Patents by Inventor JUN-LIANG SU
JUN-LIANG SU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11929260Abstract: Embodiments of methods and apparatus for reducing warpage of a substrate are provided herein. In some embodiments, a method for reducing warpage of a substrate includes: applying an epoxy mold over a plurality of dies on the substrate in a dispenser tool; placing the substrate on a pedestal in a curing chamber, wherein the substrate has an expected post-cure deflection in a first direction; inducing a curvature on the substrate in a direction opposite the first direction; and curing the substrate by heating the substrate in the curing chamber.Type: GrantFiled: August 24, 2021Date of Patent: March 12, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Fang Jie Lim, Chin Wei Tan, Jun-Liang Su, Felix Deng, Sai Kumar Kodumuri, Ananthkrishna Jupudi, Nuno Yen-Chu Chen
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Patent number: 11881436Abstract: Methods and apparatus for processing a substrate are provided. For example, metrology apparatus configured for use with a substrate processing platform comprise an interferometer configured to obtain a first set of measurements at a first set of points along a surface of a substrate, a sensor configured to obtain a second set of measurements at a second set of points different from the first set of points along the surface of the substrate, an actuator configured to position the interferometer and the sensor at various positions along a measurement plane parallel to the surface of the substrate for obtaining the first set of measurements and the second set of measurements, and a substrate support comprising a substrate support surface for supporting the substrate beneath the measurement plane while obtaining the first set of measurements and the second set of measurements.Type: GrantFiled: July 7, 2021Date of Patent: January 23, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Jun-Liang Su, Chin Wei Tan, Fang Jie Lim
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Patent number: 11871667Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a system for processing a substrate includes a process chamber comprising a first processing volume and a second processing volume, a carrier disposed in the first processing volume, comprising a first thermoelectric module (TEM), and configured to support the substrate while the substrate is being heated or cooled, a chuck disposed within the second processing volume, comprising a second TEM, and configured to receive the substrate from the carrier and to support the substrate while the substrate is being heated or cooled, and a system controller configured to monitor a temperature of at least one of the substrate, the carrier, or the chuck during operation, and based on the temperature of the at least one of the substrate, the carrier, or the chuck, supply current to at least one of the first TEM or the second TEM.Type: GrantFiled: September 17, 2020Date of Patent: January 9, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Sriskantharajah Thirunavukarasu, Puay Han Tan, Karrthik Parathithasan, Jun-Liang Su, Fang Jie Lim, Chin Wei Tan, Wei Jie Dickson Teo
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Publication number: 20230061379Abstract: Embodiments of methods and apparatus for reducing warpage of a substrate are provided herein. In some embodiments, a method for reducing warpage of a substrate includes: applying an epoxy mold over a plurality of dies on the substrate in a dispenser tool; placing the substrate on a pedestal in a curing chamber, wherein the substrate has an expected post-cure deflection in a first direction; inducing a curvature on the substrate in a direction opposite the first direction; and curing the substrate by heating the substrate in the curing chamber.Type: ApplicationFiled: August 24, 2021Publication date: March 2, 2023Inventors: Fang Jie LIM, Chin Wei TAN, Jun-Liang SU, Felix DENG, Sai Kumar KODUMURI, Ananthkrishna JUPUDI, Nuno Yen-Chu CHEN
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Publication number: 20230009864Abstract: Methods and apparatus for processing a substrate are provided. For example, metrology apparatus configured for use with a substrate processing platform comprise an interferometer configured to obtain a first set of measurements at a first set of points along a surface of a substrate, a sensor configured to obtain a second set of measurements at a second set of points different from the first set of points along the surface of the substrate, an actuator configured to position the interferometer and the sensor at various positions along a measurement plane parallel to the surface of the substrate for obtaining the first set of measurements and the second set of measurements, and a substrate support comprising a substrate support surface for supporting the substrate beneath the measurement plane while obtaining the first set of measurements and the second set of measurements.Type: ApplicationFiled: July 7, 2021Publication date: January 12, 2023Inventors: Jun-Liang SU, Chin Wei TAN, Fang Jie LIM
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Publication number: 20220085268Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a system for processing a substrate includes a process chamber comprising a first processing volume and a second processing volume, a carrier disposed in the first processing volume, comprising a first thermoelectric module (TEM), and configured to support the substrate while the substrate is being heated or cooled, a chuck disposed within the second processing volume, comprising a second TEM, and configured to receive the substrate from the carrier and to support the substrate while the substrate is being heated or cooled, and a system controller configured to monitor a temperature of at least one of the substrate, the carrier, or the chuck during operation, and based on the temperature of the at least one of the substrate, the carrier, or the chuck, supply current to at least one of the first TEM or the second TEM.Type: ApplicationFiled: September 17, 2020Publication date: March 17, 2022Inventors: Sriskantharajah THIRUNAVUKARASU, Puay Han TAN, Karrthik PARATHITHASAN, Jun-Liang SU, Fang Jie LIM, Chin Wei TAN, Wei Jie Dickson TEO
