a second end wider than the first end. The second end is connected to the signal via. The connecting layer has a signal connecting portion connected to the signal via, and a ground connecting portion connected to the ground vias. The probe is connected to the first end.
    Type: Application
    Filed: July 13, 2015
    Publication date: January 21, 2016
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, HAO WEI, JUN-LIANG LAI, CHIH-HAO HO