Abstract: An amplifier is configured in such a way that a first capacitor resonates at the frequency of a second harmonic wave included in a signal outputted from an amplifying element, a circuit including a second transmission line, the first capacitor, and a second capacitor resonates at the frequency of a third harmonic wave included in the signal outputted from the amplifying element, and also matches the impedance for a fundamental wave together with an impedance matching circuit.

Abstract: A coaxial-waveguide-to-hollow-waveguide transition circuit (1) includes a hollow waveguide (10), a coaxial waveguide (20) having an end coupled to a wide wall (16) of the hollow waveguide (10), and a strip conductor (30) located inside the internal path (10h) of the hollow waveguide (10). The coaxial waveguide (20) includes a conducting core wire (22) extending into the internal path (10h) of the hollow waveguide (10). The strip conductor (30) is located so as to make a short-circuit connection between the conducting core wire (22) of the coaxial waveguide (20) and a termination surface (12) of the hollow waveguide (10).

Abstract: An amplifier is configured in such a way that a first capacitor resonates at the frequency of a second harmonic wave included in a signal outputted from an amplifying element, a circuit including a second transmission line, the first capacitor, and a second capacitor resonates at the frequency of a third harmonic wave included in the signal outputted from the amplifying element, and also matches the impedance for a fundamental wave together with an impedance matching circuit.

Abstract: A coaxial-waveguide-to-hollow-waveguide transition circuit (1) includes a hollow waveguide (10), a coaxial waveguide (20) having an end coupled to a wide wall (16) of the hollow waveguide (10), and a strip conductor (30) located inside the internal path (10h) of the hollow waveguide (10). The coaxial waveguide (20) includes a conducting core wire (22) extending into the internal path (10h) of the hollow waveguide (10). The strip conductor (30) is located so as to make a short-circuit connection between the conducting core wire (22) of the coaxial waveguide (20) and a termination surface (12) of the hollow waveguide (10).

Abstract: An output power control device includes: an attenuator to attenuate power of a high-frequency signal output from an oscillator; a high-frequency power amplifier to amplify the power of the high-frequency signal output from the attenuator; a monitor circuit to monitor the power of the high-frequency signal output from the high-frequency power amplifier; and a controller to control an attenuation amount of the attenuator based on the monitor signal output from the monitor circuit or based on attenuation amount setting data from a data unit. The oscillator generates the high-frequency signal in synchronization with a trigger signal. The controller starts control of the attenuation amount of the attenuator based on the attenuation amount setting data, in synchronization with the trigger signal, and, after receiving the monitor signal, the controller controls the attenuation amount of the attenuator based on the monitor signal.

Abstract: A waveguide circuit (1) includes a first waveguide tube (10), a second waveguide tube (20), and a third waveguide tube (30). The first waveguide tube (10), the second waveguide tube (20), and the third waveguide tube (30) have cross-sectional shapes to allow propagation of TE modes. The tube axis of the second waveguide tube (20) is parallel to the tube axis of the first waveguide tube (10). One of the narrow sidewalls of the second waveguide tube (20) faces a narrow sidewall (10s) of the first waveguide tube (10). The third waveguide tube (30) includes a coupler that connects a hollow guide of the third waveguide tube (30) to a hollow guide of the first waveguide tube (10) and a hollow guide of the second waveguide tube (20).

Abstract: A distortion compensation device includes: a first distributor configured to distribute an input signal into a first route signal and a second route signal; a distortion generation circuit configured to generate a distortion component has non-linear characteristics opposite to those of a device to be compensated in the input first route signal; a second distributor configured to receive the first route signal including the distortion component, distribute the first route signal including the distortion component into a third route signal and a fourth route signal; a first combiner configured to receive the second route signal and the third route signal, and extract and output the distortion component included in the third route signal; a frequency characteristic adjustment circuit configured to unbalance the distortion component output from the first combiner; and a second combiner configured to combine the distortion component unbalanced by the frequency characteristic adjustment circuit with the fourth rout

Abstract: An output power control device includes: an attenuator to attenuate power of a high-frequency signal output from an oscillator; a high-frequency power amplifier to amplify the power of the high-frequency signal output from the attenuator; a monitor circuit to monitor the power of the high-frequency signal output from the high-frequency power amplifier; and a controller to control an attenuation amount of the attenuator based on the monitor signal output from the monitor circuit or based on attenuation amount setting data from a data unit. The oscillator generates the high-frequency signal in synchronization with a trigger signal. The controller starts control of the attenuation amount of the attenuator based on the attenuation amount setting data, in synchronization with the trigger signal, and, after receiving the monitor signal, the controller controls the attenuation amount of the attenuator based on the monitor signal.

Abstract: A coaxial microstrip line conversion circuit includes: a waveguide including first and second through holes, spaced apart from each other, the second through hole having a dimension to cut off a used frequency; a coaxial connector including a central conductor including a projection projecting from an axial end of an outer conductor; and a microstrip line including a ground conductor provided on one surface of an insulating substrate, and a strip line provided on the other surface of the insulating substrate and including a projection projecting axially from the ground conductor. The outer conductor is connected to an outer wall of the waveguide. The projection of the central conductor is inserted through the first through hole into the waveguide, the ground conductor is connected to an inner wall of the second through hole, and the projection of the strip line is inserted through the second through hole into the waveguide.

Abstract: A high frequency module improved in heat dissipation performance includes: a dielectric multilayer substrate including a ground layer and a high frequency electronic component mounted thereon while being in contact with the ground layer, the high frequency electronic component including a heat generating portion; and a cutoff block formed of an upstanding wall portion and a cover portion covering the upstanding wall portion, the cutoff block housing the high frequency electronic component and including a hollow portion having a cutoff characteristic at a frequency of a high frequency signal used by the high frequency electronic component, and the upstanding wall portion of the cutoff block being in contact with the ground layer of the dielectric multilayer substrate.

