Abstract: The objective of the present invention is to provide a character control device capable of causing a computer character to perform actions appropriate for a user. In a dialogue generation server 100 according to the present disclosure, an action decision unit 102 decides an action of a computer character on the basis of user information about a user and a response time (a response estimation time) required for a response of a predetermined action for a computer character if the predetermined action from a user character operated by the user in a virtual space provided to a user terminal 200 is received from the user terminal 200. A character control unit 103 causes the decided action of the computer character to be displayed on the user terminal 200.

Abstract: The objective of the present invention is to cause a computer character to perform actions appropriate for a user. In a dialogue generation server 100 of the present disclosure, when a predetermined action for a plurality of computer characters C1 is received from a user character C2 operated by a user in a virtual space, an action decision unit 102 determines a computer character C11 that responds to the predetermined action from among the plurality of computer characters C1, and determines an action of the computer character C11 based on a response estimation time required for the response to the predetermined action. Here, actions include an intervention process for reducing stress on the user related to waiting, such as a gesture, as well as an action such as speaking to another computer character C12. Also, a character control unit 103 causes the decided action of the computer character C11 to be displayed on a user terminal 200 of the user.

Abstract: A circuit device of the present invention includes a wiring board 45, and circuit elements such as semiconductor elements 32 mounted on the wiring board 45. The wiring board 45 includes: a conductive pattern 12, which is a metal core layer; a first insulating layer 14 and a second insulating layer 16 respectively covering an upper surface and a lower surface of the conductive pattern 12; and a first wiring layer 18 and a second wiring layer 20 formed respectively on an upper surface of the first insulating layer 14 and a lower surface of the second insulating layer 16. The conductive pattern 12 is made of rolled metal. With this configuration, the thermal resistance of the conductive pattern 12, which is the metal core, is reduced, and the thermal dissipation of the entire device can be improved.

Abstract: A circuit device of the present invention includes a wiring board 45, and circuit elements such as semiconductor elements 32 mounted on the wiring board 45. The wiring board 45 includes: a conductive pattern 12, which is a metal core layer; a first insulating layer 14 and a second insulating layer 16 respectively covering an upper surface and a lower surface of the conductive pattern 12; and a first wiring layer 18 and a second wiring layer 20 formed respectively on an upper surface of the first insulating layer 14 and a lower surface of the second insulating layer 16. The conductive pattern 12 is made of rolled metal. With this configuration, the thermal resistance of the conductive pattern 12, which is the metal core, is reduced, and the thermal dissipation of the entire device can be improved.

Abstract: A method of manufacturing a circuit device includes the steps of preparing a conductive foil, forming conductive patterns in convex shapes by forming an isolation trench on a surface of the conductive foil, covering the surface of the conductive foil with a resin film so as to form the resin film covering the isolation trench thicker than the resin film covering upper surfaces of the conductive patterns, exposing the upper surfaces of the conductive patterns out of the resin film by removing the resin film, electrically connecting the conductive pattern exposed out of the resin film to a circuit element, forming sealing resin to seal the circuit element, and removing a rear surface of the conductive foil until the conductive patterns are mutually isolated.

Abstract: To make thin a circuit device 10 in which are incorporated a plurality of types of circuit elements 12 that differ in thickness, first conductive patterns, onto which comparatively thin circuit elements 12A are mounted, are formed thickly, and second conductive patterns 11B, onto which comparatively thick second circuit elements 12B are mounted, are formed thinly. Also, fine wiring parts may be formed using the thinly formed second conductive patterns 12B. Thus even in the case where thick circuit elements are incorporated, by affixing such circuit elements onto the thinly formed second conductive patterns 11B, the total thickness can be made thin. Thinning of circuit device 10 as a whole can thus be accomplished.

Abstract: A method of manufacturing a circuit device includes the steps of preparing a conductive foil, forming conductive patterns in convex shapes by forming an isolation trench on a surface of the conductive foil, covering the surface of the conductive foil with a resin film so as to form the resin film covering the isolation trench thicker than the resin film covering upper surfaces of the conductive patterns, exposing the upper surfaces of the conductive patterns out of the resin film by removing the resin film, electrically connecting the conductive pattern exposed out of the resin film to a circuit element, forming sealing resin to seal the circuit element, and removing a rear surface of the conductive foil until the conductive patterns are mutually isolated.

Abstract: A circuit device 10 comprises conductive patterns 11, separated by separation grooves 41, circuit elements 12, affixed onto conductive patterns 11, and an insulating resin 13, covering circuit elements 12 and conductive patterns 11 and filling separation grooves 41 while exposing the rear surfaces of conductive patterns 11. Constricted parts 19 are formed at side surfaces of separation grooves 41. At constricted parts 19, the width of separation grooves 41 is made narrower than at other locations. Thus by making insulating resin 13 adhere closely to constricted parts 19, the adhesion of insulating resin 13 with conductive patterns 11 is improved.

Abstract: A circuit device 10 comprises conductive patterns 11, separated by separation grooves 41, circuit elements 12, affixed onto conductive patterns 11, and an insulating resin 13, covering circuit elements 12 and conductive patterns 11 and filling separation grooves 41 while exposing the rear surfaces of conductive patterns 11. Constricted parts 19 are formed at side surfaces of separation grooves 41. At constricted parts 19, the width of separation grooves 41 is made narrower than at other locations. Thus by making insulating resin 13 adhere closely to constricted parts 19, the adhesion of insulating resin 13 with conductive patterns 11 is improved.

Abstract: To make thin a circuit device 10 in which are incorporated a plurality of types of circuit elements 12 that differ in thickness, first conductive patterns, onto which comparatively thin circuit elements 12A are mounted, are formed thickly, and second conductive patterns 11B, onto which comparatively thick second circuit elements 12B are mounted, are formed thinly. Also, fine wiring parts may be formed using the thinly formed second conductive patterns 12B. Thus even in the case where thick circuit elements are incorporated, by affixing such circuit elements onto the thinly formed second conductive patterns 11B, the total thickness can be made thin. Thinning of circuit device 10 as a whole can thus be accomplished.