Patents by Inventor Jun Suk Jung

Jun Suk Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11970493
    Abstract: The present disclosure provides autotaxin (ATX) inhibitor compounds and compositions including said compounds. The present disclosure also provides methods of using said compounds and compositions for inhibiting ATX. Also provided are methods of preparing said compounds and compositions, and synthetic precursors of said compounds.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: April 30, 2024
    Assignee: ILDONG PHARMACEUTICAL CO., LTD.
    Inventors: Sung-Ku Choi, Yoon-Suk Lee, Sung-Wook Kwon, Kyung-Sun Kim, Jeong-Geun Kim, Jeong-Ah Kim, An-Na Moon, Sun-Young Park, Jun-Su Ban, Dong-Keun Song, Kyu-Sic Jang, Ju-Young Jung, Soo-Jin Lee
  • Publication number: 20240105695
    Abstract: A display device includes: a pixel circuit layer including a plurality of transistors; first partition wall and a second partition wall on the pixel circuit layer, each of the first and second partition walls having a shape protruding in a thickness direction; a first electrode and a second electrode on the same layer and respectively on the first partition wall and the second partition wall; a light emitting element between the first electrode and the second electrode; and a semiconductor pattern directly on the first electrode.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 28, 2024
    Inventors: Tae Gyun KIM, Jun Hong PARK, Jun CHUN, Eui Suk JUNG, Hyun Young JUNG
  • Patent number: 11938849
    Abstract: A seat for a vehicle having a fold-and-dive function is proposed. When a seatback is rotated forwards and folded, a seat cushion is moved down, so the fold-and-dive function of the seat is realized. When a full-flat mode is realized by the reclining operation of the seatback, a rear end of the seat cushion is moved up, so a step between the seat cushion and the seatback can be significantly reduced or eliminated. Furthermore, a front link connecting a back cushion interlocking frame and a cushion fixing bracket to perform the fold-and-dive function is installed to have directivity where it is inclined rearwards, thus preventing a submarine phenomenon of the seat in the event of a forward collision.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: March 26, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Mu Young Kim, Sang Do Park, Ho Suk Jung, Jun Young Yun, Jun Hwan Lee, Chan Ho Jung, Hyeok Seung Lee
  • Publication number: 20240092231
    Abstract: A seat for a vehicle in which user convenience may be improved by implementing various postures with a simple configuration is provided. The seat for a vehicle includes a pair of support rails coupled to the vehicle and arranged to be spaced apart from side to side, a first slide unit slidably installed back and forth on the support rail, a second slide unit slidably installed back and forth on the first slide unit, a pair of cushion side frames spaced apart from side to side, a first link member connecting the cushion side frame and the first slide unit, and a second link member connecting the cushion side frame and the second slide unit.
    Type: Application
    Filed: January 4, 2023
    Publication date: March 21, 2024
    Inventors: Mu Young Kim, Sang Do Park, Ho Suk Jung, Han Kyeol Cho, Jun Young Yun, Jun Hwan Lee, Chan Ho Jung, Sang soo Lee
  • Publication number: 20240092237
    Abstract: The present disclosure relates to a vehicle seat wherein matchability with a luggage box is maintained when the seat is folded, and a relax mode and a backward relax mode can be implemented. The vehicle seat according to the present disclosure includes: a tilting link configured to tilt a front portion of a seat cushion upwards/downwards; and a sliding bracket having one end to which a seat is connected by a hinge structure such that the seat is tilted around the hinge structure, the other end of the sliding bracket being connected so as to slide forwards/backwards.
    Type: Application
    Filed: January 20, 2023
    Publication date: March 21, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Mu Young KIM, Sang Do PARK, Ho Suk JUNG, Jun Young YUN, Jun Hwan LEE, Chan Ho JUNG, Hyeok Seung LEE
  • Publication number: 20240083384
    Abstract: A vehicle seat reinforcement device includes a leg portion mounted on a floor panel, a seat cushion frame slidably mounted on the leg portion, and a load reinforcing structure connected between the leg portion and the seat cushion frame, wherein when a seat belt anchorage load is transferred to the seat cushion frame, the seat cushion frame is locked to the leg portion by the load reinforcing structure.
    Type: Application
    Filed: February 3, 2023
    Publication date: March 14, 2024
    Applicants: Hyundai Motor Company, Kia Corporation, Daechang Seat Co.,LTD-Dongtan, Hyundai Transys Inc.
    Inventors: Sang Soo LEE, Chan Ho JUNG, Mu Young KIM, Sang Hark LEE, Ho Suk JUNG, Deok Soo LIM, Sang Do PARK, In Sun BAEK, Sin Chan YANG, Chan Ki CHO, Myung Soo LEE, Jae Yong JANG, Jun Sik HWANG, Ho Sung KANG, Hae Dong KWAK, Hyun Tak KO
  • Publication number: 20240088168
    Abstract: A display device includes: a first substrate; a second substrate on the first substrate and exposing a first edge portion of the first substrate, the second substrate protruding beyond a second edge portion of the first substrate; a connection line on the first edge portion of the first substrate, the connection line having a first end portion protruding beyond a first side of the second substrate and a second end portion covered by the second substrate; and a thin-film transistor layer on the second substrate and connected to the connection line. The thin-film transistor layer includes signal lines extending from the first side to a second side of the second substrate. The signal lines extend into contact openings in the thin-film transistor layer and are exposed at a lower part of the second substrate on the second side of the second substrate.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: Tae Gyun KIM, Jun Hong PARK, Eui Suk JUNG
  • Publication number: 20150318118
    Abstract: In a tantalum capacitor, a bending angle between a positive electrode terminal part of a positive electrode lead frame and a wire connection part connected to a tantalum wire may be set to 87 to 93° to maintain constant a contact area between a non-insertion region of the tantalum wire and an end portion of the wire connection part at the time of welding and adhering the non-insertion region and the end portion to each other.
