Patents by Inventor Jun Lu

Jun Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10442168
    Abstract: An interlayer comprised of a thermoplastic resin, at least one high refractive index plasticizer and, optionally, a conventional plasticizer. The use of a thermoplastic resin, a high refractive index plasticizer, and, optionally, a conventional plasticizer reduces or minimizes the optical defects caused by different refractive indices without sacrificing other characteristics of the interlayer.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: October 15, 2019
    Assignee: Solutia Inc.
    Inventors: Jun Lu, Wenjie Chen
  • Patent number: 10446372
    Abstract: An ion source having dual indirectly heated cathodes is disclosed. Each of the cathodes may be independently biased relative to its respective filament so as to vary the profile of the beam current that is extracted from the ion source. In certain embodiments, the ion source is used in conjunction with an ion implanter. The ion implanter comprises a beam profiler to measure the current of the ribbon ion beam as a function of beam position. A controller uses this information to independently control the bias voltages of the two indirectly heated cathodes so as to vary the uniformity of the ribbon ion beam. In certain embodiments, the current passing through each filament may also be independently controlled by the controller.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: October 15, 2019
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Bon-Woong Koo, Jun Lu, Frank Sinclair, Eric D. Hermanson, Joseph E. Pierro, Michael D. Johnson, Michael S. DeLucia, Antonella Cucchetti
  • Patent number: 10428167
    Abstract: Resin compositions, layers, and interlayers comprising an acetoacetylized poly(vinyl acetal) resin are provided. Such compositions, layers, and interlayers can exhibit enhanced or optimized properties as compared to non-acetoacetylized poly(vinyl acetal) resins. The acetoacetylized poly(vinyl acetal) resins may be used in a layer or an interlayer for in an architectural application, or the acetoacetylized poly(vinyl acetal) resins may be used in a layer or interlayer, or combined with other layers, to provide an interlayer having good acoustic and other properties.
    Type: Grant
    Filed: April 3, 2016
    Date of Patent: October 1, 2019
    Assignee: Solutia Inc.
    Inventors: Bruce Edward Wade, Witold Szydlowski, Helen Mackin Thompson, Jun Lu, John Joseph D'Errico, Garry Kenneth Weakley, Howard Smith Carman, Jr., Steven V Haldeman, Guangxin Tang
  • Patent number: 10430802
    Abstract: Role based assessment for an IT management system, includes maintaining a plurality of roles, each role attributable to a user type within an IT management system. Mappings are defined between the plurality of user roles and assets of the IT management system. An assessment for the IT management system is then assembled from the perspective of a selected one of the plurality of roles based on mappings between the selected user role and the assets.
    Type: Grant
    Filed: September 3, 2014
    Date of Patent: October 1, 2019
    Assignee: ENTIT SOFTWARE LLC
    Inventors: Jin Wang, Jun Lu, Lingyan Meng, Bing Gu, Keke Qi
  • Patent number: 10428212
    Abstract: Resin compositions, layers, and interlayers comprising two or more thermoplastic polymers and at least one RI balancing agent for adjusting the refractive index of at least one of the resins or layers is provided. Such compositions, layers, and interlayers exhibit enhanced optical properties while retaining other properties, such as impact resistance and acoustic performance.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: October 1, 2019
    Assignee: Solutia Inc.
    Inventors: Jun Lu, Wenjie Chen, Helen M Thompson
  • Publication number: 20190283367
    Abstract: Multiple layer panels including a pair of substrates and an interlayer disposed therebetween are provided. In some cases, the multiple layer panels may utilize substrates having different thicknesses, and such configurations may help reduce glass thickness and overall panel weight. However, panels of the present invention may still exhibit sufficient strength, rigidity, and acoustic performance and can be suitable for use in a wide range of automotive, aeronautical, and/or architectural applications.
    Type: Application
    Filed: May 24, 2019
    Publication date: September 19, 2019
    Applicant: SOLUTIA INC.
    Inventor: JUN LU
  • Publication number: 20190267172
    Abstract: Tapes and coils for superconducting magnets are provided, along with methods of making the tapes and coils. In one embodiment, the coil includes a rare earth barium copper oxide (REBCO) superconducting tape; and a thin resistive layer of copper oxide, Cr, Ni, or Ni—P substantially coated onto the REBCO superconducting tape, wherein the coated REBCO superconducting tape is wound into a coil form. In another embodiment, the coil includes at least two REBCO superconducting tapes; and a stainless steel tape interlay disposed between the at least two REBCO superconducting tapes, wherein the stainless steel tape comprises a plating layer of nickel or copper, and wherein the at least two REBCO superconducting tapes together with the stainless steel tape interlay are wound into a coil form.
