Abstract: An optical semiconductor module including a base having installed on an optical fiber and an optical semiconductor element, and a package which houses the base on a bottom thereof and has a first side wall with an optical section through which the optical fiber is led and a second side wall facing the first side wall, where the base is cut off to form a curved surface with respect to the bottom at a lower corner on a side of the base facing the second side wall of the housing, and a ratio of r/t is from 0.4 to 1.0, where t is a thickness of the base, and r is a curvature radius of the curved surface.

Abstract: An optical semiconductor module including a base having installed on an optical fiber and an optical semiconductor element, and a package which houses the base on a bottom thereof and has a first side wall with an optical section through which the optical fiber is led and a second side wall facing the first side wall, where the base is cut off to form a curved surface with respect to the bottom at a lower corner on a side of the base facing the second side wall of the housing, and a ratio of r/t is from 0.4 to 1.0, where t is a thickness of the base, and r is a curvature radius of the curved surface.

Abstract: An optical semiconductor module including a base having installed on an optical fiber and an optical semiconductor element, and a package which houses the base on a bottom thereof and has a first side wall with an optical section through which the optical fiber is led and a second side wall facing the first side wall, where the base is cut off to form a curved surface with respect to the bottom at a lower corner on a side of the base facing the second side wall of the housing, and a ratio of r/t is from 0.4 to 1.0, where t is a thickness of the base, and r is a curvature radius of the curved surface.

Abstract: An optical semiconductor module includes an optical semiconductor element; an optical fiber optically coupled with the semiconductor element; a base having an upper surface and a lower surface; and a package. The package has a bottom plate on which the base is mounted, a front wall having a hole through which the optical fiber is inserted, and a rear wall opposite to the front wall. The optical fiber and the optical semiconductor element are mounted on the upper surface. The base has a rear face formed on an end portion opposite to the front wall, and the rear face is positioned above the lower surface of the base.

Abstract: An optical semiconductor module including a base having installed on an optical fiber and an optical semiconductor element, and a package which houses the base on a bottom thereof and has a first side wall with an optical section through which the optical fiber is led and a second side wall facing the first side wall, where the base is cut off to form a curved surface with respect to the bottom at a lower corner on a side of the base facing the second side wall of the housing, and a ratio of r/t is from 0.4 to 1.0, where t is a thickness of the base, and r is a curvature radius of the curved surface.

Abstract: An optical semiconductor module includes an optical semiconductor element; an optical fiber optically coupled with the semiconductor element; a base having an upper surface and a lower surface; and a package. The package has a bottom plate on which the base is mounted, a front wall having a hole through which the optical fiber is inserted, and a rear wall opposite to the front wall. The optical fiber and the optical semiconductor element are mounted on the upper surface.

Abstract: An optical module includes a package; an optical device housed in the package, and having a temperature-dependent characteristic; a thermo-module connected to the optical device to control its temperature and configured to heat or cool the optical device when supplied with a first electric current in one direction or a second electric current in a direction opposite to the first electric current, respectively; and a heating element disposed close to the optical device and configured to heat the optical device when supplied with an electric current.

Abstract: A semiconductor laser diode module in which a laser diode and an optical fiber are optically coupled with each other efficiently irrespective of an ambient temperature change within the laser diode module. The laser diode module includes a laser diode, an optical system including an optical fiber and a lens portion, a holder configured to receive a portion of the optical system, a base having a holder mounting member and a fastening member, and a bottom plate configured to support the base. The holder is mounted to the fastening member at a first joint position, and the fastening member is mounted to the holder mounting member at a second joint position, where the first and second joint positions are located at substantially a same distance from the bottom plate. Alternatively, the first and second joint positions are coplanar with an active layer of the diode.

Abstract: The present invention is related to a laser diode module and a fabricating method therefor, which facilitates the fabrication of the laser diode module in a short time with a low manufacturing cost and high long term reliability. The laser diode module is formed by optically aligning a lens formed fiber disposed within a ferrule to a laser diode element. Ferrule fixing parts are utilized to hold the ferrule in place and are secured in position using a YAG laser welding process.

Abstract: A lensed polarization maintaining fiber having a lens on an end thereof has a core, two stress-applied regions disposed on both sides of the core, respectively, and a clad containing the core and stress-applied regions. The lens has at least an inclined face, the inclined face including an edge. Each of the stress-applied regions is exposed on the inclined face except the edge.

Abstract: A semiconductor laser diode module in which a laser diode and an optical fiber are optically coupled with each other efficiently irrespective of an ambient temperature change within the laser diode module. The laser diode module includes a laser diode, an optical system including an optical fiber and a lens portion, a base configured to support the laser diode and at least a portion of the optical system, and a bottom plate configured to support the laser diode, the optical system, and the base. The optical system is configured to receive and transmit a beam emitted from the laser diode through the lens portion to the optical fiber along an optical axis. The base includes a structural support member configured to prevent warping of the base, where the structural support member extends along the base in a direction generally parallel to the optical axis.

