Patents by Inventor Jun-Ming SU

Jun-Ming SU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12284837
    Abstract: A backside illuminated image sensor, including a semiconductor layer, a first gate structure, and a light sensing device, is provided. The semiconductor layer has a first surface and a second surface opposite to each other. The first gate structure is disposed on the second surface. The light sensing device is located in the semiconductor layer. The light sensing device extends from the first surface to the second surface.
    Type: Grant
    Filed: May 7, 2024
    Date of Patent: April 22, 2025
    Assignee: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Jun-Ming Su, Chih-Ping Chung, Ming-Yu Ho
  • Publication number: 20240290815
    Abstract: A backside illuminated image sensor, including a semiconductor layer, a first gate structure, and a light sensing device, is provided. The semiconductor layer has a first surface and a second surface opposite to each other. The first gate structure is disposed on the second surface. The light sensing device is located in the semiconductor layer. The light sensing device extends from the first surface to the second surface.
    Type: Application
    Filed: May 7, 2024
    Publication date: August 29, 2024
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Jun-Ming Su, Chih-Ping Chung, Ming-Yu Ho
  • Patent number: 12040343
    Abstract: A backside illuminated image sensor, including a semiconductor layer, a first gate structure, and a light sensing device, is provided. The semiconductor layer has a first surface and a second surface opposite to each other. The first gate structure is disposed on the second surface. The light sensing device is located in the semiconductor layer. The light sensing device extends from the first surface to the second surface.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: July 16, 2024
    Assignee: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Jun-Ming Su, Chih-Ping Chung, Ming-Yu Ho
  • Publication number: 20230043664
    Abstract: A backside illuminated image sensor, including a semiconductor layer, a first gate structure, and a light sensing device, is provided. The semiconductor layer has a first surface and a second surface opposite to each other. The first gate structure is disposed on the second surface. The light sensing device is located in the semiconductor layer. The light sensing device extends from the first surface to the second surface.
    Type: Application
    Filed: August 27, 2021
    Publication date: February 9, 2023
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Jun-Ming Su, Chih-Ping Chung, Ming-Yu Ho
  • Publication number: 20180114141
    Abstract: The present disclosure provides a planning method for learning applied to a planning system for learning, and the planning system for learning includes a storage, a monitor and a processor. The planning method for learning includes the following steps: recording learning information of a plurality of subjects and storing the learning information in the storage via the monitor; calculating weighting parameters of the subjects according to the learning information and calculating weighting scores of the subjects according to the weighting parameters via the processor; and performing a fuzzy process to the weighting scores via the processor to transform the weighting scores into score levels of the subjects, so as to establish a learning sequence of the subjects to establish a learning plan.
    Type: Application
    Filed: November 10, 2016
    Publication date: April 26, 2018
    Inventors: Hsiao-Chien TSENG, Chieh-Feng CHIANG, Jun-Ming SU