    Type: Application
    Filed: February 22, 2019
    Publication date: August 29, 2019
    Inventors: Jun Lu, Jeremy Levitan
  • Patent number: 10396019
    Abstract: An intelligent power module (IPM) has a first, second, third and fourth die paddles, a first, second, third, fourth, fifth and sixth metal-oxide-semiconductor field-effect transistors (MOSFETs), a tie bar, a metal slug, a plurality of spacers, a plurality of leads and a molding encapsulation. The molding encapsulation encloses the first, second, third and fourth die paddles, the first, second, third, fourth, fifth and sixth MOSFETs, the tie bar and the plurality of spacers. A bottom surface of the metal slug is exposed from the molding encapsulation. A process for fabricating the IPM comprises preparing the first, second, third and fourth die paddles, the first, second, third, fourth, fifth and sixth MOSFETs, the tie bar, the plurality of leads, the metal slug and the plurality of spacers and applying a molding process to form the molding encapsulation.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: August 27, 2019
    Assignee: ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD.
    Inventors: Zhiqiang Niu, Bum-Seok Suh, Wonjin Cho, Jun Lu
  • Patent number: 10377891
    Abstract: Resin compositions, layers, and interlayers comprising two or more poly(vinyl acetal) resins and at least one blending agent or haze reducing agent are provided. Such compositions, layers, and interlayers exhibit enhanced optical properties while retaining other properties, such as impact resistance and acoustic performance.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: August 13, 2019
    Assignee: Solutia Inc.
    Inventors: Wenjie Chen, John Joseph D'Errico, Jun Lu
  • Patent number: 10372867
    Abstract: Techniques for analyzing a routed interconnection of a net of a circuit are discussed herein. Some embodiments may include a method comprising with a computer, analyzing the circuit to determine a performance parameter of the net, wherein the circuit is analyzed based at least in part on applying pre-layout simulation data of the net to layout data of the circuit. Additionally or alternatively, the circuit may be analyzed based on extracting characteristics of the routed interconnection from the layout data of the net.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: August 6, 2019
    Assignee: SYNOPSYS, INC.
    Inventors: Jun Wang, Randy Bishop, Jingyu Xu, Dick Liu, Hu Cai, Jun Lu
  • Patent number: 10372761
    Abstract: In an example, one or more processes that transform data originating in one or more of a plurality of different data sources are identified. Then, for each of the identified one or more processes, a relationship table is created, the relationship table listing objects input to the process, objects output from the process, and one or more mappings defining transformations performed on the objects input to the process to produce the objects output from the process. Dependencies are created between relationship tables by linking at least an instance of a first object input to a process in a first relationship table with at least an instance of the first object output from a process in a second relationship table. Lineage of an object in the computer system is traced by accessing one or more of the relationship tables and the dependencies.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: August 6, 2019
    Assignee: SAP SE
    Inventors: Min He, Nikhil Patil, Jun Lu
  • Publication number: 20190232624
    Abstract: Multilayered interlayers comprising stiff skin or outer layers and a soft core layer(s) are disclosed. The multilayered interlayers comprise: a first polymer layer (skin layer) comprising plasticized poly(vinyl butyral) resin; a second polymer layer (core layer) comprising a blend of two (or more) plasticized poly(vinyl butyral) resins having different residual hydroxyl content; and optionally a third polymer layer (skin layer) comprising plasticized poly(vinyl butyral) resin.
    Type: Application
    Filed: March 25, 2019
    Publication date: August 1, 2019
    Applicant: Solutia Inc.
    Inventor: Jun Lu
  • Publication number: 20190232626
    Abstract: Multiple layer interlayers comprising pairs of alternating polymer layers are provided, along with methods of making and using the same. Multiple layer interlayers according to embodiments of the present invention may include more than three polymer layers and may exhibit desirable acoustic and optical properties, which may make them suitable for use in various types of multiple layer panels, including safety glass for automotive and architectural applications.
    Type: Application
    Filed: April 8, 2019
    Publication date: August 1, 2019
    Applicant: Solutia Inc.
    Inventor: Jun Lu
  • Patent number: 10365010
    Abstract: A dehumidifier has a water receiving tray receiving condensed water of the dehumidifier. The water receiving tray comprises a water tank outlet, a main water outlet arranged outside the casing of the dehumidifier as a whole, the main water outlet being arranged opposite the water tank outlet; a pump used for draining is provided on the bottom of the outside of the water receiving tray, the pump being directly connected with the water receiving tray, eliminating the need of providing a pipe to connect with the dehumidifier pump, therefore reducing the risk of leaking. By connecting the pump with the water receiving tray directly, the pressure loss due to the connection of pipe is eliminated; the drainage capacity of the pump is utilized fully. Without installing or detaching additional pipes during installment or maintenance, operation is easier.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: July 30, 2019
    Assignee: Jiangsu Yoau Electric Co., Ltd.
