Abstract: A printed circuit board assembly includes a first printed circuit board, a second printed circuit board, and a space holding member. The second printed circuit board includes a first rigid substrate region, spaced apart from and opposed to the first printed circuit board, and a flexible substrate region, extended from one side of the first rigid substrate region to be connected to the first printed circuit board. The space holding member includes a first member, disposed between the first printed circuit board and the second printed circuit board to maintain a space therebetween, and a second member configured to fix the first printed circuit board or the second printed circuit board on the first member.

Abstract: A printed circuit board assembly includes a first printed circuit board, a second printed circuit board, and a space holding member. The second printed circuit board includes a first rigid substrate region, spaced apart from and opposed to the first printed circuit board, and a flexible substrate region, extended from one side of the first rigid substrate region to be connected to the first printed circuit board. The space holding member includes a first member, disposed between the first printed circuit board and the second printed circuit board to maintain a space therebetween, and a second member configured to fix the first printed circuit board or the second printed circuit board on the first member.

Abstract: A package structure and a method of manufacturing the package structure are disclosed. The package structure in accordance with an aspect of the present invention includes: a stiffener substrate; a dielectric layer and a circuit pattern layer laminated on the stiffener substrate; a protective layer laminated on the dielectric layer so as to protect the circuit pattern layer; a first electrode post protruded by penetrating the protective layer from the circuit pattern layer; and a chip receiving portion formed on a surface of the protective layer that is in a protruded direction of the first electrode post.

Abstract: A package substrate and a method for manufacturing the same are disclosed. The method for manufacturing a package substrate in accordance with an aspect of the present invention includes: forming a first open hole corresponding to a shape of a bonding pad in a first photo resist; laminating a second photo resist on the first photo resist and forming a second open hole corresponding to shapes of a soldering pad, a circuit pattern layer and the bonding pad in the second photo resist; and forming a pattern plating layer up to a predetermined height in the first open hole and the second open hole.

Abstract: A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.

Abstract: A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.

Abstract: A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.

Abstract: The invention provides a conductive paste including a carbon nanotube and a printed circuit board using the same. The invention provides the conductive paste which exhibits an excellent electrical conductivity and allows the implementation of the X-Y interconnection and simultaneously the Z-interconnection without loosing the carbon nanotube's own original characteristics.

Abstract: A conductive paste and a printed circuit board using the conductive paste are disclosed. The conductive paste including conductive particles and carbon nanotubes according to the invention, can improve an electrical conductivity of the conductive paste.

Abstract: A heat-releasing PCB and a method of manufacturing the PCB are disclosed. The method of manufacturing the heat-releasing printed circuit board includes: preparing a copper clad laminate, which has at least one copper layer stacked on at least one insulation layer; forming a coating layer, made from a paste having carbon nanotubes as a major constituent, on a surface of the copper layer; and forming a circuit pattern by removing portions of the coating layer and portions of the copper layer.