Patents by Inventor Jun Oh

Jun Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080255181
    Abstract: The present invention relates to methods for treating or preventing podocyte-related diseases and disorders using compounds that modulate the calcium sensing receptor or pharmaceutical compositions comprising thereof.
    Type: Application
    Filed: December 14, 2007
    Publication date: October 16, 2008
    Applicant: University of Heidelberg
    Inventors: Jun Oh, Claus P. Schmitt
  • Publication number: 20070240303
    Abstract: Disclosed herein is a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon. Also, a method of manufacturing the printed circuit board including embedded capacitors is provided.
    Type: Application
    Filed: February 2, 2007
    Publication date: October 18, 2007
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Kim, Min Kim, Jun Oh, Tae Kim
  • Publication number: 20070125574
    Abstract: The present invention is related to a printed circuit board having embedded capacitors using a hybrid material and a method of manufacturing the same. This invention provides a printed circuit board having embedded capacitors using a material for a hybrid dielectric layer including liquid crystal polymer and ceramic powder, and a method of manufacturing such a printed circuit board.
    Type: Application
    Filed: February 7, 2007
    Publication date: June 7, 2007
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Kim, Jun Oh, Jin Kim
  • Publication number: 20060246284
    Abstract: The present invention is related to a fabric reinforcement using a modified cyclic olefin copolymer and a resin substrate for a printed circuit board. Specifically, the current invention provides a fabric reinforcement using a modified cyclic olefin copolymer, which is prepared from filaments obtained by melting the modified cyclic olefin copolymer including a cyclic olefin copolymer backbone grafted with a monomer having at least one unsaturated carboxylic group, and a resin substrate for a printed circuit board.
    Type: Application
    Filed: February 15, 2006
    Publication date: November 2, 2006
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jun Oh, Cheol Choi, Tae Kim
  • Publication number: 20060243479
    Abstract: The present invention is related to a printed circuit board having embedded capacitors using a hybrid material and a method of manufacturing the same. This invention provides a printed circuit board having embedded capacitors using a material for a hybrid dielectric layer including liquid crystal polymer and ceramic powder, and a method of manufacturing such a printed circuit board.
    Type: Application
    Filed: February 22, 2006
    Publication date: November 2, 2006
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Kim, Jun Oh, Jin Kim
  • Publication number: 20060032666
    Abstract: Disclosed herein is a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon. Also, a method of manufacturing the printed circuit board including embedded capacitors is provided.
    Type: Application
    Filed: January 6, 2005
    Publication date: February 16, 2006
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Kim, Min Kim, Jun Oh, Tae Kim
  • Publication number: 20050156761
    Abstract: A CAVLC decoding method and apparatus is provided. In the method for decoding a coded bitstream using a CAVLC length table and a CAVLC value table, CAVLC length tables are re-sorted in an order of a codeword length and the coded bitstream is decoded using the re-sorted length table. Therefore, since data on a bitstream is sequentially read as much as a length suggested by the re-sorted table of the present invention, a memory access time is reduced and calculation complexity for comparing the CAVLC codewords is reduced.
    Type: Application
    Filed: December 17, 2004
    Publication date: July 21, 2005
    Inventor: Jun Oh
  • Publication number: 20050152455
    Abstract: Disclosed is a management apparatus and method of 32-bit double VLD buffers capable of reading a bitstream for video decoding in a digital TV receiver in a predetermined bit data unit length. Particularly, the first VLD buffer is used for directly storing an input stream in bytes, and the second VLD buffer is used for reading and storing the bitstream from the first VLD buffer, reading the bitstream with the required bit length of the VLD by bit unit, and outputting it to the VLD. As a result, 32-bit data can be processed at once. In addition, the double VLD buffer structure also reduces the number of accesses to the VLD buffer and thus, the repetitive memory access procedure can be simplified for the VLD.
    Type: Application
    Filed: January 7, 2005
    Publication date: July 14, 2005
    Inventor: Jun Oh