Abstract: A laser diode module in which a laser diode and an optical fiber are optically coupled with each other efficiently irrespective of an ambient temperature change within the laser diode module. The laser diode module includes a laser diode, an optical system, an optical system mounting member supporting at least a portion of the optical system, a laser diode mounting member, and a bottom plate supporting the laser diode, the optical system, the optical system mounting member, and the laser diode mounting member. The optical system receives and transmits a beam emitted from the laser diode through a lens portion to an optical fiber. The optical system mounting member is attached to the laser diode mounting member. The laser diode module preferably includes a thermo module having a first plate member attached to the laser diode mounting member.

Abstract: A semiconductor laser diode module in which a laser diode and an optical fiber are optically coupled with each other efficiently irrespective of an ambient temperature change within the laser diode module. The laser diode module includes a laser diode, an optical system including an optical fiber and a lens portion, a holder configured to receive a portion of the optical system, a base having a holder mounting member and a fastening member, and a bottom plate configured to support the base. The holder is mounted to the fastening member at a first joint position, and the fastening member is mounted to the holder mounting member at a second joint position, where the first and second joint positions are located at substantially a same distance from the bottom plate. Alternatively, the first and second joint positions are coplanar with an active layer of the diode.

Abstract: A semiconductor laser diode module in which a laser diode and an optical fiber are optically coupled with each other efficiently irrespective of an ambient temperature change within the laser diode module. The laser diode module includes a laser diode, an optical system including an optical fiber and a lens portion, a base configured to support the laser diode and at least a portion of the optical system, and a bottom plate configured to support the laser diode, the optical system, and the base. A portion of the base is made of a material having a first thermal expansion coefficient and the bottom plate is constructed of a material having a second thermal expansion coefficient, where the first thermal expansion coefficient is substantially equal to the second thermal expansion coefficient. The optical system is configured to receive and transmit a beam emitted from the laser diode through the lens portion to the optical fiber.

Abstract: An optical semiconductor module includes an optical semiconductor element; an optical fiber optically coupled with the semiconductor element; a base having an upper surface and a lower surface; and a package. The package has a bottom plate on which the base is mounted, a front wall having a hole through which the optical fiber is inserted, and a rear wall opposite to the front wall. The optical fiber and the optical semiconductor element are mounted on the upper surface. The base has a rear face formed on an end portion opposite to the front wall, and the rear face is positioned above the lower surface of the base.

Abstract: An optical module includes a package; an optical device housed in the package, and having a temperature-dependent characteristic; a thermo-module connected to the optical device to control its temperature and configured to heat or cool the optical device when supplied with a first electric current in one direction or a second electric current in a direction opposite to the first electric current, respectively; and a heating element disposed close to the optical device and configured to heat the optical device when supplied with an electric current.

Abstract: The present invention is related to a laser diode module and a fabricating method therefor, which facilitate the fabrication and enable fabrication in a short time with a low cost and high long-range reliability. With a lens formed fiber (8) and a laser diode element (LD element) (3) aligned with each other, the front side edge portion of the ferule 4 near the LD element 3 are fixedly sandwiched on the both sides thereof by means of a ferule supporting part (6) to form a sandwiched portion (9). By a fulcrum at sandwiched portion (9), the rear side edge portion of the ferule (4) is displaced to re-align the lens formed fiber (8) with the LD element (3). On the both sides for sandwiching the rear edge side of the ferule (4), ferule fixing parts (10) guided by means of a guide portion (11) with a spacing interposed against the ferule (4) are disposed with a spacing within a range of approximately 0 to 5 &mgr;m relative to a side surface of the ferule (4).

Abstract: There is provided a semiconductor laser device capable of increasing the optical output. The semiconductor laser module comprises a semiconductor laser device (1), an optical fiber (2) that receives light emitted from the semiconductor laser device (1) and a photo diode (3) that monitors optical output of the semiconductor laser device (1). The optical fiber (2) is a lensed fiber having a wedge-shaped lens on its tip and the photo diode (3) placed in the vicinity of the laser light receiving end (2a) of the semiconductor laser device (1) receives reflected light from a reflection surface (2a1) and monitors the optical output of the semiconductor laser device (1).

Abstract: A laser diode module is provided which is capable of suppressing reduction in the efficiency of laser beam coupling with an optical fiber even in the case where a warp is caused in the mounting surface of a thermo electrical cooler on which a laser diode chip is mounted. A laser diode module has a heat sink and optical coupling portion mounted directly or indirectly on a mounting surface of a thermo electrical cooler. A laser diode chip and the optical coupling portion are located on the same side of the mounting surface along the emitting direction of a laser beam emitted from the laser diode chip, with respect to a first center line (Lcpp) intersecting perpendicularly with a tangential plane tangent to the mounting surface of the thermo electrical cooler at the center thereof and/or a second center line passing through the center of the mounting surface of the thermo electrical cooler and perpendicular to both the first center line and an axis representative of the emitting direction of the laser beam.

Abstract: A protective member and an optical module comprises a package for retaining an optical component, an optical fiber to be fixed to the package in such a way as to be optically coupled to the optical component and a protective member which protects the optical fiber. The protective member has a body, which covers the package and optical fiber, formed of an elastic material and a reinforcing member arranged along an inner surface of the body to cover an outer surface of the optical fiber in a contactless state with respect to the optical fiber.