Patents by Inventor Jun Simizu

Jun Simizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IC package testing device and method for testing IC package using the same
    Patent number: 6445201
    Abstract: Coordinate data for the array pattern of contact pins and coordinate data for the array pattern of solder balls of an IC package is stored by a positioning section of an IC package testing device. The position of a BGA is adjusted so that the contact pins and the solder balls accurately overlap each other. The solder balls of the IC package are abutted on the respective contact pins while the IC package is sucked onto by a suction head. Then, the solder balls are abutted on the respective contact pins with an optimal load while measuring a load applied to the IC package by load cells.
    Type: Grant
    Filed: August 16, 2000
    Date of Patent: September 3, 2002
    Assignee: NEC Machinery Corporation
    Inventors: Jun Simizu, Akio Horimoto