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Patent number: 11177146Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a system for processing a substrate includes a process chamber comprising a first processing volume and a second processing volume; a first heating device configured to heat a substrate to a first temperature; a carrier configured to support the substrate while the substrate is being heated using the first heating device to the first temperature and transfer the substrate to and from each of the first processing volume and the second processing volume; a second heating device configured to maintain the substrate at or near the first temperature; and a chuck configured to receive the substrate from the carrier, and comprising an outer zone and an inner zone having independent variable pressure control to apply a chucking force at the outer zone that is different from a chucking force provided at the inner zone.Type: GrantFiled: October 31, 2019Date of Patent: November 16, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Qi Jie Peng, Chin Wei Tan, Jun-Liang Su, Fang Jie Lim, Sriskantharajah Thirunavukarasu, Arvind Sundarrajan, Puay Han Tan
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Publication number: 20210134627Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a system for processing a substrate includes a process chamber comprising a first processing volume and a second processing volume; a first heating device configured to heat a substrate to a first temperature; a carrier configured to support the substrate while the substrate is being heated using the first heating device to the first temperature and transfer the substrate to and from each of the first processing volume and the second processing volume; a second heating device configured to maintain the substrate at or near the first temperature; and a chuck configured to receive the substrate from the carrier, and comprising an outer zone and an inner zone having independent variable pressure control to apply a chucking force at the outer zone that is different from a chucking force provided at the inner zone.Type: ApplicationFiled: October 31, 2019Publication date: May 6, 2021Inventors: Qi Jie Peng, Chin Wei Tan, Jun-Liang Su, Fang Jie Lim, Sriskantharajah Thirunavukarasu, Arvind Sundarrajan, Puay Han Tan
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Publication number: 20210057238Abstract: Embodiments of methods and apparatus for reducing warpage of a substrate are provided herein. In some embodiments, a method for reducing warpage of a substrate includes heating the substrate with an epoxy layer to at least a glass transition temperature of the epoxy layer while allowing the substrate to expand; subsequently constraining the substrate with a clamping force exerted towards the substrate from a top direction by applying a high pressure gas to the substrate and from a bottom direction by applying a vacuum pressure to the substrate; and rapidly cooling the substrate while the substrate is constrained.Type: ApplicationFiled: August 20, 2019Publication date: February 25, 2021Inventors: CHIN WEI TAN, QI JIE PENG, FANG JIE LIM, PRAYUDI LIANTO, SRISKANTHARAJAH THIRUNAVUKARASU, ARVIND SUNDARRAJAN, JUN-LIANG SU
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Publication number: 20210035795Abstract: Methods and apparatus for reducing warpage of a substrate. In some embodiments, a method of reducing substrate warpage comprises heating the substrate with an epoxy layer to at least a glass transition temperature of the epoxy layer while allowing the substrate to expand; maintaining the at least the glass transition temperature of the substrate until the substrate is constrained; constraining the substrate with a total clamping force of approximately 5000N to approximately 7000N exerted towards the substrate from a top direction and a bottom direction; applying at least one electrostatic field to the substrate with a first electrostatic chuck positioned above the substrate and a second electrostatic chuck positioned below the substrate; and rapidly cooling the substrate using a first liquid convection heat sink positioned above the substrate and a second liquid convection heat sink positioned below the substrate.Type: ApplicationFiled: July 23, 2020Publication date: February 4, 2021Inventors: Qi Jie PENG, Prayudi LIANTO, Chin Wei TAN, Sriskantharajah THIRUNAVUKARASU, Arvind SUNDARRAJAN, Jun-Liang SU, Fang Jie LIM, Manorajh ARUNAKIRI, Wei Jie Dickson TEO, Karrthik PARATHITHASAN, Puay Han TAN
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Patent number: 10446423Abstract: Systems, apparatuses and methods for determining a surface profile of a substrate are provided. In one embodiment, a method includes projecting a signal having a vertical component/profile across the surface of the substrate from a plurality of locations along a first side of the substrate, capturing the projected signals at each of a plurality of respective locations across the surface of the substrate and determining a surface profile for the substrate using the captured signals. The process can be automated using a controller having predetermined projection and capture positions along respective sides of the substrate, where a surface profile of the substrate can be automatically determined by the controller using the captured signals.Type: GrantFiled: June 15, 2017Date of Patent: October 15, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Jun-Liang Su, Karthik Elumalai, Eng Sheng Peh, Sriskantharajah Thirunavukarasu, Dimantha Rajapaksa
