Abstract: An apparatus includes first and second chip bonders. The first chip bonder includes a first holder, a first shaft, a first driver driving the first shaft, and a first pressure sensor detecting a first pressure at which the first driver presses a chip against a bonding target. The second chip bonder includes a second holder, a second shaft, a second driver driving the second shaft, and a second pressure sensor detecting a second pressure at which the second driver presses the chip against the bonding target. A storage stores a first set value of the first pressure and a second set value of the second pressure. A controller controls the first chip bonder to set the first pressure to be the first set value and controls the second chip bonder to set the second pressure to be the second set value.

Abstract: A semiconductor device includes a first semiconductor chip having a first surface, a second surface on a side of the first semiconductor chip opposite to that of the first surface, a first electrode on the first surface, a second electrode on the second surface, and a first contact electrically connecting the first electrode and the second electrode, and a second semiconductor chip having a third surface facing the first surface, a fourth surface on a side of the second semiconductor chip opposite to that of the third surface and a third electrode on the fourth surface. The semiconductor device further includes a metal wire electrically connecting the first and third electrodes, a first insulating layer on the second surface, a first conductive layer that is on the first insulating layer and electrically connected to the second electrode, and a first external terminal electrically connected to the first conductive layer.

Abstract: A semiconductor device includes a first semiconductor chip having a first surface, a second surface on a side of the first semiconductor chip opposite to that of the first surface, a first electrode on the first surface, a second electrode on the second surface, and a first contact electrically connecting the first electrode and the second electrode, and a second semiconductor chip having a third surface facing the first surface, a fourth surface on a side of the second semiconductor chip opposite to that of the third surface and a third electrode on the fourth surface. The semiconductor device further includes a metal wire electrically connecting the first and third electrodes, a first insulating layer on the second surface, a first conductive layer that is on the first insulating layer and electrically connected to the second electrode, and a first external terminal electrically connected to the first conductive layer.