Patents by Inventor Jun Nakahara

Jun Nakahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8197718
    Abstract: Provided are a paste composition making it possible to improve the adhesive property of a backside electrode and restrain an aluminum electrode layer from exfoliating, and a solar cell element having an electrode formed by use of this composition. The paste composition is a paste composition for forming an electrode (8) on a silicon semiconductor substrate (1) which comprises aluminum powder, an organic vehicle, and a tackifier. The solar cell element has the electrode (8) formed by painting a paste composition having the above-mentioned characteristic onto the silicon semiconductor substrate (1) and then firing the resultant.
    Type: Grant
    Filed: June 1, 2006
    Date of Patent: June 12, 2012
    Assignee: Toyo Aluminium Kabushiki Kaisha
    Inventors: Jun Nakahara, Gaochao Lai, Haruzo Katoh, Takashi Watsuji
  • Publication number: 20080302411
    Abstract: Provided are a paste composition making it possible to improve the adhesive property of a backside electrode and restrain an aluminum electrode layer from exfoliating, and a solar cell element having an electrode formed by use of this composition. The paste composition is a paste composition for forming an electrode (8) on a silicon semiconductor substrate (1) which comprises aluminum powder, an organic vehicle, and a tackifier. The solar cell element has the electrode (8) formed by painting a paste composition having the above-mentioned characteristic onto the silicon semiconductor substrate (1) and then firing the resultant.
    Type: Application
    Filed: June 1, 2006
    Publication date: December 11, 2008
    Inventors: Jun Nakahara, Gaochao Lai, Haruzo Katoh, Takashi Watsuji
  • Publication number: 20080135097
    Abstract: Disclosed herein are a paste composition capable of, even when the thickness of a silicon semiconductor substrate (1) is reduced, satisfactorily achieving a desired BSF effect and suppressing the deformation (bow) of the silicon semiconductor substrate (1) occurring after the firing of the paste composition without reducing the mechanical strength of an obtained electrode (8) and the adhesion of the electrode (8) to the silicon semiconductor substrate (1), an electrode (8) formed using the paste composition, and a solar cell element including the electrode (8). The paste composition is used for forming an electrode on a silicon semiconductor substrate (1), and contains aluminum powder, an organic vehicle, and whisker insoluble or hardly-soluble in the organic vehicle, the whisker being previously mixed with the aluminum powder and the organic vehicle.
    Type: Application
    Filed: March 7, 2006
    Publication date: June 12, 2008
    Inventors: Ken Kikuchi, Jun Nakahara, Takashi Watsuji, Gaochao Lai, Kazuhiko Yokoe
  • Patent number: D522952
    Type: Grant
    Filed: July 18, 2005
    Date of Patent: June 13, 2006
    Assignee: Honda Motor Co., Ltd.
    Inventor: Jun Nakahara
  • Patent number: D528232
    Type: Grant
    Filed: July 18, 2005
    Date of Patent: September 12, 2006
    Assignee: Honda Motor Co., Ltd.
    Inventor: Jun Nakahara
  • Patent number: D528681
    Type: Grant
    Filed: July 18, 2005
    Date of Patent: September 19, 2006
    Assignee: Honda Motor Co., Ltd.
    Inventor: Jun Nakahara
  • Patent number: D598591
    Type: Grant
    Filed: March 2, 2009
    Date of Patent: August 18, 2009
    Assignee: Honda Motor Co., Ltd.
    Inventor: Jun Nakahara
  • Patent number: D607382
    Type: Grant
    Filed: February 18, 2009
    Date of Patent: January 5, 2010
    Assignee: Honda Motor Co., Ltd.
    Inventor: Jun Nakahara
  • Patent number: D692803
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: November 5, 2013
    Assignee: Honda Motor Co., Ltd
    Inventor: Jun Nakahara
  • Patent number: D749022
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: February 9, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Jun Nakahara
  • Patent number: D749023
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: February 9, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Jun Nakahara
  • Patent number: D749251
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: February 9, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Jun Nakahara
  • Patent number: D749252
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: February 9, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Jun Nakahara
  • Patent number: D749471
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: February 16, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Jun Nakahara
  • Patent number: D755692
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: May 10, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Jun Nakahara
  • Patent number: D759551
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: June 21, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Jun Nakahara
  • Patent number: D774434
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: December 20, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Jun Nakahara