Abstract: Resin compositions, layers, and interlayers comprising two or more thermoplastic polymers and at least one RI balancing agent for adjusting the refractive index of at least one of the resins or layers is provided. Such compositions, layers, and interlayers exhibit enhanced optical properties while retaining other properties, such as impact resistance and acoustic performance.

Abstract: Techniques for analyzing a routed interconnection of a net of a circuit are discussed herein. Some embodiments may include a method comprising with a computer, analyzing the circuit to determine a performance parameter of the net, wherein the circuit is analyzed based at least in part on applying pre-layout simulation data of the net to layout data of the circuit. Additionally or alternatively, the circuit may be analyzed based on extracting characteristics of the routed interconnection from the layout data of the net.

Abstract: Resin compositions, layers, and interlayers comprising two or more thermoplastic polymers and at least one RI balancing agent for adjusting the refractive index of at least one of the resins or layers is provided. Such compositions, layers, and interlayers exhibit enhanced optical properties while retaining other properties, such as impact resistance and acoustic performance.

Abstract: A polymer interlayer having improved sound insulation is disclosed. The polymer interlayer comprises at least one soft layer wherein the soft layer comprises a blend of a first poly(vinyl butyral) resin, a second poly(vinyl butyral) resin and a plasticizer; at least one stiffer layer comprising a third poly(vinyl butyral resin) and a plasticizer, wherein the polymer interlayer has a damping loss factor (?) (as measured by Mechanical Impedance Measurement according to ISO 16940) of at least about 0.16 measured at two or more different temperatures selected from 10° C., 20° C. and 30° C.

Abstract: The present invention discloses small-size battery protection packages and provides a process of fabricating small-size battery protection packages. A battery protection package includes a first common-drain metal oxide semiconductor field effect transistor (MOSFET), a second common-drain MOSFET, a power control integrated circuit (IC), a plurality of solder balls, a plurality of conductive bumps, and a packaging layer. The power control IC is vertically stacked on top of the first and second common-drain MOSFETs. At least a majority portion of the power control IC and at least majority portions of the plurality of solder balls are embedded into the packaging layer.

Abstract: The present invention discloses small-size battery protection packages and provides a process of fabricating small-size battery protection packages. A battery protection package includes a first common-drain metal oxide semiconductor field effect transistor (MOSFET), a second common-drain MOSFET, a power control integrated circuit (IC), a plurality of solder balls, a plurality of conductive bumps, and a packaging layer. The power control IC is vertically stacked on top of the first and second common-drain MOSFETs. At least a majority portion of the power control IC and at least majority portions of the plurality of solder balls are embedded into the packaging layer.

Abstract: Systems and methods integrate disparate backup devices with a unified interface. In certain examples, a management console manages data from various backup devices, while retaining such data in its native format. The management console can display a hierarchical view of the client devices and/or their data and can further provide utilities for processing the various data formats. A data structure including fields for storing both metadata common to the client device data and value-added metadata can be used to mine or process the data of the disparate client devices. The unified single platform and interface reduces the need for multiple data management products and/or customized data utilities for each individual client device and provides a single pane of glass view into data management operations. Integrating the various types of storage formats and media allows a user to retain existing storage infrastructures and further facilitates scaling to meet long-term management needs.

Abstract: A composition includes LiO2, reduced graphene oxide, and a metal catalyst or residue thereof.

Abstract: A method for controlling an air mouse is disclosed. The method includes receiving a control mode of an air mouse sent by a set top box; acquiring angular velocities and moving time of the air mouse at various directions; determining speeds of the air mouse at various directions according to the control mode and the angular velocities of the air mouse at various directions; and calculating displacements of the air mouse at various directions according to the moving time and the speeds of the air mouse at various directions, and sending the displacements of the air mouse at various directions to the set top box, so as to control movement of a screen cursor.

Abstract: A method of optimizing 4D cone beam computed tomography (4DCBCT) imaging is provided that includes using a scanner to generate projections of a target, where the projections are used to form a cone beam computed tomography (CBCT) scan of the target, where the CBCT includes a 3D image of the target, and using an appropriately programmed computer to control rotation speed of a gantry and projection acquisition of the CBCT in real-time according to a measured patient respiratory signal, where the real-time acquisition of the 4CBCT forms an optimized 4DCBCT image set.

Abstract: The present invention provides a corn active peptide additive for cell culture medium, wherein in the corn active peptide additive, oligopeptides with molecular weight of lower than 1000 Dalton account for equal to or more than 90 wt % of total proteins, and the oligopeptides at least comprise one or more of AP, SAP, PAL, VNAP, PSSQ, and TQPGPQ. The corn active peptide additive of the present invention can be compounded with various basic culture mediums for serum-free culture of various animal cells, which not only substantially lowers the cost for cell culturing and reduces pollution and other problems caused by an animal derived component, but also can promote cell proliferation, improve cell viability and enhance expression of cell products.

