Abstract: An LED tube lamp, comprising: a lamp tube; a first circuit board, disposed in the lamp tube, having a plurality of light sources mounted thereon; two lamp caps disposed at respective ends of the lamp tube; and a power supply substantially disposed in one or both of the two lamp caps, the power supply having a second circuit board, the second circuit board is electrically connected to the first circuit board. The lamp cap includes a body and an insulating portion, the insulating portion constitutes at least a part of an end of the lamp cap, the insulating portion has an inner side surface, and a slot is set on the inner side surface, the second circuit board is inserted into the slot for fastening.

Abstract: An LED tube lamp, comprising: a lamp tube; a first circuit board, disposed in the lamp tube, having a plurality of light sources mounted thereon; two lamp caps disposed at respective ends of the lamp tube; a power supply substantially disposed in one or both of the two lamp caps, the power supply having a second circuit board; and a connection structure having a third circuit board, the third circuit board for connecting the first circuit board to the second circuit board thereby connecting the light sources to the power supply.

Abstract: An LED tube lamp, comprising: a lamp tube; a first circuit board, disposed in the lamp tube, having a plurality of light sources mounted thereon; two lamp caps disposed at respective ends of the lamp tube; and a power supply substantially disposed in one or both of the two lamp caps, the power supply having a second circuit board, the second circuit board is electrically connected to the first circuit board. The lamp cap includes a body and an insulating portion, the insulating portion constitutes at least a part of an end of the lamp cap, the insulating portion has an inner side surface, and a slot is set on the inner side surface, the second circuit board is inserted into the slot for fastening.

Abstract: An LED tube lamp comprises a lamp tube, a first circuit board disposed in the lamp tube having a plurality of light sources mounted thereon, and two lamp caps respectively disposed at both ends of the lamp tube and having a power supply disposed in the lamp caps. The power supply has a second circuit board with a first surface and a second surface opposite and parallel to each other. The lamp cap comprises a side wall, an end wall, and a slot with a first rib. There is a coupling structure protruded on the first rib with respect to the first surface of the second circuit board.

Abstract: An LED tube lamp, comprising: a lamp tube; a first circuit board, disposed in the lamp tube, having a plurality of light sources mounted thereon; two lamp caps disposed at respective ends of the lamp tube; a power supply substantially disposed in one or both of the two lamp caps, the power supply having a second circuit board; and a connection structure having a third circuit board, the third circuit board for connecting the first circuit board to the second circuit board thereby connecting the light sources to the power supply.

Abstract: An LED tube lamp comprises a lamp tube, a first circuit board disposed in the lamp tube having a plurality of light sources mounted thereon, and two lamp caps respectively disposed at both ends of the lamp tube and having a power supply disposed in the lamp caps. The power supply has a second circuit board with a first surface and a second surface opposite and parallel to each other. The lamp cap comprises a side wall, an end wall, and a slot with a first rib. There is a coupling structure protruded on the first rib with respect to the first surface of the second circuit board.

Abstract: A monitoring system applied to a shaping machine having a high speed electricity meter. The monitoring system includes a current obtaining device and an analyzing device. The current obtaining device is coupled to the high speed electricity meter to obtain a plurality of current signals from the operated shaping machine and in respond to the shaping machine executes a machining program, the current obtaining device extracts current variation data from the current signals. The machining program corresponds to a piece of the current variation data. The piece of the current variation datum comprises a maximum current and an occurring time that the maximum current being recorded. The analyzing device is configured to calculate a gap, based on the maximum currents and the occurring times corresponding to at least two successive machining programs. In respond to the gap time exceeding a predetermined threshold, the analyzing device generates a warning signal.

Abstract: A data collecting system includes a management server, a number of data collecting chains. Each data collecting chain includes a computer connected to the management server, at least one sensor and a data acquisition (DAQ), coupled to the sensor(s) and connected to the computer through RS485, configured to acquire sensing data from the sensor(s) and transmit the sensing data to the computer. The DAQs are connected to the computers through a wireless backup transmission interface. The management server sends a first confirmation signal to the computers. When at least one of the computers does not respond to the first confirmation signal, the management server indicates the computers which have responded to the first confirmation signal to receive the sensing data from the DAQ(s) corresponding to the computer(s) which doesn't respond to the first confirmation signal through the wireless backup transmission interface.