    Type: Application
    Filed: July 23, 2014
    Publication date: November 5, 2015
    Inventors: Hyoung Sun HAM, Jun Suk JUNG, Jae Hyuk CHOI, Jae Yik HOWANG
  • Patent number: 8780532
    Abstract: There is provided a solid electrolytic capacitor, including: a condenser element including a chip body molded by sintering, a positive electrode terminal contact layer formed on one area of the chip body to be exposed to the outside, an insulating layer formed in the entire area or some area other than one area in which the positive electrode terminal contact layer is formed, and a negative electrode layer stacked on the insulating layer; a negative electrode extracting layer stacked to be electrically connected with the negative electrode layer; a negative electrode terminal stacked on the negative electrode extracting layer; a positive electrode terminal stacked on the positive electrode terminal contact layer.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: July 15, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Kwang Kim, Jun Suk Jung, Chang Sub Song
  • Patent number: 8411417
    Abstract: A solid electrolytic condenser includes a condenser element, an anode wire including one end inserted into the condenser element, a cathode drawing layer formed on outer side of the condenser element, terminal reinforcements arranged respectively under opposite side portions of a bottom surface of the condenser element, a liquid epoxy resin filled in spaces between the terminal reinforcements and between the bottom surface of the condenser element and top surfaces of the terminal reinforcements, a molding part surrounding the condenser element while exposing the other end of the anode wire, an end portion of the cathode drawing layer, and bottom surfaces of the terminal reinforcements, and anode and cathode terminals formed by a plating layer provided on the bottom surfaces of the terminal reinforcements and on opposite side surfaces of the molding part. The liquid epoxy resin includes fillers of a smaller size than those in the molding part.
    Type: Grant
    Filed: April 16, 2010
    Date of Patent: April 2, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Kwang Kim, Kwan Hyeong Kim, Jun Suk Jung, Jae Yik Howang, Chong Hoon Pak, Jae Jun Park
  • Publication number: 20120182668
    Abstract: A solid electrolytic capacitor and manufacturing method, in which an oxidation-resistant coating layer configured to surround the surface of a terminal reinforcing material underlies a capacitor element. The solid electrolytic capacitor includes a capacitor element having a positive polarity internally and having one end to which an anode wire is inserted; a cathode leading-out layer; a pair of terminal reinforcing materials coupled with both bottom sides of the capacitor element; an oxidation resistant coating layer surrounding the surface of the pair of terminal reinforcing materials; a mold part surrounding the outer periphery of the capacitor element, while exposing the other end of the anode wire, the other side of the cathode leading-out layer, and the lower surfaces of the pair of terminal reinforcing materials; and anode and cathode terminals formed on both sides of the mold part and the lower surfaces of the terminal reinforcing materials.
    Type: Application
    Filed: January 17, 2012
    Publication date: July 19, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Kwang KIM, Jun Suk Jung, Chang Sub Song
  • Publication number: 20120120554
    Abstract: There is provided a solid electrolytic capacitor, including: a condenser element including a chip body molded by sintering, a positive electrode terminal contact layer formed on one area of the chip body to be exposed to the outside, an insulating layer formed in the entire area or some area other than one area in which the positive electrode terminal contact layer is formed, and a negative electrode layer stacked on the insulating layer; a negative electrode extracting layer stacked to be electrically connected with the negative electrode layer; a negative electrode terminal stacked on the negative electrode extracting layer; a positive electrode terminal stacked on the positive electrode terminal contact layer.
    Type: Application
    Filed: February 24, 2011
    Publication date: May 17, 2012
    Inventors: Jae Kwang Kim, Jun Suk Jung, Chang Sub Song
  • Publication number: 20110127689
    Abstract: An apparatus for manufacturing an electronic component includes: upper and lower metal molds, at least one of which being formed as a porous member on which an electronic component is mounted, including an internal space for accommodating the electronic component therein; a release film providing unit providing a release film to the internal space of the upper and lower metal molds; and a molding resin providing unit providing a molding resin to the internal space to allow the electronic component to be injection-molded.
    Type: Application
    Filed: April 27, 2010
    Publication date: June 2, 2011
    Inventors: Jae Kwang KIM, Chang Sub Song, Jun Suk Jung
  • Publication number: 20110038102
    Abstract: Disclosed is a solid electrolytic condenser and method for manufacturing the same.
    Type: Application
    Filed: April 16, 2010
    Publication date: February 17, 2011
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Kwang KIM, Kwan Hyeong Kim, Jun Suk Jung, Jae Yik Howang, Chong Hoon Pak, Jae Jun Park