Patents by Inventor Jun Suk Jung
Jun Suk Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11970493Abstract: The present disclosure provides autotaxin (ATX) inhibitor compounds and compositions including said compounds. The present disclosure also provides methods of using said compounds and compositions for inhibiting ATX. Also provided are methods of preparing said compounds and compositions, and synthetic precursors of said compounds.Type: GrantFiled: October 4, 2021Date of Patent: April 30, 2024Assignee: ILDONG PHARMACEUTICAL CO., LTD.Inventors: Sung-Ku Choi, Yoon-Suk Lee, Sung-Wook Kwon, Kyung-Sun Kim, Jeong-Geun Kim, Jeong-Ah Kim, An-Na Moon, Sun-Young Park, Jun-Su Ban, Dong-Keun Song, Kyu-Sic Jang, Ju-Young Jung, Soo-Jin Lee
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Publication number: 20240105695Abstract: A display device includes: a pixel circuit layer including a plurality of transistors; first partition wall and a second partition wall on the pixel circuit layer, each of the first and second partition walls having a shape protruding in a thickness direction; a first electrode and a second electrode on the same layer and respectively on the first partition wall and the second partition wall; a light emitting element between the first electrode and the second electrode; and a semiconductor pattern directly on the first electrode.Type: ApplicationFiled: December 1, 2023Publication date: March 28, 2024Inventors: Tae Gyun KIM, Jun Hong PARK, Jun CHUN, Eui Suk JUNG, Hyun Young JUNG
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Patent number: 11938849Abstract: A seat for a vehicle having a fold-and-dive function is proposed. When a seatback is rotated forwards and folded, a seat cushion is moved down, so the fold-and-dive function of the seat is realized. When a full-flat mode is realized by the reclining operation of the seatback, a rear end of the seat cushion is moved up, so a step between the seat cushion and the seatback can be significantly reduced or eliminated. Furthermore, a front link connecting a back cushion interlocking frame and a cushion fixing bracket to perform the fold-and-dive function is installed to have directivity where it is inclined rearwards, thus preventing a submarine phenomenon of the seat in the event of a forward collision.Type: GrantFiled: November 15, 2021Date of Patent: March 26, 2024Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Mu Young Kim, Sang Do Park, Ho Suk Jung, Jun Young Yun, Jun Hwan Lee, Chan Ho Jung, Hyeok Seung Lee
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Publication number: 20240092231Abstract: A seat for a vehicle in which user convenience may be improved by implementing various postures with a simple configuration is provided. The seat for a vehicle includes a pair of support rails coupled to the vehicle and arranged to be spaced apart from side to side, a first slide unit slidably installed back and forth on the support rail, a second slide unit slidably installed back and forth on the first slide unit, a pair of cushion side frames spaced apart from side to side, a first link member connecting the cushion side frame and the first slide unit, and a second link member connecting the cushion side frame and the second slide unit.Type: ApplicationFiled: January 4, 2023Publication date: March 21, 2024Inventors: Mu Young Kim, Sang Do Park, Ho Suk Jung, Han Kyeol Cho, Jun Young Yun, Jun Hwan Lee, Chan Ho Jung, Sang soo Lee
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Publication number: 20240092237Abstract: The present disclosure relates to a vehicle seat wherein matchability with a luggage box is maintained when the seat is folded, and a relax mode and a backward relax mode can be implemented. The vehicle seat according to the present disclosure includes: a tilting link configured to tilt a front portion of a seat cushion upwards/downwards; and a sliding bracket having one end to which a seat is connected by a hinge structure such that the seat is tilted around the hinge structure, the other end of the sliding bracket being connected so as to slide forwards/backwards.Type: ApplicationFiled: January 20, 2023Publication date: March 21, 2024Applicants: Hyundai Motor Company, Kia CorporationInventors: Mu Young KIM, Sang Do PARK, Ho Suk JUNG, Jun Young YUN, Jun Hwan LEE, Chan Ho JUNG, Hyeok Seung LEE
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Publication number: 20240083384Abstract: A vehicle seat reinforcement device includes a leg portion mounted on a floor panel, a seat cushion frame slidably mounted on the leg portion, and a load reinforcing structure connected between the leg portion and the seat cushion frame, wherein when a seat belt anchorage load is transferred to the seat cushion frame, the seat cushion frame is locked to the leg portion by the load reinforcing structure.Type: ApplicationFiled: February 3, 2023Publication date: March 14, 2024Applicants: Hyundai Motor Company, Kia Corporation, Daechang Seat Co.,LTD-Dongtan, Hyundai Transys Inc.Inventors: Sang Soo LEE, Chan Ho JUNG, Mu Young KIM, Sang Hark LEE, Ho Suk JUNG, Deok Soo LIM, Sang Do PARK, In Sun BAEK, Sin Chan YANG, Chan Ki CHO, Myung Soo LEE, Jae Yong JANG, Jun Sik HWANG, Ho Sung KANG, Hae Dong KWAK, Hyun Tak KO
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Publication number: 20240088168Abstract: A display device includes: a first substrate; a second substrate on the first substrate and exposing a first edge portion of the first substrate, the second substrate protruding beyond a second edge portion of the first substrate; a connection line on the first edge portion of the first substrate, the connection line having a first end portion protruding beyond a first side of the second substrate and a second end portion covered by the second substrate; and a thin-film transistor layer on the second substrate and connected to the connection line. The thin-film transistor layer includes signal lines extending from the first side to a second side of the second substrate. The signal lines extend into contact openings in the thin-film transistor layer and are exposed at a lower part of the second substrate on the second side of the second substrate.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Inventors: Tae Gyun KIM, Jun Hong PARK, Eui Suk JUNG
