Patents by Inventor Jun-Qi Kao

Jun-Qi Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silicone-modified dicyclopentadiene-derived hydroxy aromatic compound, manufacturing method thereof, and curable product
    Patent number: 11795319
    Abstract: The present disclosure provides a silicone-modified dicyclopentadiene-derived hydroxy aromatic compound, which includes a structure represented by formula (I). Formula (I) is defined as in the specification. The present disclosure further provides a manufacturing method for a silicone-modified dicyclopentadiene-derived hydroxy aromatic compound and a curable product, wherein the curable product is obtained by mixing the silicone-modified dicyclopentadiene-derived hydroxy aromatic compound and a modified polyphenylene oxide resin, and then adding a peroxide to perform a curing reaction.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: October 24, 2023
    Assignee: Swancor Highpolymer Co., Ltd.
    Inventors: Jun-Qi Kao, Meng-Wei Wang
  • SILICONE-MODIFIED DICYCLOPENTADIENE-DERIVED HYDROXY AROMATIC COMPOUND, MANUFACTURING METHOD THEREOF, AND CURABLE PRODUCT
    Publication number: 20220098399
    Abstract: The present disclosure provides a silicone-modified dicyclopentadiene-derived hydroxy aromatic compound, which includes a structure represented by formula (I). Formula (I) is defined as in the specification. The present disclosure further provides a manufacturing method for a silicone-modified dicyclopentadiene-derived hydroxy aromatic compound and a curable product, wherein the curable product is obtained by mixing the silicone-modified dicyclopentadiene-derived hydroxy aromatic compound and a modified polyphenylene oxide resin, and then adding a peroxide to perform a curing reaction.
    Type: Application
    Filed: September 28, 2021
    Publication date: March 31, 2022
    Inventors: Jun-Qi Kao, Meng-Wei Wang