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Patent number: 10325790Abstract: Embodiments of methods and apparatus for correcting substrate deformity are provided herein. In some embodiments, a substrate support includes a base having an interior volume formed by walls extending upward from the base; a plurality of infrared lamps disposed within the interior volume; a support plate disposed above the plurality of infrared lamps, wherein the support plate includes a support surface to support a substrate; and a cover plate disposed atop the support plate and having a central opening corresponding to the support surface and an exhaust portion at a periphery of a top surface of the cover plate, wherein the exhaust portion includes a plurality of perforations fluidly coupling a space above the cover plate with an exhaust conduit formed in the cover plate. Embodiments of a showerhead assembly and processing equipment incorporating the inventive substrate support and showerhead assembly are additionally provided herein.Type: GrantFiled: November 13, 2017Date of Patent: June 18, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Eng Sheng Peh, Sriskantharajah Thirunavukarasu, Jun-Liang Su, Shoju Vayyapron, Karthik Elumalai, Dimantha Rajapaksa, Arunkumar M Tatti
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Publication number: 20180218928Abstract: Embodiments of methods and apparatus for correcting substrate deformity are provided herein. In some embodiments, a substrate support includes a base having an interior volume formed by walls extending upward from the base; a plurality of infrared lamps disposed within the interior volume; a support plate disposed above the plurality of infrared lamps, wherein the support plate includes a support surface to support a substrate; and a cover plate disposed atop the support plate and having a central opening corresponding to the support surface and an exhaust portion at a periphery of a top surface of the cover plate, wherein the exhaust portion includes a plurality of perforations fluidly coupling a space above the cover plate with an exhaust conduit formed in the cover plate. Embodiments of a showerhead assembly and processing equipment incorporating the inventive substrate support and showerhead assembly are additionally provided herein.Type: ApplicationFiled: November 13, 2017Publication date: August 2, 2018Inventors: Eng Sheng PEH, Sriskantharajah THIRUNAVUKARASU, Jun-Liang SU, Shoju VAYYAPRON, Karthik ELUMALAI, Dimantha RAJAPAKSA, Arunkumar M Tatti
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Publication number: 20180144960Abstract: Systems, apparatuses and methods for determining a surface profile of a substrate are provided. In one embodiment, a method includes projecting a signal having a vertical component/profile across the surface of the substrate from a plurality of locations along a first side of the substrate, capturing the projected signals at each of a plurality of respective locations across the surface of the substrate and determining a surface profile for the substrate using the captured signals. The process can be automated using a controller having predetermined projection and capture positions along respective sides of the substrate, where a surface profile of the substrate can be automatically determined by the controller using the captured signals.Type: ApplicationFiled: June 15, 2017Publication date: May 24, 2018Inventors: JUN-LIANG SU, KARTHIK ELUMALAI, ENG SHENG PEH, Sriskantharajah THIRUNAVUKARASU, DIMANTHA RAJAPAKSA
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Patent number: 9818624Abstract: Embodiments of methods and apparatus for correcting substrate deformity are provided herein. In some embodiments, a substrate flattening system includes: a first process chamber having a first substrate support and a first showerhead, wherein the first substrate support does not include a chucking mechanism; a first heater disposed in the first substrate support to heat a substrate placed on a first support surface of the first substrate support; a second heater configured to heat a process gas flowing through the first showerhead into a first processing volume of the first process chamber; and a second process chamber having a second substrate support, wherein the second substrate support is not heated, and wherein the first process chamber and the cooling chamber are both non-vacuum chambers.Type: GrantFiled: April 29, 2016Date of Patent: November 14, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Jen Sern Lew, Tuck Foong Koh, Sriskantharajah Thirunavukarasu, Karthik Elumalai, Eng Sheng Peh, Jun-Liang Su
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Publication number: 20160322234Abstract: Embodiments of methods and apparatus for correcting substrate deformity are provided herein. In some embodiments, a substrate flattening system includes: a first process chamber having a first substrate support and a first showerhead, wherein the first substrate support does not include a chucking mechanism; a first heater disposed in the first substrate support to heat a substrate placed on a first support surface of the first substrate support; a second heater configured to heat a process gas flowing through the first showerhead into a first processing volume of the first process chamber; and a second process chamber having a second substrate support, wherein the second substrate support is not heated, and wherein the first process chamber and the cooling chamber are both non-vacuum chambers.Type: ApplicationFiled: April 29, 2016Publication date: November 3, 2016Inventors: Jen Sern LEW, Tuck Foong KOH, Sriskantharajah THIRUNAVUKARASU, Karthik ELUMALAI, ENG SHENG PEH, JUN-LIANG SU