Abstract: An image forming apparatus capable of improving the reliability of intermediate transfer belt shift control and attaining a high quality image. The image forming apparatus includes an intermediate transfer belt onto which a toner image is transferred and formed, a shift position detecting sensor that detects a shift position of the belt, a shift control roller that changes the shift position of the belt, and an angle adjustment cam and an angle adjustment arm that correct an inclination angle of the roller. An amount of correction for the inclination angle is calculated by an ASIC based on the belt shift position detected by the sensor. In a Kf multiplier and a Kr multiplier, coefficient values used for the calculation of the amount of correction for the inclination angle can variably be changed independently for respective directions of control for the roller inclination angle.

Abstract: An image forming apparatus includes a pattern forming unit which forms a light amount adjustment pattern on an image carrier belt, a light amount control unit which controls the amount of light irradiating the image carrier belt and pattern, a detection sensor which detects reflected light amounts from the image carrier belt and pattern with respect to the irradiating light amount and stores the detection results in a storage unit, a calculation unit which calculates the correspondence between the irradiating light amount and the reflected light amounts from the image carrier belt and pattern on the basis of the detection results and stores the calculation results in the storage unit, and a light amount decision unit which decides, on the basis of the calculation results, a light amount at which the difference between the reflected light amounts from the image carrier belt and pattern exhibits a value set in advance.

Abstract: A rotary member apparatus includes a main drive unit configured to apply a driving torque to a photosensitive drum through a drive transfer unit, a torque limiter configured to limit the driving torque transmitted from the main drive unit to the photosensitive drum, a compensation drive unit configured to apply a torque for adjusting an angular velocity of the photosensitive drum, an encoder configured to detect the angular velocity of the photosensitive drum, and a compensation drive controller configured to control the torque applied by the compensation drive unit on the basis of a detection result obtained by the encoder.

Abstract: An image forming apparatus includes a pattern forming unit which forms a light amount adjustment pattern on an image carrier belt, a light amount control unit which controls the amount of light irradiating the image carrier belt and pattern, a detection sensor which detects reflected light amounts from the image carrier belt and pattern with respect to the irradiating light amount and stores the detection results in a storage unit, a calculation unit which calculates the correspondence between the irradiating light amount and the reflected light amounts from the image carrier belt and pattern on the basis of the detection results and stores the calculation results in the storage unit, and a light amount decision unit which decides, on the basis of the calculation results, a light amount at which the difference between the reflected light amounts from the image carrier belt and pattern exhibits a value set in advance.

Abstract: An image forming apparatus including a fixing device for fixing by heat an image formed on a recording material; a heater for heating the fixing device; a controller for controlling electric power supply to the heater, wherein the apparatus is operable in a stand-by mode in which an electric energy consumption of the heater is reduced, wherein in the stand-by mode, the controller continuously supplies the electric power to the heater.

Abstract: An image forming apparatus capable of ensuring a sufficient difference between amounts of light reflected from a base such as a transfer material and from a toner pattern in the detection of the toner pattern for registration correction control by a reflective optical sensor. The image forming apparatus includes a pattern generator for generating a toner pattern, a pattern detection sensor for detecting the toner pattern formed on the intermediate transfer belt, a pattern density decider for determining the density of the toner pattern that makes the amount of light received by the sensor in detection of the toner pattern equal to or less than a predetermined value.

Abstract: An image forming apparatus includes a pattern forming unit which forms a light amount adjustment pattern on an image carrier belt, a light amount control unit which controls the amount of light irradiating the image carrier belt and pattern, a detection sensor which detects reflected light amounts from the image carrier belt and pattern with respect to the irradiating light amount and stores the detection results in a storage unit, a calculation unit which calculates the correspondence between the irradiating light amount and the reflected light amounts from the image carrier belt and pattern on the basis of the detection results and stores the calculation results in the storage unit, and a light amount decision unit which decides, on the basis of the calculation results, a light amount at which the difference between the reflected light amounts from the image carrier belt and pattern exhibits a value set in advance.

Abstract: An image forming apparatus has a fixing unit for fixing a toner image formed on a recording material, and a heater, for heating the fixing unit, made of a carbon-based material. In order to detect and expect the life of the heating unit with good accuracy, the image forming apparatus further has a current measuring device for measuring a current passing through the heating unit and a notification device for providing notification of information on a life of the heating unit depending on an output of the current measuring device.

Abstract: An image forming apparatus includes fixing means for fixing a toner image formed on a recording material, and heating means, for heating the fixing means, comprising a carbon-based material. In order to detect and expect the life of the heating means with good accuracy, the image forming apparatus further comprises current measuring means for measuring a current passing through the heating means and notification means for providing notification of information on a life of the heating means depending on an output of the current measuring means.

Abstract: An image forming apparatus including fixing means for fixing by heat an image formed on a recording material; heating means for heating the fixing means; control means for controlling electric power supply to the heating means, wherein the apparatus is operable in a stand-by mode in which an electric energy consumption of the heating means is reduced, wherein in the stand-by mode, the control means continuously supply the electric power to the heating means.

Abstract: A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.

Abstract: A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: A semiconductor failure analysis system and method therefor facilitated by a failure information collection unit for collection, by bit, failure information of a semiconductor, an inspection unit for examining relations between various types of inspection data obtained by inspection of the semiconductor and for examining relations between the inspection data and failure information, a storage unit for storing design information of the semiconductor, an analysis unit for analyzing the failure information from the failure information collection unit, from the inspection unit and design information stored in the storage unit, a display unit for displaying at least one of the result of analysis from the analysis unit and the failure information, a failure cause estimation unit for estimating a cause of the failure information, and a unit for feeding the estimated cause of the failure information back to a process in which the failure has occurred.

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.