Patents by Inventor Jun Matsueda
Jun Matsueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11961059Abstract: The present disclosure promotes distribution of sensor data among a plurality of business operators. A controller that an information processing system according to the present disclosure includes collects first data including a plurality of items and personal information from mobile bodies belonging to a first business operator. The controller converts the first data to second data not being usable to identify individuals. The controller provides data in a range decided based on content of a predetermined data use contract, among the second data, to a second business operator. The controller calculates a consideration for the data that is to be paid by the second business operator, based on a data use record of the second business operator.Type: GrantFiled: August 24, 2021Date of Patent: April 16, 2024Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Nobuaki Matsueda, Takashi Sueki, Jun Okamoto, Takumi Wada, Ryo Midorikawa, Junichi Nonaka, Wataru Shiraishi, Yasuhisa Fujiwara, Hiroshi Ishikawa, Shigeru Ichikawa, Hidetaka Eguchi, Masayo Nagai, Mika Inaba
-
Patent number: 8065793Abstract: An application method for resin includes applying resin to a first electronic component in an application chamber under a first internal pressure, moving a second electronic component into an internal pressure adjustment chamber under a second internal pressure which is higher than the first internal pressure and adjusting an internal pressure of the internal pressure adjustment chamber from the second internal pressure to the first internal pressure, and moving the second electronic component into the application chamber while moving the first electronic component into the internal pressure adjustment chamber after the step of application of the resin has been completed.Type: GrantFiled: November 12, 2009Date of Patent: November 29, 2011Assignee: Fujitsu LimitedInventors: Kazuyuki Ikura, Junzou Une, Jun Matsueda
-
Patent number: 7938160Abstract: An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.Type: GrantFiled: September 22, 2009Date of Patent: May 10, 2011Assignee: Fujitsu LimitedInventors: Yasuyuki Masuda, Yukio Ozaki, Jun Matsueda, Kazuyuki Ikura, Taizan Kobayashi, Toshinori Kasuga
-
Publication number: 20110076009Abstract: An optical axis adjusting apparatus for an optical device includes a drive unit moving an optical component through which communication light emitted from a light source passes, a plate member disposed facing the optical component, the plate member allowing light to transmit through the plate member and reflecting light to the optical component, a photographing unit disposed on a back side of the plate member, taking an image irradiated with the light transmitted through the plate member, and a control section controlling the drive unit to move the optical component based on the image and information on optical characteristics of the light reflected by the plate member.Type: ApplicationFiled: September 22, 2010Publication date: March 31, 2011Applicant: FUJITSU LIMITEDInventors: Masahiko SATO, Jun MATSUEDA, Yukihiko OHASHI, Yoshinori HINO
-
Patent number: 7905268Abstract: An ultrasonic bonding apparatus for manufacturing an electronic device that includes a substrate, an electronic component, and an underfill filled between the electronic component and the substrate includes a head that includes a tool surface configured to mount the electronic component, a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate and to press the head against the wiping member on the wiping table, a detector configured to detect a first pressure applied between the wiping member on the wiping table and the tool surface when the wiping unit provides wiping, and a controller configured to control a second pressure applied by the ultrasonic bonding unit, based on a detection result by the detector.Type: GrantFiled: September 22, 2009Date of Patent: March 15, 2011Assignee: Fujitsu LimitedInventors: Yasuyuki Masuda, Yukio Ozaki, Jun Matsueda, Kazuyuki Ikura, Taizan Kobayashi, Toshinori Kasuga
-
Patent number: 7823618Abstract: An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.Type: GrantFiled: September 22, 2009Date of Patent: November 2, 2010Assignee: Fujitsu LimitedInventors: Yasuyuki Masuda, Yukio Ozaki, Jun Matsueda, Kazuyuki Ikura, Taizan Kobayashi, Toshinori Kasuga
-
Publication number: 20100122457Abstract: An application method for resin includes applying resin to a first electronic component in an application chamber under a first internal pressure, moving a second electronic component into an internal pressure adjustment chamber under a second internal pressure which is higher than the first internal pressure and adjusting an internal pressure of the internal pressure adjustment chamber from the second internal pressure to the first internal pressure, and moving the second electronic component into the application chamber while moving the first electronic component into the internal pressure adjustment chamber after the step of application of the resin has been completed.Type: ApplicationFiled: November 12, 2009Publication date: May 20, 2010Applicant: FUJITSU LIMITEDInventors: Kazuyuki Ikura, Junzou Une, Jun Matsueda
-
Publication number: 20100038406Abstract: An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.Type: ApplicationFiled: September 22, 2009Publication date: February 18, 2010Applicant: FUJITSU LIMITEDInventors: Yasuyuki MASUDA, Yukio OZAKI, Jun MATSUEDA, Kazuyuki IKURA, Taizan KOBAYASHI, Toshinori KASUGA
-
Publication number: 20100006231Abstract: An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.Type: ApplicationFiled: September 22, 2009Publication date: January 14, 2010Applicant: FUJITSU LIMITEDInventors: Yasuyuki MASUDA, Yukio OZAKI, Jun MATSUEDA, Kazuyuki IKURA, Taizan KOBAYASHI, Toshinori KASUGA
-
Publication number: 20100006621Abstract: An ultrasonic bonding apparatus for manufacturing an electronic device that includes a substrate, an electronic component, and an underfill filled between the electronic component and the substrate includes a head that includes a tool surface configured to mount the electronic component, a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate and to press the head against the wiping member on the wiping table, a detector configured to detect a first pressure applied between the wiping member on the wiping table and the tool surface when the wiping unit provides wiping, and a controller configured to control a second pressure applied by the ultrasonic bonding unit, based on a detection result by the detector.Type: ApplicationFiled: September 22, 2009Publication date: January 14, 2010Applicant: FUJITSU LIMITEDInventors: Yasuyuki MASUDA, Yukio OZAKI, Jun MATSUEDA, Kazuyuki IKURA, Taizan KOBAYASHI, Toshinori KASUGA