Patents by Inventor Jun Sang Hwang

Jun Sang Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240092228
    Abstract: A seat for a vehicle, includes a second row center seat and a second row side seat provided on a partition wall positioned rearward of a driver seat, the second row center seat may move leftward or rightward, and an interval between the seats may be increased in a state in which the second row center seat is moved in a right direction away from the second row side seat, which makes it possible to maximally prevent body contact between a passenger in the second row center seat and a passenger in the second row side seat.
    Type: Application
    Filed: January 20, 2023
    Publication date: March 21, 2024
    Applicants: Hyundai Motor Company, Kia Corporation, Hyundai Transys Inc.
    Inventors: Jung Sang YOU, Yong Chul Kim, Dae Hee Lee, Eun Sue Kim, Jae Hoon Cho, Han Kyung Park, Jae Sung Shin, Hae Dong Kwak, Jun Sik Hwang, Gwon Hwa Bok
  • Publication number: 20240067056
    Abstract: The present disclosure relates to a vehicle rear seat including: a center seat; and side seats located on the left and right of the center seat, wherein, the center seat is capable of protruding by moving the center seat forward with respect to the side seats, and in the state in which the center seat protrudes forward, it is possible to increase an inter-passenger distance so that physical contact between the passenger of the center seat and the passenger of each of the side seats can be prevented as much as possible.
    Type: Application
    Filed: March 6, 2023
    Publication date: February 29, 2024
    Inventors: Jung Sang You, Yong Chul Kim, Dae Hee Lee, Eun Sue Kim, Jae Hoon Cho, Han Kyung Park, Jae Sung Shin, Hae Dong Kwak, Jun Sik Hwang, Gwon Hwa Bok
  • Patent number: 7081675
    Abstract: Provided is an anisotropic conductive adhesive for a fine pitch having a conductive adhesive layer and a nonconductive adhesive layer formed on one surface or both surfaces of the conductive adhesive layer. The anisotropic conductive adhesive for a fine pitch can be used to adhere an integrated circuit, on which a plurality of bumps each having a second height are formed, to a substrate, on which a plurality of electrodes each having a first height are formed keeping predetermined distances from each other, so that the integrated circuit is electrically connected to the electrodes. The anisotropic conductive adhesive includes a nonconductive first adhesive layer and a second adhesive layer. The nonconductive first adhesive layer includes a thermosetting resin and a hardener for hardening the thermosetting resin and has a first thickness of ½– 3/2 of the second height.
    Type: Grant
    Filed: August 16, 2004
    Date of Patent: July 25, 2006
    Assignee: Telephus Inc.
    Inventors: Myung Jin Yim, Jun Sang Hwang
  • Patent number: D1025167
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: April 30, 2024
    Inventors: Han Wool Choi, Jun Hwan Park, Seok Young Youn, Hun Keon Ko, Ho Seong Kang, Hyeon Jeong An, Gyu Jong Hwang, Soo Kyoung Kang, Dong Jin Hyun, Geun Sang Yu
  • Patent number: D1025168
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: April 30, 2024
    Inventors: Han Wool Choi, Jun Hwan Park, Seok Young Youn, Hun Keon Ko, Ho Seong Kang, Hyeon Jeong An, Gyu Jong Hwang, Soo Kyoung Kang, Dong Jin Hyun, Geun Sang Yu