Patents by Inventor Jun Mitani

Jun Mitani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230084695
    Abstract: A stress estimation method for a machine structure according to an embodiment is provided with a calculation step of calculating a relationship between the stress generated at the evaluation target position and a physical quantity including a sound pressure or vibration generated at a detection position different from the evaluation target position during vibration of the machine structure. The stress estimation method for a machine structure is provided with a detection step of detecting the physical quantity generated at the detection position during operation of the machine structure. The stress estimation method for a machine structure is provided with an estimation step of estimating the stress generated at the evaluation target position during operation of the machine structure on the basis of the relationship calculated in the calculation step and the physical quantity detected in the detection step.
    Type: Application
    Filed: September 6, 2022
    Publication date: March 16, 2023
    Applicants: KABUSHIKI KAISHA TOSHIBA, Toshiba Energy Systems & Solutions Corporation
    Inventors: Jun MITANI, Takero MUKAI, Takanobu KOJIMA, Masahiko NAKAZONO
  • Patent number: 10842585
    Abstract: A model of a body part, e.g., liver, of which the internal structure can be observed easily; and others. In a liver model according to the present invention, the liver parenchyma is formed in the form of a frame to make it possible to observe the portal, veins, a tumor and others in the inside of the frame 31a easily. In addition, the liver model can be handled easily by gripping a gripping part provided at the lower end surface of the inferior vena cava, and the tumor is integrated with the liver model by means of a joint part. The liver model can be manufactured from a model material using a 3D printer on the basis of three-dimensional shape data for model manufacturing purposes, which are produced using an information processing device.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: November 24, 2020
    Assignees: UNIVERSITY OF TSUKUBA, DAI NIPPON PRINTING CO., LTD.
    Inventors: Jun Mitani, Nobuhiro Ohkohchi, Yukio Oshiro, Kentaro Ko, Takuji Hayashi
  • Publication number: 20180049838
    Abstract: A model of a body part, e.g., liver, of which the internal structure can be observed easily; and others. In a liver model according to the present invention, the liver parenchyma is formed in the form of a frame to make it possible to observe the portal, veins, a tumor and others in the inside of the frame 31a easily. In addition, the liver model can be handled easily by gripping a gripping part provided at the lower end surface of the inferior vena cava, and the tumor is integrated with the liver model by means of a joint part. The liver model can be manufactured from a model material using a 3D printer on the basis of three-dimensional shape data for model manufacturing purposes, which are produced using an information processing device.
    Type: Application
    Filed: February 22, 2016
    Publication date: February 22, 2018
    Applicants: UNIVERSITY OF TSUKUBA, DAI NIPPON PRINTING CO., LTD.
    Inventors: Jun MITANI, Nobuhiro OHKOHCHI, Yukio OSHIRO, Kentaro KO, Takuji HAYASHI
  • Patent number: 6657523
    Abstract: A stacked radio-frequency module is formed by stacking packages each storing MMICs and mounting another package upside down which stores a control circuit for controlling MMICs. The MMICs and control circuits are each sealed by a metal sealing lid within the cavity of each of the packages which are spatially completely separated from each other. Each of the pads for wiring paths for radio-frequency signals and for power supply/control signals and ground pads are provided within each package and at opposing surfaces of packages to be stacked with corresponding pads joined by a gold bump.
    Type: Grant
    Filed: May 24, 2002
    Date of Patent: December 2, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yukinobu Tarui, Kazuhiro Yamaguchi, Jun Mitani
  • Publication number: 20030122638
    Abstract: A stacked radio-frequency module is formed by stacking packages each storing MMICs and mounting another package upside down which stores a control circuit for controlling MMICs. The MMICs and control circuits are each sealed by a metal sealing lid within the cavity of each of the packages which are spatially completely separated from each other. Each of the pads for wiring paths for radio-frequency signals and for power supply/control signals and ground pads are provided within each package and at opposing surfaces of packages to be stacked with corresponding pads joined by a gold bump.
    Type: Application
    Filed: May 24, 2002
    Publication date: July 3, 2003
    Inventors: Yukinobu Tarui, Kazuhiro Yamaguchi, Jun Mitani