    Inventors: Chengcai Hou, Jun Lu
  • Publication number: 20190217578
    Abstract: A polymer interlayer comprising a layer comprising a poly(vinyl acetal) resin having a residual hydroxyl content and a residual acetate content, and a plasticizer, wherein the residual hydroxyl content, the residual acetate content and the plasticizer are selected such that the polymer interlayer has at least one glass transition temperature less than about 20° C. and a peak tan delta of greater than 1.33, and a glass panel having a configuration of 2.3-mm glass//interlayer//2.3-mm glass and at 20° C. has a transmission loss, TLw, of greater than 42 decibels as measured by weighted average sound transmission loss at 2000 to 8000 Hz, and a transmission loss, TLc, of greater than 38 decibels at the coincident frequency is disclosed.
    Type: Application
    Filed: March 20, 2019
    Publication date: July 18, 2019
    Applicant: Solutia Inc.
    Inventors: Jun Lu, Wenjie Chen
  • Patent number: 10354636
    Abstract: A polymer interlayer comprising a layer comprising a poly(vinyl acetal) resin having a residual hydroxyl content and a residual acetate content, and a plasticizer, wherein the residual hydroxyl content, the residual acetate content and the plasticizer are selected such that the polymer interlayer has at least one glass transition temperature less than about 20° C. and a peak tan delta of greater than 1.29, and a glass panel having a configuration of 2.3-mm glass//interlayer//2.3-mm glass and at 20° C. has a transmission loss, TLw, of greater than 41 decibels as measured by weighted average sound transmission loss at 2000 to 8000 Hz, and a transmission loss, TLc, of greater than 38 decibels at the coincident frequency is disclosed.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: July 16, 2019
    Assignee: Solutia Inc.
    Inventor: Jun Lu
  • Patent number: 10343379
    Abstract: Multiple layer panels including a pair of substrates and an interlayer disposed therebetween are provided. In some cases, the multiple layer panels may utilize substrates having different thicknesses, and such configurations may help reduce glass thickness and overall panel weight. However, panels of the present invention may still exhibit sufficient strength, rigidity, and acoustic performance and can be suitable for use in a wide range of automotive, aeronautical, and/or architectural applications.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: July 9, 2019
    Assignee: Solutia Inc.
    Inventor: Jun Lu
  • Publication number: 20190202179
    Abstract: Resin compositions, layers, and interlayers comprising two or more thermoplastic polymers and at least one RI balancing agent for adjusting the refractive index of at least one of the resins or layers is provided. Such compositions, layers, and interlayers exhibit enhanced optical properties while retaining other properties, such as impact resistance and acoustic performance.
    Type: Application
    Filed: March 5, 2019
    Publication date: July 4, 2019
    Applicant: Solutia Inc.
    Inventors: Jun Lu, Wenjie Chen, Curtis Schilling, III, John Joseph D'Errico, Weihong Cui
  • Publication number: 20190189569
    Abstract: A semiconductor wafer is singulated to form a plurality of semiconductor packages. The semiconductor wafer has a semiconductor substrate, a metal layer, an adhesive layer, a rigid supporting layer, a passivation layer and a plurality of contact pads. A semiconductor package has a semiconductor substrate, a metal layer, an adhesive layer, a rigid supporting layer, a passivation layer and a plurality of contact pads. A thickness of the rigid supporting layer is larger than a thickness of the semiconductor substrate. A thickness of the metal layer is thinner than the thickness of the semiconductor substrate. An entirety of the rigid supporting layer may be made of a single crystal silicon material or a poly-crystal silicon material. The single crystal silicon material or the poly-crystal silicon material may be fabricated from a reclaimed silicon wafer. An advantage of using a reclaimed silicon wafer is for a cost reduction.
    Type: Application
    Filed: December 20, 2017
    Publication date: June 20, 2019
    Applicant: Alpha and Omega Semiconductor (Cayman) Ltd.
    Inventors: Long-Ching Wang, Zhen Du, Bo Chen, Jun Lu, Yueh-Se Ho
  • Patent number: 10286638
    Abstract: Multiple layer interlayers comprising pairs of alternating polymer layers are provided, along with methods of making and using the same. Multiple layer interlayers according to embodiments of the present invention may include more than three polymer layers and may exhibit desirable acoustic and optical properties, which may make them suitable for use in various types of multiple layer panels, including safety glass for automotive and architectural applications.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: May 14, 2019
    Assignee: Solutia Inc.
    Inventor: Jun Lu