Patents by Inventor Jun Otani

Jun Otani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7829202
    Abstract: A large-heat-input butt-welded joint of welded structures prepared by butt-welding high-strength steel plates over 50 mm in thickness, having excellent brittle fracture resistance, is characterized by: (a1) the hardness of the weld metal is not more than 110% of the hardness of the base metal or (a2) the hardness of the weld metal is not less than 70% and not more than 110% of the hardness of the base metal, and, as required, (b) the width of the weld metal is not more than 70% of the plate thickness of the base metal, (c) the width of the region affected by welding whose hardness is softened to not more than 95% of the hardness of the non-heat-affected base metal has a width not less than 5 mm, and/or (d) the prior austenite grain size in the heat-affected zone (HAZ) contacting the welding fusion line is not more than 200 ?m.
    Type: Grant
    Filed: October 22, 2004
    Date of Patent: November 9, 2010
    Assignee: Nippon Steel Corporation
    Inventors: Tadashi Ishikawa, Takehiro Inoue, Hiroshi Shimanuki, Tadashi Koseki, Jun Otani, Masanori Minagawa, Akihiko Kojima
  • Patent number: 7652912
    Abstract: A nonvolatile semiconductor memory device includes a free layer having first and second magnetic layers magnetized oppositely to each other, and also having a first nonmagnetic layer formed between the first and second magnetic layers, a first fixed layer having a fixed magnetization direction, a second nonmagnetic layer formed between the second magnetic layer and the first fixed layer, a first drive circuit passing a write current through a first write current line in a data write operation, and thereby generating a data write magnetic field acting on magnetization of the free layer, and a second drive circuit passing a spin injection current between the first magnetic layer and the first fixed layer in a data write operation, and thereby exerting a force in the same direction as or in the direction opposite to the magnetization direction of the first fixed layer on the magnetization of the free layer.
    Type: Grant
    Filed: September 14, 2006
    Date of Patent: January 26, 2010
    Assignee: Renesas Technology Corp.
    Inventors: Tomoya Kawagoe, Jun Otani, Hideto Hidaka
  • Publication number: 20070181223
    Abstract: The present invention provides a high-strength thick steel plate having a plate thickness of 50 to 80 mm and a tensile strength of 490 to 570 MPa which is able to realize an excellent HAZ toughness even when welding with a heat input of 20 to 100 kJ/mm is conducted and is characterized by containing, by wt %, 0.03-0.14% of C, 0.30% or less of Si, 0.8-2.0% of Mn, 0.02% or less of P, 0.005% or less of S, 0.8-4.0% of Ni, 0.003-0.040% of Nb, 0.001-0.040% of Al, 0.0010-0.0100% of N, and 0.005-0.030% of Ti, where Ni and Mn satisfy equation [1], and the balance of iron and unavoidable impurities: Ni/Mn?10×Ceq?3 (0.36<Ceq<0.
    Type: Application
    Filed: April 6, 2005
    Publication date: August 9, 2007
    Inventors: Minoru Ito, Akihiko Kojima, Masanori Minagawa, Yoichi Tanaka, Toshiei Hasegawa, Jun Otani
  • Publication number: 20070131316
    Abstract: A large-heat-input butt-welded joint of welded structures prepared by butt-welding high-strength steel plates over 50 mm in thickness, having excellent brittle fracture resistance, is characterized by: (a1) the hardness of the weld metal is not more than 110% of the hardness of the base metal or (a2) the hardness of the weld metal is not less than 70% and not more than 110% of the hardness of the base metal, and, as required, (b) the width of the weld metal is not more than 70% of the plate thickness of the base metal, (c) the width of the region affected by welding whose hardness is softened to not more than 95% of the hardness of the non-heat-affected base metal has a width not less than 5 mm, and/or (d) the prior austenite grain size in the heat-affected zone (HAZ) contacting the welding fusion line is not more than 200 ?m.
    Type: Application
    Filed: October 22, 2004
    Publication date: June 14, 2007
    Inventors: Tadashi Ishikawa, Takehiro Inoue, Hiroshi Shimanuki, Tadashi Koseki, Jun Otani, Masanori Minagawa, Akihiko Kojima
  • Publication number: 20070064472
    Abstract: A nonvolatile semiconductor memory device includes a free layer having first and second magnetic layers magnetized oppositely to each other, and also having a first nonmagnetic layer formed between the first and second magnetic layers, a first fixed layer having a fixed magnetization direction, a second nonmagnetic layer formed between the second magnetic layer and the first fixed layer, a first drive circuit passing a write current through a first write current line in a data write operation, and thereby generating a data write magnetic field acting on magnetization of the free layer, and a second drive circuit passing a spin injection current between the first magnetic layer and the first fixed layer in a data write operation, and thereby exerting a force in the same direction as or in the direction opposite to the magnetization direction of the first fixed layer on the magnetization of the free layer.
    Type: Application
    Filed: September 14, 2006
    Publication date: March 22, 2007
    Inventors: Tomoya Kawagoe, Jun Otani, Hideto Hidaka