Abstract: A structure for a heat-dissipating device includes a radiator, a heat dissipating plate and a fan. The radiator has plurality of radiating fins, flow passages are formed between these radiating fins which are divided into middle part and two-side parts. The lower ends of the radiating fins in two-side parts each provides at least one passageway which is connected to some of the flow passages. A heat dissipating plate includes two opposing sides which provide notches relative to the passageway of the radiator respectively. The radiator is set on the heat dissipating plate which can be set on the heat-generating component. A fan is disposed over the radiator. The structure can channel partial airflow generated by the driving fans off the radiator with the two-side flow passages and the passageway of the radiator to flow to the other heat-generating components.

Abstract: A heat-radiating device assembly includes at least a radiator including a base, a plurality of radiating fins, and two heat pipes. The radiating fins are aligned in parallel on the top surface of the base and two opposite and large area radiating surfaces are provided thereon, each of the upper side of the radiating surfaces is provided with two through holes. The two heat pipes are connected and mounted between the through holes of the radiating fins and the base, the lower surface of the base is attached with the top surface of an electronic element to radiate heat therefrom, wherein one lateral edge of the radiating surfaces of the radiating fins is generally arc shaped, V-shaped in the disclosed embodiment, with two raised outward upper and lower ends and a depressed inward center.