Abstract: Provided is a thermoplastic resin composition which has excellent heat resistance, mechanical characteristics, and adhesion properties with respect to a reinforcing fiber base material, which is a different kind of material, and from which a molded article particularly having excellent rigidity at a high temperature is obtained. A thermoplastic resin composition is provided, which includes: a phenoxy resin (A) having a hydroxy group and/or an epoxy group at a polymer chain terminal; and a polyamide resin (B), wherein a proportion of the phenoxy resin (A) is 50 to 90 mass % and a proportion of the polyamide resin (B) is 10 to 50 mass % relative to a total amount of 100 mass % of the phenoxy resin (A) and the polyamide resin (B), and a tensile modulus retention rate [Equation (i) below] of a dumbbell test piece (JIS K 7139, Type A1), and a molded article manufactured therefrom is also provided.

Abstract: This resin composition contains a first resin and a second resin, and exhibits curability by thermal crosslinking, wherein the first resin is at least one selected from among a bifunctional epoxy resin having a weight average molecular weight of 4,000 or more, and a phenoxy resin, and the second resin is a polycarbonate resin. The content ratio, by weight, of the first resin to the second resin (the first resin:the second resin) is preferably in the range of 9:1 to 2:8. Both the first resin and the second resin preferably have a bisphenol skeleton in a molecule.

Abstract: An object of the present invention is to provide an adhesion improver for a carbon fiber-reinforced polyolefin-based resin composition that provides improved mechanical characteristics such as bending strength and bending elastic modulus. The adhesion improver is used for a carbon fiber-reinforced resin composition including carbon fibers and a polyolefin-based resin. The adhesion improver includes an acid-modified polyolefin-based resin unit and an epoxy resin unit. The acid-modified polyolefin-based resin unit and the epoxy resin unit are linked via an ester structure, and the epoxy resin unit includes a secondary hydroxy group.