Abstract: A distributor distributes an input signal to a first transmission line and a second transmission line. A high-pass filter, a first linearizer, and a first phase shifter disposed on the first transmission line adjust the phase and amplitude of an intermodulation distortion in a low-frequency range. A low-pass filter, a second linearizer, and a second phase shifter disposed on the second transmission line adjust the phase and amplitude of an intermodulation distortion in a high-frequency range. A synthesizer synthesizes the signal from the first transmission line and the signal from the second transmission line.

Abstract: A waveguide circuit (1) includes a first waveguide tube (10), a second waveguide tube (20), and a third waveguide tube (30). The first waveguide tube (10), the second waveguide tube (20), and the third waveguide tube (30) have cross-sectional shapes to allow propagation of TE modes. The tube axis of the second waveguide tube (20) is parallel to the tube axis of the first waveguide tube (10). One of the narrow sidewalls of the second waveguide tube (20) faces a narrow sidewall (10s) of the first waveguide tube (10). The third waveguide tube (30) includes a coupler that connects a hollow guide of the third waveguide tube (30) to a hollow guide of the first waveguide tube (10) and a hollow guide of the second waveguide tube (20).

Abstract: A high frequency module improved in heat dissipation performance includes: a dielectric multilayer substrate including a ground layer and a high frequency electronic component mounted thereon while being in contact with the ground layer, the high frequency electronic component including a heat generating portion; and a cutoff block formed of an upstanding wall portion and a cover portion covering the upstanding wall portion, the cutoff block housing the high frequency electronic component and including a hollow portion having a cutoff characteristic at a frequency of a high frequency signal used by the high frequency electronic component, and the upstanding wall portion of the cutoff block being in contact with the ground layer of the dielectric multilayer substrate.

Abstract: A distributor distributes an input signal to a first transmission line and a second transmission line. A high-pass filter, a first linearizer, and a first phase shifter disposed on the first transmission line adjust the phase and amplitude of an intermodulation distortion in a low-frequency range. A low-pass filter, a second linearizer, and a second phase shifter disposed on the second transmission line adjust the phase and amplitude of an intermodulation distortion in a high-frequency range. A synthesizer synthesizes the signal from the first transmission line and the signal from the second transmission line.

Abstract: A high frequency module improved in heat dissipation performance includes: a dielectric multilayer substrate including a ground layer and a high frequency electronic component mounted thereon while being in contact with the ground layer, the high frequency electronic component including a heat generating portion; and a cutoff block formed of an upstanding wall portion and a cover portion covering the upstanding wall portion, the cutoff block housing the high frequency electronic component and including a hollow portion having a cutoff characteristic at a frequency of a high frequency signal used by the high frequency electronic component, and the upstanding wall portion of the cutoff block being in contact with the ground layer of the dielectric multilayer substrate.

Abstract: A coaxial microstrip line conversion circuit includes: a waveguide including first and second through holes, spaced apart from each other, the second through hole having a dimension to cut off a used frequency; a coaxial connector including a central conductor including a projection projecting from an axial end of an outer conductor; and a microstrip line including a ground conductor provided on one surface of an insulating substrate, and a strip line provided on the other surface of the insulating substrate and including a projection projecting axially from the ground conductor. The outer conductor is connected to an outer wall of the waveguide. The projection of the central conductor is inserted through the first through hole into the waveguide, the ground conductor is connected to an inner wall of the second through hole, and the projection of the strip line is inserted through the second through hole into the waveguide.

Abstract: A distortion compensation circuit includes a low-pass circuit to block the passage of two-wave RF signals and intermodulation distortions and to allow the passage of a difference-frequency signal. The low-pass circuit is connected between a signal path and an intermodulation distortion adjustment circuit.

Abstract: An in-line waveguide divider divides power of an incoming high-frequency signal among openings. Amplification boards disposed on a base are provided for respective openings and are each connected in parallel with one another to the in-line waveguide divider. An in-line waveguide combiner includes openings formed correspondingly to the amplification boards, and is connected to the amplification boards. An electrically conductive amplifier cover includes walls formed to provide isolation between circuits of the amplification boards continuously from the in-line waveguide divider to the in-line waveguide combiner, and the entire surface of the amplification boards at the in-line waveguide combiner side is covered with the electrically conductive amplifier cover except openings and openings. Each of the amplification boards includes a waveguide-to-microstrip transition corresponding to the opening, an amplifier element, and a microstrip-to-waveguide transition corresponding to the opening.

Abstract: In order to obtain an electromagnetic transmission device and an electromagnetic transmission system that emit high-power continuous microwaves stably onto a material or an irradiation target in electromagnetic heating systems and electromagnetic power transmission systems that are required to emit electromagnetic waves such as high-power microwaves, the electromagnetic transmission device, the power amplification device, and the electromagnetic transmission system emit, onto an irradiation target, electromagnetic waves that are modulated by a repeating pulse with a predetermined transmission duty cycle, or electromagnetic waves that are modulated by a repeating pulse with a predetermined transmission duty cycle and are amplified.

Abstract: A high frequency module improved in heat dissipation performance includes: a dielectric multilayer substrate including a ground layer and a high frequency electronic component mounted thereon while being in contact with the ground layer, the high frequency electronic component including a heat generating portion; and a cutoff block formed of an upstanding wall portion and a cover portion covering the upstanding wall portion, the cutoff block housing the high frequency electronic component and including a hollow portion having a cutoff characteristic at a frequency of a high frequency signal used by the high frequency electronic component, and the upstanding wall portion of the cutoff block being in contact with the ground layer of the dielectric multilayer substrate.