Abstract: The present invention provides a novel diamine compound capable of producing a polymer which exhibits greatly enhanced mechanical properties and heat resistance while maintaining transparency. A film including a polymer produced using the diamine compound has excellent transparency, heat resistance, mechanical strength and flexibility, and thus can be used in various fields, such as in a device substrate, a display cover substrate, an optical film, an Integrated circuit (IC) package, an adhesive film, a multi-layer flexible printed circuit (FPC), a tape, a touch panel and an optical disc protection film, and the like.

Abstract: The present invention provides a polyimide film which, by having a fluorine structure adopted into a rigid polyamide chain structure, exhibits not only superb heat resistance but also enhanced optical properties. Additionally, the polyimide according to the present invention, by having the particular structure, exhibits excellent transparency, heat-resistance, mechanical strength and flexibility, and thus can be utilized in a variety of functions such as an element substrate, display cover substrate, optical film, integrated circuit (IC) package, adhesive film, multi-layered flexible printed circuit (FPC), tape, touch panel, and protective film for optical disks.

Abstract: The present invention provides a novel diamine compound capable of producing a polymer which exhibits greatly enhanced mechanical properties and heat resistance while maintaining transparency. A film including a polymer produced using the diamine compound has excellent transparency, heat resistance, mechanical strength and flexibility, and thus can be used in various fields, such as in a device substrate, a display cover substrate, an optical film, an Integrated circuit (IC) package, an adhesive film, a multi-layer flexible printed circuit (FPC), a tape, a touch panel and an optical disc protection film, and the like.

Abstract: The present invention provides a polyimide film which, by having a fluorine structure adopted into a rigid polyamide chain structure, exhibits not only superb heat resistance but also enhanced optical properties. Additionally, the polyimide according to the present invention, by having the particular structure, exhibits excellent transparency, heat-resistance, mechanical strength and flexibility, and thus can be utilized in a variety of functions such as an element substrate, display cover substrate, optical film, integrated circuit (IC) package, adhesive film, multi-layered flexible printed circuit (FPC), tape, touch panel, and protective film for optical disks.

Abstract: The present invention provides a polyamide-imide film which maintains transparency and has highly enhanced mechanical properties and heat resistance. The polyamide-imide shows excellent transparency, heat resistance, mechanical strength and flexibility and thus can be used in various fields such as substrates for devices, cover substrates for displays, optical films, integrated circuit (IC) packages, adhesive films, multi-layer flexible printed circuits (FPC), tapes, touch panels and protective films for optical disks.

Abstract: The present invention provides a polyamide-imide, a method for preparing same, and a polyimide film using same. The polyamide-imide film exhibits excellent transparency, heat resistance, mechanical strength and flexibility, and thus may be used in various fields such as substrates for device, cover substrates for displays, optical films, integrated circuit (IC) packages, adhesive films, multi-layer flexible printed circuits (FPCs), tapes, touch panels and protective films for optical discs.

Abstract: Provided in the present invention is a polyamide-imide film having significantly enhanced mechanical physical properties and heat resistance while maintaining transparency. The polyamide-imide has excellent transparency, heat resistance, mechanical strength and flexibility, and thus can be used in a variety of fields including a device substrate, a cover substrate for a display, an optical film, an integrated circuit (IC) package, an adhesive film, a multilayer flexible printed circuit (FPC), a tape, a touch panel, and a protection film for an optical disk.