Abstract: A method and device for optimal power flow calculation in power systems based on generalized Nash equilibrium are disclosed.

Abstract: Provided in the present application is a chimeric antigen receptor, including a GPC3 antigen binding domain, an ICDI, ICD2 or ICD3 intracellular signal stimulation domain with amino acid sequences of SEQ ID NOs: 29, 31 and 33, respectively, and an IL-15-IL-15? fusion protein with an amino acid sequence of SEQ ID NO: 7. After the chimeric antigen receptor is transferred into immune cells, especially iNKT cells, the cell proliferation rate, survival time and tumor killing effect can be effectively improved. Further provided in the present application are a corresponding expression vector, a transduction system, a pharmaceutical use, independent ICDI, ICD2 and ICD3 intracellular signal stimulation domains, and an IL-15-IL-15? fusion protein.

Abstract: A monitoring system based on a digital converter station includes a first monitoring terminal deployed at a first-level monitoring side, a second monitoring terminal deployed at a second-level monitoring side, and a third monitoring terminal deployed at a third-level monitoring side; the monitoring terminal at each level includes a communication module, a human-machine interaction module, a device status monitoring module, a device alarm management module, a video fusion processing module, and a data transmission adjustment and control module.

Abstract: A method and device for optimal power flow calculation in power systems based on generalized Nash equilibrium are disclosed.

Abstract: A monitoring system based on a digital converter station includes a first monitoring terminal deployed at a first-level monitoring side, a second monitoring terminal deployed at a second-level monitoring side, and a third monitoring terminal deployed at a third-level monitoring side; the monitoring terminal at each level includes a communication module, a human-machine interaction module, a device status monitoring module, a device alarm management module, a video fusion processing module, and a data transmission adjustment and control module.

Abstract: The disclosure discloses a solder strip applied to a shingled solar cell module, including a flat portion, and an upper cell slice connecting portion and a lower cell slice connecting portion located at two sides of the flat portion; a plurality of fine grid lines are arranged in parallel on front/back surfaces of lower/upper cell slices; cutting directions of the lower cell slice and the upper cell slice are parallel to the fine grid lines; the solder strip is arranged perpendicular to the fine grid lines or parallel to busbars; and the upper cell slice partially overlaps with the lower cell slice, the flat portion is soldered to the fine grid lines/busbars on the front surface of the lower cell slice and the fine grid lines/busbars on the back surface of the upper cell slice to form an overlapped region, the upper cell slice connecting portion is soldered to the fine grid lines/busbars on the back surface of the upper cell slice, and the lower cell slice connecting portion is soldered to the fine grid lines

Abstract: The disclosure discloses a solder strip applied to a shingled solar cell module, including a flat portion, and an upper cell slice connecting portion and a lower cell slice connecting portion located at two sides of the flat portion; a plurality of fine grid lines are arranged in parallel on front/back surfaces of lower/upper cell slices; cutting directions of the lower cell slice and the upper cell slice are parallel to the fine grid lines; the solder strip is arranged perpendicular to the fine grid lines or parallel to busbars; and the upper cell slice partially overlaps with the lower cell slice, the flat portion is soldered to the fine grid lines/busbars on the front surface of the lower cell slice and the fine grid lines/busbars on the back surface of the upper cell slice to form an overlapped region, the upper cell slice connecting portion is soldered to the fine grid lines/busbars on the back surface of the upper cell slice, and the lower cell slice connecting portion is soldered to the fine grid lines

Abstract: The disclosure discloses a solder strip applied to a shingled solar cell module, including a flat portion, and an upper cell slice connecting portion and a lower cell slice connecting portion located at two sides of the flat portion; a plurality of fine grid lines are arranged in parallel on front/back surfaces of lower/upper cell slices; cutting directions of the lower cell slice and the upper cell slice are parallel to the fine grid lines; the solder strip is arranged perpendicular to the fine grid lines or parallel to busbars; and the upper cell slice partially overlaps with the lower cell slice, the flat portion is soldered to the fine grid lines/busbars on the front surface of the lower cell slice and the fine grid lines/busbars on the back surface of the upper cell slice to form an overlapped region, the upper cell slice connecting portion is soldered to the fine grid lines/busbars on the back surface of the upper cell slice, and the lower cell slice connecting portion is soldered to the fine grid lines

Abstract: The disclosure discloses a solder strip applied to a shingled solar cell module, including a flat portion, and an upper cell slice connecting portion and a lower cell slice connecting portion located at two sides of the flat portion; a plurality of fine grid lines are arranged in parallel on front/back surfaces of lower/upper cell slices; cutting directions of the lower cell slice and the upper cell slice are parallel to the fine grid lines; the solder strip is arranged perpendicular to the fine grid lines or parallel to busbars; and the upper cell slice partially overlaps with the lower cell slice, the flat portion is soldered to the fine grid lines/busbars on the front surface of the lower cell slice and the fine grid lines/busbars on the back surface of the upper cell slice to form an overlapped region, the upper cell slice connecting portion is soldered to the fine grid lines/busbars on the back surface of the upper cell slice, and the lower cell slice connecting portion is soldered to the fine grid lines