Abstract: The present invention relates to a semiconductor chip bonding apparatus for applying flux to a lower surface of a semiconductor chip on which bumps are formed and bonding the semiconductor chip to a substrate by heating and pressing the flux-applied chip, and to a fume collection method thereof. The invention quickly collects and removes vaporized fume of flux generated during thermocompression bonding, preventing contamination of the semiconductor chip and the bonding tool and preventing fume from entering fine gaps that may cause malfunction of vacuum suction. Even if fume enters the tool passage and chip passage of the heating block and solidifies, it can be liquefied and vaporized, with liquefied fume dropping to the bottom surface in the fume collection unit while vaporized fume is suctioned and removed, enabling quick removal and maintaining the passages in good condition.