Abstract: The disclosure relates to methods for nucleic acid purification, comprising (a) combining a sample comprising at least one nucleic acid with a suspension buffer to form a suspension, (b) combining the suspension with a lysis buffer to form a lysate, (c) combining the lysate with a binding buffer to form a solution; (d) combining the solution with at least one magnetic particle to form a combined solution comprising at least one modified magnetic particle reversibly bound to the at least one nucleic acid, (e) separating the at least one modified magnetic particle from the combined solution, (f) washing the at least one modified magnetic particle with a first wash buffer and a second wash buffer, and (g) combining the at least one modified magnetic particle with an elution buffer. Kits comprising these buffers and magnetic particles are also disclosed herein.

Abstract: A method for designing an IC package having a plastic encapsulated portion and a lead frame portion that are bonded together at a bonding interface includes selecting material candidates for each of the plastic encapsulated portion and the lead frame portion to obtain possible material combinations. A peeling stress and a shear stress at the bonding interface for each possible material combination is determined. A design material combination from all of the possible material combinations is then selected based on a singularity parameter and stress intensity factors of the peeling stress and the shear stress. To enhance the IC package, a circular fillet feature having a radius is added to a singularity point at the bonding interface of the IC package to reduce the stress at the singularity point.

Abstract: A method for designing an IC package having a plastic encapsulated portion and a lead frame portion that are bonded together at a bonding interface includes selecting material candidates for each of the plastic encapsulated portion and the lead frame potion to obtain possible material combinations. A peeling stress and a shear stress at the bonding interface for each possible material combination is determined. A design material combination from all of the possible material combinations is then selected based on a singularity parameter and stress intensity factors of the peeling stress and the shear stress. To enhance the IC package, a circular fillet feature having a radius is added to a singularity point at the bonding interface of the IC package to reduce the stress at the singularity point.