Patents by Inventor Jun Sakong

Jun Sakong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11518909
    Abstract: Provided is a composition for forming a silica layer, the composition containing a silicon-containing polymer and a solvent, wherein a silica layer formed of the composition for forming the silica layer satisfies Relation 1. The definition of Relation 1 is as described in the specification. The definition of Relation 1 is the same as described in the specification.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: December 6, 2022
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Kunbae Noh, Taeksoo Kwak, Junyoung Jang, Yoonyoung Koo, Yonggoog Kim, Jingyo Kim, Jin-Hee Bae, Jun Sakong, Jinwoo Seo, Sooyeon Sim, Huichan Yun, Jiho Lee, Kwen-Woo Han, Byeong Gyu Hwang
  • Patent number: 11201052
    Abstract: Disclosed is a composition for forming a silica layer including perhydropolysilazane (PHPS) and a solvent, wherein in an 1H-NMR spectrum of the perhydropolysilazane (PHPS) in CDCl3, when a peak derived from N3SiH1 and N2SiH2 is referred to as Peak 1 and a peak derived from NSiH3 is referred to as Peak 2, a ratio (P1/(P1+P2)) of an area (P1) of Peak 1 relative to a total area (P1+P2) of the Peak 1 and Peak 2 is greater than or equal to 0.77, and when an area from a minimum point between the peaks of Peak 1 and Peak 2 to 4.78 ppm is referred to as a Region B and an area from 4.78 ppm to a minimum point of Peak 1 is referred to as a Region A of the area of Peak 1, a ratio (PA/PB) of an area (PA) of Region A relative to an area (PB) of Region B is greater than or equal to about 1.5.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: December 14, 2021
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Seungwoo Jang, Taeksoo Kwak, Jin-Hee Bae, Hyeonsu Jo, Euihyun Kim, Kunbae Noh, Jun Sakong, Chungheon Lee, Wanhee Lim, Byeonggyu Hwang
  • Publication number: 20200369915
    Abstract: Provided is a composition for forming a silica layer, the composition containing a silicon-containing polymer and a solvent, wherein a silica layer formed of the composition for forming the silica layer satisfies Relation 1. The definition of Relation 1 is as described in the specification. The definition of Relation 1 is the same as described in the specification.
    Type: Application
    Filed: February 13, 2018
    Publication date: November 26, 2020
    Applicant: Samsung SDI Co., Ltd.
    Inventors: Kunbae NOH, Taeksoo KWAK, Junyoung JANG, Yoonyoung KOO, Yonggoog KIM, Jingyo KIM, Jin-Hee BAE, Jun SAKONG, Jinwoo SEO, Sooyeon SIM, Huichan YUN, Jiho LEE, Kwen-Woo HAN, Byeong Gyu HWANG
  • Publication number: 20200365400
    Abstract: Disclosed is a composition for forming a silica layer including perhydropolysilazane (PHPS) and a solvent, wherein in an 1H-NMR spectrum of the perhydropolysilazane (PHPS) in CDCl3, when a peak derived from N3SiH1 and N2SiH2 is referred to as Peak 1 and a peak derived from NSiH3 is referred to as Peak 2, a ratio (P1/(P1+P2)) of an area (P1) of Peak 1 relative to a total area (P1+P2) of the Peak 1 and Peak 2 is greater than or equal to 0.77, and when an area from a minimum point between the peaks of Peak 1 and Peak 2 to 4.78 ppm is referred to as a Region B and an area from 4.78 ppm to a minimum point of Peak 1 is referred to as a Region A of the area of Peak 1, a ratio (PA/PB) of an area (PA) of Region A relative to an area (PB) of Region B is greater than or equal to about 1.5.
    Type: Application
    Filed: May 15, 2020
    Publication date: November 19, 2020
    Applicant: Samsung SDI Co., Ltd.
    Inventors: Seungwoo JANG, Taeksoo KWAK, Jin-Hee BAE, Hyeonsu JO, Euihyun KIM, Kunbae NOH, Jun SAKONG, Chungheon LEE, Wanhee LIM, Byeonggyu HWANG
  • Patent number: 10804095
    Abstract: A composition for forming a silica layer includes a silicon-containing polymer and a solvent, the composition having a SiO2 conversion rate of greater than about 0 and less than or equal to about 15. The SiO2 conversion rate is represented by: SiO2 conversion rate=(a ratio of an area of Si—O to an area of Si—H measured after coating the composition in a thickness of 6700 ? on a bare wafer, and allowing the coated wafer to stand for 24 hours under conditions of a temperature of 85° C. and a relative humidity of 85%)?(a ratio of an area of Si—O to an area of Si—H measured after coating the composition in a thickness of 6700 ? on a bare wafer, and allowing the coated wafer to stand for 2 hours under conditions of a temperature of 85° C. and a relative humidity of 85%).
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: October 13, 2020
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Jin-Hee Bae, Taeksoo Kwak, Byeonggyu Hwang, Kunbae Noh, Jun Sakong, Jinwoo Seo, Junyoung Jang
  • Publication number: 20190189430
    Abstract: A composition for forming a silica layer includes a silicon-containing polymer and a solvent, the composition having a SiO2 conversion rate of greater than about 0 and less than or equal to about 15. The SiO2 conversion rate is represented by: SiO2 conversion rate=(a ratio of an area of Si—O to an area of Si—H measured after coating the composition in a thickness of 6700 ? on a bare wafer, and allowing the coated wafer to stand for 24 hours under conditions of a temperature of 85° C. and a relative humidity of 85%)?(a ratio of an area of Si—O to an area of Si—H measured after coating the composition in a thickness of 6700 ? on a bare wafer, and allowing the coated wafer to stand for 2 hours under conditions of a temperature of 85° C. and a relative humidity of 85%).
    Type: Application
    Filed: October 17, 2018
    Publication date: June 20, 2019
    Applicant: Samsung SDI Co., Ltd.
    Inventors: Jin-Hee BAE, Taeksoo KWAK, Byeonggyu HWANG, Kunbae NOH, Jun SAKONG, Jinwoo SEO, Junyoung JANG
  • Patent number: 10020185
    Abstract: A composition for forming a silica layer including a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 70,000 and a polydispersity index of about 5.0 to about 17.0 and a solvent; a silica layer manufactured using the same; and an electronic device including the silica layer.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: July 10, 2018
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Hui-Chan Yun, Woo-Han Kim, Sang-Ran Koh, Taek-Soo Kwak, Bo-Sun Kim, Jin-Gyo Kim, Yoong-Hee Na, Kun-Bae Noh, Sae-Mi Park, Jin-Hee Bae, Jun Sakong, Eun-Seon Lee, Wan-Hee Lim, Jun-Young Jang, Il Jung, Byeong-Gyu Hwang
  • Publication number: 20160099145
    Abstract: A composition for forming a silica layer including a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 70,000 and a polydispersity index of about 5.0 to about 17.0 and a solvent; a silica layer manufactured using the same; and an electronic device including the silica layer.
    Type: Application
    Filed: May 22, 2015
    Publication date: April 7, 2016
    Inventors: Hui-Chan Yun, Woo-Han Kim, Sang-Ran Koh, Taek-Soo Kwak, Bo-Sun Kim, Jin-Gyo Kim, Yoong-Hee Na, Kun-Bae Noh, Sae-Mi Park, Jin-Hee Bae, Jun Sakong, Eun-Seon Lee, Wan-Hee Lim, Jun-Young Jang, Il Jung, Byeong-Gyu Hwang