Abstract: A device, method and system of displaying a file on a mobile communication device may comprise duplicating at least a leftmost part of a file to obtain a duplicated leftmost part of the file, and displaying a frame through moving a display window along the frame, the frame comprising a rightmost part of the file and the duplicated leftmost part of the file, wherein the duplicated leftmost part of the file is placed on right of the rightmost part of the file. In some embodiments, the mobile communication device may control the display window to automatically move to a leftmost side of the frame, if the display window moves to a rightmost side of the frame, and further in response to a user instruction of continuing viewing the file.

Abstract: A power semiconductor package device and a method of preparation the device are disclosed. The package device includes a die paddle, a first pin, a second pin, and a semiconductor chip attached to the die paddle. A first electrode, a second electrode and a third electrode of the semiconductor chip are connected to the first pin, the second pin and the die paddle respectively. A plastic package body covers the semiconductor chip, the die paddle, the first pin and the second pin. The first pin and the second pin are located near two adjacent corners of the plastic package body. The bottom surface and two side surfaces of each of the first pin and the second pin are exposed from the plastic package body. Locking mechanisms are constructed to prevent the first pin and the second pin from falling off the power semiconductor package device during a manufacturing cutting process. Portions of the first pin, portions of the second pin, and portions of the plastic package body can be cut off.

Abstract: A method of manufacturing a semiconductor package having a small gate clip is disclosed. A first and second semiconductor chips, each of which includes a source electrode and a gate electrode at a top surface, are attached on two adjacent lead frame units of a lead frame such that the lead frame unit with the first chip formed thereon is rotated 180 degrees in relation to the other lead frame unit with the second semiconductor chip formed thereon. A first and second clip sets are mounted on the first and second semiconductor chips, wherein the first clip set is connected to the gate electrode of the first chip, the source electrode of the second chip, and their corresponding leads and the second clip set is connected to the gate electrode of the second chip, the source electrode of the first chip and their corresponding leads.

Abstract: An effuser for a plumbing apparatus including a stepper motor, a transmission mechanism connected with an output end of the stepper motor, an effuser connected with the transmission mechanism and configured to spray water from an internal water pipe using a nozzle, wherein the transmission mechanism extends and retracts the effuser by rotating the effuser about an axis transverse to the plumbing apparatus when driven by the stepper motor.

Abstract: Resin compositions, layers, and interlayers comprising two or more thermoplastic polymers and at least one RI balancing agent for adjusting the refractive index of at least one of the resins or layers is provided. Such compositions, layers, and interlayers exhibit enhanced optical properties while retaining other properties, such as impact resistance and acoustic performance.

Abstract: Tripyolide-nucleic acid aptamer derivatives, a preparation method and use thereof are shown. The structure of the triptolide-nucleic acid aptamer derivatives is as shown by formula I, wherein the definitions of R1-R7, G, A, B, M, Z and X are described. The present invention uses a nucleic acid aptamer and triptolide or modified compounds thereof as the starting materials, and introduces a linking group A at the C-14 hydroxyl group, epoxy groups and five-membered ring lactones in triptolide, then connects it to a nucleic acid aptamer B, and obtains the triptolide-nucleic acid aptamer derivatives. The triptolide-nucleic acid aptamer derivatives of the present invention have the characteristics of good targeting, a high anti-cancer activity, low toxicity and side effects, good water solubility and high bioavailability, and the preparation method of the present invention is scientific and reasonable and has a controllable quality and good repeatability, and is thereby suitable for production.

Abstract: A polymer interlayer having improved sound insulation is disclosed. The polymer interlayer comprises at least one soft layer wherein the soft layer comprises a blend of a first poly(vinyl butyral) resin, a second poly(vinyl butyral) resin and a plasticizer; at least one stiffer layer comprising a third poly(vinyl butyral resin) and a plasticizer, wherein the polymer interlayer has a damping loss factor (?) (as measured by Mechanical Impedance Measurement according to ISO 16940) of at least about 0.16 measured at two or more different temperatures selected from 10° C., 20° C. and 30° C.

Abstract: Resin compositions, layers, and interlayers comprising two or more thermoplastic polymers and at least one RI balancing agent for adjusting the refractive index of at least one of the resins or layers is provided. Such compositions, layers, and interlayers exhibit enhanced optical properties while retaining other properties, such as impact resistance and acoustic performance.

Abstract: A wafer process for molded chip scale package (MCSP) comprises: depositing metal bumps on bonding pads of chips on a wafer; forming a first packaging layer at a front surface of the wafer to cover the metal bumps; forming an un-covered ring at an edge of the wafer to expose two ends of each scribe line of a plurality of scribe lines; thinning the first packaging layer to expose metal bumps; forming cutting grooves; grinding a back surface of the wafer to form a recessed space and a support ring at the edge of the wafer; depositing a metal seed layer at a bottom surface of the wafer in the recessed space; cutting off an edge portion of the wafer; flipping and mounting the wafer on a substrate; depositing a metal layer covering the metal seed layer; removing the substrate from the wafer; and separating individual chips from the wafer by cutting through the first packaging layer, the wafer, the metal seed layers and the metal layers along the scribe lines.