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Publication number: 20150318118Abstract: In a tantalum capacitor, a bending angle between a positive electrode terminal part of a positive electrode lead frame and a wire connection part connected to a tantalum wire may be set to 87 to 93° to maintain constant a contact area between a non-insertion region of the tantalum wire and an end portion of the wire connection part at the time of welding and adhering the non-insertion region and the end portion to each other.Type: ApplicationFiled: July 23, 2014Publication date: November 5, 2015Inventors: Hyoung Sun HAM, Jun Suk JUNG, Jae Hyuk CHOI, Jae Yik HOWANG
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Patent number: 8780532Abstract: There is provided a solid electrolytic capacitor, including: a condenser element including a chip body molded by sintering, a positive electrode terminal contact layer formed on one area of the chip body to be exposed to the outside, an insulating layer formed in the entire area or some area other than one area in which the positive electrode terminal contact layer is formed, and a negative electrode layer stacked on the insulating layer; a negative electrode extracting layer stacked to be electrically connected with the negative electrode layer; a negative electrode terminal stacked on the negative electrode extracting layer; a positive electrode terminal stacked on the positive electrode terminal contact layer.Type: GrantFiled: February 24, 2011Date of Patent: July 15, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Kwang Kim, Jun Suk Jung, Chang Sub Song
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Patent number: 8411417Abstract: A solid electrolytic condenser includes a condenser element, an anode wire including one end inserted into the condenser element, a cathode drawing layer formed on outer side of the condenser element, terminal reinforcements arranged respectively under opposite side portions of a bottom surface of the condenser element, a liquid epoxy resin filled in spaces between the terminal reinforcements and between the bottom surface of the condenser element and top surfaces of the terminal reinforcements, a molding part surrounding the condenser element while exposing the other end of the anode wire, an end portion of the cathode drawing layer, and bottom surfaces of the terminal reinforcements, and anode and cathode terminals formed by a plating layer provided on the bottom surfaces of the terminal reinforcements and on opposite side surfaces of the molding part. The liquid epoxy resin includes fillers of a smaller size than those in the molding part.Type: GrantFiled: April 16, 2010Date of Patent: April 2, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Kwang Kim, Kwan Hyeong Kim, Jun Suk Jung, Jae Yik Howang, Chong Hoon Pak, Jae Jun Park
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Publication number: 20120182668Abstract: A solid electrolytic capacitor and manufacturing method, in which an oxidation-resistant coating layer configured to surround the surface of a terminal reinforcing material underlies a capacitor element. The solid electrolytic capacitor includes a capacitor element having a positive polarity internally and having one end to which an anode wire is inserted; a cathode leading-out layer; a pair of terminal reinforcing materials coupled with both bottom sides of the capacitor element; an oxidation resistant coating layer surrounding the surface of the pair of terminal reinforcing materials; a mold part surrounding the outer periphery of the capacitor element, while exposing the other end of the anode wire, the other side of the cathode leading-out layer, and the lower surfaces of the pair of terminal reinforcing materials; and anode and cathode terminals formed on both sides of the mold part and the lower surfaces of the terminal reinforcing materials.Type: ApplicationFiled: January 17, 2012Publication date: July 19, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Kwang KIM, Jun Suk Jung, Chang Sub Song
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Publication number: 20120120554Abstract: There is provided a solid electrolytic capacitor, including: a condenser element including a chip body molded by sintering, a positive electrode terminal contact layer formed on one area of the chip body to be exposed to the outside, an insulating layer formed in the entire area or some area other than one area in which the positive electrode terminal contact layer is formed, and a negative electrode layer stacked on the insulating layer; a negative electrode extracting layer stacked to be electrically connected with the negative electrode layer; a negative electrode terminal stacked on the negative electrode extracting layer; a positive electrode terminal stacked on the positive electrode terminal contact layer.Type: ApplicationFiled: February 24, 2011Publication date: May 17, 2012Inventors: Jae Kwang Kim, Jun Suk Jung, Chang Sub Song
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Publication number: 20110127689Abstract: An apparatus for manufacturing an electronic component includes: upper and lower metal molds, at least one of which being formed as a porous member on which an electronic component is mounted, including an internal space for accommodating the electronic component therein; a release film providing unit providing a release film to the internal space of the upper and lower metal molds; and a molding resin providing unit providing a molding resin to the internal space to allow the electronic component to be injection-molded.Type: ApplicationFiled: April 27, 2010Publication date: June 2, 2011Inventors: Jae Kwang KIM, Chang Sub Song, Jun Suk Jung
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Publication number: 20110038102Abstract: Disclosed is a solid electrolytic condenser and method for manufacturing the same.Type: ApplicationFiled: April 16, 2010Publication date: February 17, 2011Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Kwang KIM, Kwan Hyeong Kim, Jun Suk Jung, Jae Yik Howang, Chong Hoon Pak, Jae Jun Park