Patents by Inventor Jun Sen

Jun Sen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220112237
    Abstract: The present invention provides a means of raising the solubility of even a slightly soluble amino acid, without needing an expensive peptide or varying the pH. The present invention also provides a composition containing at least two amino acids which are formed into a co-amorphous structure.
    Type: Application
    Filed: December 22, 2021
    Publication date: April 14, 2022
    Applicant: AJINOMOTO CO., INC.
    Inventor: Jun Sen
  • Patent number: 7749902
    Abstract: Provided is a method of manufacturing a semiconductor device using double patterning. The method includes: forming a first material layer pattern having recesses in a first direction on an object layer and a second material layer pattern formed on the first material layer pattern; selectively etching the second material layer pattern and the first material layer pattern in a direction perpendicular to the first direction to form an etching mask; and etching the object layer to form minute patterns.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: July 6, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-chul Kim, Sung-il Cho, Jae-seung Hwang, Jun Sen, Yong-hyun Kwon
  • Publication number: 20080194108
    Abstract: Provided is a method of manufacturing a semiconductor device using double patterning. The method includes: forming a first material layer pattern having recesses in a first direction on an object layer and a second material layer pattern formed on the first material layer pattern; selectively etching the second material layer pattern and the first material layer pattern in a direction perpendicular to the first direction to form an etching mask; and etching the object layer to form minute patterns.
    Type: Application
    Filed: June 5, 2007
    Publication date: August 14, 2008
    Inventors: Hyun-chul Kim, Sung-il Cho, Jae-seung Hwang, Jun Sen, Yong-hyun Kwon