Abstract: A monitoring system applied to a shaping machine having a high speed electricity meter. The monitoring system includes a current obtaining device and an analyzing device. The current obtaining device is coupled to the high speed electricity meter to obtain a plurality of current signals from the operated shaping machine and in respond to the shaping machine executes a machining program, the current obtaining device extracts current variation data from the current signals. The machining program corresponds to a piece of the current variation data. The piece of the current variation datum comprises a maximum current and an occurring time that the maximum current being recorded. The analyzing device is configured to calculate a gap, based on the maximum currents and the occurring times corresponding to at least two successive machining programs. In respond to the gap time exceeding a predetermined threshold, the analyzing device generates a warning signal.

Abstract: An evaluation system applied on shaping machine, in which the shaping machine has a controller and an electricity meter. The evaluation system includes a parameter obtaining device and an evaluation device. The parameter obtaining device communicatively coupled to the controller and the electricity meter. The parameter obtaining device is configured to obtain a plurality of parameter data regarding a machining program from the controller and the electricity meter. The evaluation device is electrically coupled to the parameter obtaining device, the evaluation device configured to transform the parameter data into numerical parameters to extract a bolster plate position value and a motor current value, multiply the bolster plate position value and the motor current value with weights and sum up the weighted bolster plate position value and the weighted motor current value as an evaluation score.

Abstract: A adjustment system for machining parameter includes a storage device and a processor. The processor includes a mapping module and a prediction module. The mapping module determines a type of a tool under test. When the type of the tool under test is determined as the same as the type of the first cutting tool, the mapping module obtains the first machining data from the database and as it as a reference data of the tool under test. When a machining program related to at least one of the NC program blocks is going to be executed for the tool under test, the prediction module predicts a predicted capacity loss value of the tool under test at a predetermined PRM while executing the machining program.

Abstract: A diagnostic device includes a data obtaining module and an analyzing module. The data obtaining module is configured to obtain a NC program block and receive condition data of an external device corresponds to the NC program block at the same time when the external device performs a NC program. The NC program block is a NC code of the NC program, the external device comprises a plurality of peripheral equipments, and the NC program block corresponds to at least one peripheral equipment of the peripheral equipments. If the condition data is abnormal, the analyzing module is configured to determine the at least one peripheral equipment of the peripheral equipments is abnormal based on the NC program block corresponding to the condition data which is abnormal.

Abstract: An electricity consumption predicting system includes a knowledge database, a decomposition module, a mapping module and a predicting module. The knowledge database stores model information. The module information records a corresponding relation between each of a plurality of NC program blocks and an electricity consumption value thereof. The decomposition module decomposes a processing program into the NC program blocks, and acquires processing information corresponding to the each of the NC program blocks. The mapping module generates a predictive block electricity consumption value of the each of the NC program blocks according to the NC program blocks, the corresponding processing information and the model information. The predicting module sums up the predictive block electricity consumption values corresponding to the NC program blocks to generate a predictive processing program electricity consumption value.

Abstract: The present disclosure provides a method for measuring lens contamination in a lithography apparatus. The method includes imaging an asymmetric pattern utilizing a lens system and measuring an alignment offset of the asymmetric pattern associated with the lens system. A contamination of the lens system is determined by comparing the alignment offset to a reference value.

Abstract: The present disclosure provides a method for measuring lens contamination in a lithography apparatus. The method includes imaging an asymmetric pattern utilizing a lens system and measuring an alignment offset of the asymmetric pattern associated with the lens system. A contamination of the lens system is determined by comparing the alignment offset to a reference value.

Abstract: A method for fabricating a bond pad structure in an integrated circuit is provided. In one embodiment, a bond pad is formed above a substrate. A first passivation layer is deposited above the bond pad, the first passivation having an opening therein exposing a portion of the bond pad. A conductive layer is deposited over the first passivation layer and the exposed bond pad. The conductive layer is patterned to expose portions of the first passivation layer. A second passivation layer is deposited above the conductive layer and the exposed first passivation layer, the second passivation layer having an opening therein exposing a portion of the conductive layer. An electrical contact is bonded to the exposed portion of the conductive layer.