Abstract: A D/A converting unit generates a comparative voltage corresponding to a target bit falling within a range from a most significant bit through a least significant bit. A comparator determines a value of the target bit by comparing a differential voltage between an output signal of an input switching unit and a comparative voltage generated by the D/A converting unit with a reference voltage. An integrator integrates a conversion error. In a first conversion operation of converting a first signal, a control unit sets, based on a result obtained by the integrator, the reference voltage for use when the first signal to be provided next time as the output signal by the input switching unit is A/D converted. In a second conversion operation of A/D converting a second signal, the control unit sets the reference voltage at a constant voltage level.

Abstract: Provided are an analog-to-digital (AD) converter, a sensor processing circuit, and a sensor system capable of improving responsiveness of feedback control. AD converter includes input part, AD conversion part, first output part, and second output part. The analog signal output from sensor is input to input part. AD conversion part digitally converts an analog signal to generate first digital data and second digital data. First output part outputs the first digital data to control circuit. Second output part outputs the second digital data to sensor before first output part outputs the first digital data.

Abstract: A D/A converting unit generates a comparative voltage corresponding to a target bit falling within a range from a most significant bit through a least significant bit. A comparator determines a value of the target bit by comparing a differential voltage between an output signal of an input switching unit and a comparative voltage generated by the D/A converting unit with a reference voltage. An integrator integrates a conversion error. In a first conversion operation of converting a first signal, a control unit sets, based on a result obtained by the integrator, the reference voltage for use when the first signal to be provided next time as the output signal by the input switching unit is A/D converted. In a second conversion operation of A/D converting a second signal, the control unit sets the reference voltage at a constant voltage level.

Abstract: An A/D converter includes an A/D conversion unit and an output unit. The A/D conversion unit includes a second A/D converter (successive approximation register A/D converter) and generates first digital data having a first number of bits and second digital data having a second number of bits, where the second number of bits is smaller than the first number of bits. The output unit provides first output information that is the first digital data and also provides second output information based on the second digital data. The output unit provides the second output information before providing the first output information.

Abstract: A digital filter is used in an A/D converter and includes a first filter and second filter. The first filter outputs first digital data by performing filter processing on output of an A/D conversion unit included in the A/D converter. The second filter outputs second digital data by performing filter processing on the output of the A/D conversion unit. The second digital data has either a lower resolution or a smaller effective number of bits than the first digital data does. The second filter outputs the second digital data before the first filter outputs the first digital data.

Abstract: Provided are an analog-to-digital (AD) converter, a sensor system, and a test system capable of reducing the time for test processing. AD converter includes input part, AD conversion part, first output part, and second output part. The analog signal output from sensor is input to input part. AD conversion part digitally converts an analog signal to generate first digital data and second digital data. First output part outputs the first digital data to control circuit. Second output part outputs the second digital data to test controller before first output part outputs the first digital data. In the test mode, test controller determines whether or not sensor system including sensor is in an abnormal state on the basis of the second digital data.

Abstract: Provided is a heterofullerene where n number (where n is a positive even number) of carbon atoms constituting a fullerene are substituted by n number of boron atoms or n number of nitrogen atoms.

Abstract: An A/D converter includes an A/D conversion unit and an output unit. The A/D conversion unit includes a second A/D converter (successive approximation register A/D converter) and generates first digital data having a first number of bits and second digital data having a second number of bits, where the second number of bits is smaller than the first number of bits. The output unit provides first output information that is the first digital data and also provides second output information based on the second digital data. The output unit provides the second output information before providing the first output information.

Abstract: A digital filter is used in an A/D converter and includes a first filter and second filter. The first filter outputs first digital data by performing filter processing on output of an A/D conversion unit included in the A/D converter. The second filter outputs second digital data by performing filter processing on the output of the A/D conversion unit. The second digital data has either a lower resolution or a smaller effective number of bits than the first digital data does. The second filter outputs the second digital data before the first filter outputs the first digital data.

Abstract: Provided are an analog-to-digital (AD) converter, a sensor processing circuit, and a sensor system capable of improving responsiveness of feedback control. AD converter includes input part, AD conversion part, first output part, and second output part. The analog signal output from sensor is input to input part. AD conversion part digitally converts an analog signal to generate first digital data and second digital data. First output part outputs the first digital data to control circuit. Second output part outputs the second digital data to sensor before first output part outputs the first digital data.

