Patents by Inventor JUN-SUB SHIN

JUN-SUB SHIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing head for use in chemical mechanical polishing and CMP apparatus having the same
    Patent number: 11654527
    Abstract: The present disclosure is directed to a polishing head for polishing a wafer by a slurry. The polishing head includes a main body and at least two air modules. The main body has a cavity for accommodating the wafer, a main channel, and at least two sub-channels connected to the main channel. The at least two air modules are disposed at an outer surface of the main body. Each of the air modules is respectively connected to one of the sub-channels of the main body and configured to generate an air stream. When the polishing head rotates, the air stream forms an air curtain around the outer surface of the main body.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: May 23, 2023
    Assignee: XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
    Inventor: Jun-Sub Shin
  • POLISHING HEAD FOR USE IN CHEMICAL MECHANICAL POLISHING AND CMP APPARATUS HAVING THE SAME
    Publication number: 20210154795
    Abstract: The present disclosure is directed to a polishing head for polishing a wafer by a slurry. The polishing head includes a main body and at least two air modules. The main body has a cavity for accommodating the wafer, a main channel, and at least two sub-channels connected to the main channel. The at least two air modules are disposed at an outer surface of the main body. Each of the air modules is respectively connected to one of the sub-channels of the main body and configured to generate an air stream. When the polishing head rotates, the air stream forms an air curtain around the outer surface of the main body.
    Type: Application
    Filed: February 11, 2020
    Publication date: May 27, 2021
    Inventor: JUN-SUB SHIN