Patents by Inventor Jun-Qiang Wei

Jun-Qiang Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11947634
    Abstract: An image object classification method and system are disclosed. The method is executed by a processor coupled to a memory. The method includes: providing an image file including at least one image object, performing a process of extracting multiple binary-classified characteristics on the image object to obtain a plurality of first results independent of each other in categories, combining the plurality of first results in a manner of dimensionality reduction based on concatenation, performing a process of characteristics abstraction on the combined first results to obtain a second result, and performing a process of characteristics integration on the plurality of first results and the second result in a manner of dot product of matrices to obtain a classification result.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: April 2, 2024
    Assignee: Footprintku Inc.
    Inventors: Yan-Jhih Wang, Kuan-Hsiang Tseng, Jun-Qiang Wei, Shih-Feng Huang, Tzung-Pei Hong, Yi-Ting Chen
  • Publication number: 20230067231
    Abstract: An image object classification method and system are disclosed. The method is executed by a processor coupled to a memory. The method includes: providing an image file including at least one image object, performing a process of extracting multiple binary-classified characteristics on the image object to obtain a plurality of first results independent of each other in categories, combining the plurality of first results in a manner of dimensionality reduction based on concatenation, performing a process of characteristics abstraction on the combined first results to obtain a second result, and performing a process of characteristics integration on the plurality of first results and the second result in a manner of dot product of matrices to obtain a classification result.
    Type: Application
    Filed: September 1, 2021
    Publication date: March 2, 2023
    Inventors: Yan-Jhih WANG, Kuan-Hsiang TSENG, Jun-Qiang WEI, Shih-Feng HUANG, Tzung-Pei HONG, Yi-Ting CHEN
  • Publication number: 20230051313
    Abstract: A method for analyzing a specification parameter of an electronic component includes inputting a package type and at least one engineering drawing image of an electronic component; acquiring a probability value that in each view of the different viewing directions each of the plurality of specification parameter of the electronic component is labeled; taking the view of each of the plurality of specification parameters in the view direction with a highest probability value as a recommended view; performing a box selection on the plurality of specification parameters for at least one engineering drawing image with the same viewing direction as that of the recommended view by an object detection model; and identifying box-selected specification parameters to acquire a size value of identified specification parameters from the at least one engineering drawing image, and converting the size value into a corresponding editable text for output.
    Type: Application
    Filed: August 11, 2021
    Publication date: February 16, 2023
    Inventors: YAN-JHIH WANG, KUN-YOU LIN, JUN-QIANG WEI, WEI-CHI CHENG, YI-TING CHEN
  • Patent number: 10339263
    Abstract: An electronic component footprint verification system and a method thereof are provided in the present disclosure. The system is available to an external user for selecting an electronic component footprint to be verified, reading a verification rule checklist in an external database, extracting characteristics of the electronic component footprint, accessing characteristic data from the electronic component footprint, verifying the characteristic data based on the verification rule checklist, and displaying a verification result.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: July 2, 2019
    Assignee: Footprintku Inc.
    Inventors: Yu-Siang Fan Jiang, Mong-Fong Fan Horng, Yan-Jhih Wang, Jun-Qiang Wei, Yi-Ting Chen
  • Publication number: 20190050518
    Abstract: An electronic component footprint verification system and a method thereof are provided in the present disclosure. The system is available to an external user for selecting an electronic component footprint to be verified, reading a verification rule checklist in an external database, extracting characteristics of the electronic component footprint, accessing characteristic data from the electronic component footprint, verifying the characteristic data based on the verification rule checklist, and displaying a verification result.
    Type: Application
    Filed: August 8, 2017
    Publication date: February 14, 2019
    Applicant: FootPrintKu Inc.
    Inventors: Yu-Siang Fan Jiang, Mong-Fong Fan Horng, Yan-Jhih Wang, Jun-Qiang Wei, Yi-Ting Chen