Abstract: Provided are an analog-to-digital (AD) converter, a sensor system, and a test system capable of reducing the time for test processing. AD converter includes input part, AD conversion part, first output part, and second output part. The analog signal output from sensor is input to input part. AD conversion part digitally converts an analog signal to generate first digital data and second digital data. First output part outputs the first digital data to control circuit. Second output part outputs the second digital data to test controller before first output part outputs the first digital data. In the test mode, test controller determines whether or not sensor system including sensor is in an abnormal state on the basis of the second digital data.

Abstract: A p-type semiconductor film including heterofullerene having a further sufficiently high hole mobility is provided. The p-type semiconductor film contains heterofullerene in which n+r number (where n and r are both positive odd numbers) of carbon atoms constituting a fullerene are substituted by n number of boron atom or atoms and r number of nitrogen atom or atoms.

Abstract: A p-type semiconductor film including heterofullerene having a further sufficiently high hole mobility is provided. The p-type semiconductor film contains heterofullerene in which n+r number (where n and r are both positive odd numbers) of carbon atoms constituting a fullerene are substituted by n number of boron atom or atoms and r number of nitrogen atom or atoms.

Abstract: A wireless communication semiconductor device includes a circuit board, a semiconductor chip mounted on the circuit board, a thin film transistor provided on the circuit board, and an antenna provided on the circuit board. Even if a different unique ID is assigned to each of the wireless communication semiconductor devices, as compared with silicon-based wireless communication semiconductor devices, a manufacturing cost per device is sufficiently reduced, and the reduction in operation speed and reliability is sufficiently prevented.

Abstract: Improving safety against peeling-off of a semiconductor device from an article and omitting an adhesion work of the semiconductor device to the article are made possible. Provided is semiconductor device including one or more components selected from a group including semiconductor chip, thin film transistor, antenna, and wiring. The one or more components are directly fixed on a surface of article. Provided is a manufacturing method of semiconductor device including one or more components selected from a group including semiconductor chip, thin film transistor, antenna, and wiring. The manufacturing method includes at least one of following step P1 and step Q1: step P1 of directly mounting the semiconductor chip on a surface of an article; and step Q1 of directly forming one or more components selected from a group including the thin film transistor, the antenna, and the wiring on the surface of the article by a printing method.

Abstract: The present disclosure provides a vibration power generation device capable of generating large electric power relative to an amount of displacement of a portion of a specimen. Vibration power generation device according to the present invention includes piezoelectric part and displacement enhancer. In response to displacement of a portion of specimen, displacement enhancer displaces a portion of piezoelectric part by a displacement amount greater than an amount of the displacement of the portion of specimen. When the portion of piezoelectric part is displaced, piezoelectric part generates electric power in accordance with an amount of the displacement of the portion of piezoelectric part.

Abstract: Provided is a heterofullerene where n number (where n is a positive even number) of carbon atoms constituting a fullerene are substituted by n number of boron atoms or n number of nitrogen atoms.

Abstract: A differential amplifier circuit comprises: first and second input terminals; first and second output terminals; a first transistor comprising a gate terminal connected to the first input terminal; a second transistor comprising a gate terminal connected to the second input terminal; a first resistor connected between the source terminal of the first transistor and the source terminal of the second transistor; a third transistor comprising a drain terminal connected to the source terminal of the first transistor, a gate terminal connected to the drain terminal of the first transistor, and a source terminal connected to the first output terminal; a fourth transistor comprising a drain terminal connected to the source terminal of the second transistor, a gate terminal connected to the drain terminal of the second transistor, and a source terminal connected to the second output terminal; first to fourth current sources; and second and third resistors.

Abstract: A differential amplifier circuit comprises: first and second input terminals; first and second output terminals; a first transistor comprising a gate terminal connected to the first input terminal; a second transistor comprising a gate terminal connected to the second input terminal; a first resistor connected between the source terminal of the first transistor and the source terminal of the second transistor; a third transistor comprising a drain terminal connected to the source terminal of the first transistor, a gate terminal connected to the drain terminal of the first transistor, and a source terminal connected to the first output terminal; a fourth transistor comprising a drain terminal connected to the source terminal of the second transistor, a gate terminal connected to the drain terminal of the second transistor, and a source terminal connected to the second output terminal; first to fourth current sources; and second and third resistors.

Abstract: An alkali-free glass applicable to a light transparent glass substrate in a liquid crystal display essentially consists, by weight, of basic elements of 40-70% SiO2, 6-25% Al2O3, 5-20% B2O3, 0-10% MgO, 0-15% CaO, 0-30% BaO, 0-10% SrO, and 0-10% ZnO, and a fining agent of a combination of 0.05-3% Sb2O3 and at least one of 0.05-2% SnO2 and 0.005-1% Cl2, which fining agent makes the resultant glass free from bubbles without the use of toxic As2O3 which has been known as the fining agent in the art.