Patents by Inventor Jun Shimormura

Jun Shimormura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
    Patent number: 8411415
    Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: April 2, 2013
    Assignee: Air Water Inc.
    Inventors: Naoto Yoshinaga, Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimormura, Yoshimi Murage, Niro Shiomi, Yoshinobu Kodani, Takaomi Ikeda
  • Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
    Publication number: 20100004356
    Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.
    Type: Application
    Filed: October 12, 2007
    Publication date: January 7, 2010
    Inventors: Naoto Yoshinaga, Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimormura, Yoshimi Murage, Niro Shiomi, Yoshinobu Kodani, Takaomi Ikeda