Abstract: A duty cycle correction circuit includes a duty correction circuit, an information generation circuit and a duty control circuit. The duty correction circuit corrects a duty rate of an input clock signal based on a duty control code to generate an output clock signal. The information generation circuit compares a difference between operation power voltages based on an operation mode to generate voltage information. The duty control circuit receives the voltage information from the information generation circuit and generates the duty control code that includes the voltage information based on a duty rate of the output clock signal.

Abstract: Provided are a semiconductor device and a method for fabricating the same. The semiconductor device includes an active fin protruding upwardly from a substrate and extending in a first direction and a gate structure extending in a second direction intersecting to cross the active fin, where a first width of a lower portion of the gate structure that contacts the active fin is greater than a second width of the lower portion of the gate structure that is spaced apart from the active fin.

Abstract: The present technology relates to an electronic device. A storage device in which a memory device controls an ODT operation to improve operation performance of the memory device with a small number of pins includes a plurality of memory devices comprising a target memory device in which an operation is performed and non-target memory devices, and a memory controller configured to control the plurality of memory devices. Each of the plurality of memory devices includes an on die termination (ODT) flag generator configured to generate a flag that indicates that an ODT operation is possible for the non-target memory devices, and an ODT performer configured to determine whether the ODT operation is an ODT read operation for a read operation or an ODT write operation for a write operation based on the flag and configured to generate an enable signal that enables the ODT read operation or the ODT write operation.

Abstract: A dividing circuit system includes a first dividing circuit and a second dividing circuit. The first dividing circuit performs a reset operation based on a reset control signal and generates second and fourth divided clock signals. The second dividing circuit performs a reset operation based on the reset control signal and generates first and third divided clock signals.

Abstract: The present technology relates to an electronic device. A data transmission circuit that receives data from an outside and transmits the received data, wherein the data transmission circuit includes a storage configured of a plurality of stages that stores the data, and a reset control circuit configured to generate a signal based on the data.

Abstract: A dividing circuit system includes a first dividing circuit and a second dividing circuit. The first dividing circuit performs a reset operation based on a reset control signal and generates second and fourth divided clock signals. The second dividing circuit performs a reset operation based on the reset control signal and generates first and third divided clock signals.

Abstract: Disclosed is a guidewire steering micro-robot. The guidewire steering micro-robot includes a guidewire, and a steering unit provided at an end portion of the guidewire, the steering unit including a magnetic body to control and steer a position of the guidewire by an external magnetic field.

Abstract: The present technology relates to an electronic device. A storage device in which a memory device controls an ODT operation to improve operation performance of the memory device with a small number of pins includes a plurality of memory devices comprising a target memory device in which an operation is performed and non-target memory devices, and a memory controller configured to control the plurality of memory devices. Each of the plurality of memory devices includes an on die termination (ODT) flag generator configured to generate a flag that indicates that an ODT operation is possible for the non-target memory devices, and an ODT performer configured to determine whether the ODT operation is an ODT read operation for a read operation or an ODT write operation for a write operation based on the flag and configured to generate an enable signal that enables the ODT read operation or the ODT write operation.

Abstract: Provided are a semiconductor device and a method for fabricating the same. The semiconductor device includes an active fin protruding upwardly from a substrate and extending in a first direction and a gate structure extending in a second direction intersecting to cross the active fin, where a first width of a lower portion of the gate structure that contacts the active fin is greater than a second width of the lower portion of the gate structure that is spaced apart from the active fin.

Abstract: The present technology relates to an electronic device. A data transmission circuit that receives data from an outside and transmits the received data, wherein the data transmission circuit includes a storage configured of a plurality of stages that stores the data, and a reset control circuit configured to generate a signal based on the data.

Abstract: Provided are a semiconductor device and a method for fabricating the same. The semiconductor device includes an active fin protruding upwardly from a substrate and extending in a first direction and a gate structure extending in a second direction intersecting to cross the active fin, where a first width of a lower portion of the gate structure that contacts the active fin is greater than a second width of the lower portion of the gate structure that is spaced apart from the active fin.

Abstract: Provided are a semiconductor device and a method for fabricating the same. The semiconductor device includes an active fin protruding upwardly from a substrate and extending in a first direction and a gate structure extending in a second direction intersecting to cross the active fin, where a first width of a lower portion of the gate structure that contacts the active fin is greater than a second width of the lower portion of the gate structure that is spaced apart from the active fin.

Abstract: Provided are a semiconductor device and a method for fabricating the same. The semiconductor device includes an active fin protruding upwardly from a substrate and extending in a first direction and a gate structure extending in a second direction intersecting to cross the active fin, where a first width of a lower portion of the gate structure that contacts the active fin is greater than a second width of the lower portion of the gate structure that is spaced apart from the active fin.

Abstract: A semiconductor device includes a plurality of semiconductor chips vertically stacked and electrically coupled to one another through TSVs (Through-Silicon Vias), a plurality of semiconductor elements formed in each of the semiconductor chips, a plurality of nodes suitable for coupling the semiconductor elements to one another, and a node control device suitable for being provided in each of the nodes, deciding whether to couple the node to a communication path based on a temperature of the node, and setting a shortest communication path among the semiconductor elements.

Abstract: A semiconductor device including a first fin pattern and a second fin pattern which have respective short sides facing each other and are separated from each other, a first field insulating layer which is around the first fin pattern and the second fin pattern, a second field insulating layer and a third field insulating layer which are between the first fin pattern and the second fin pattern, a first gate which is formed on the first fin pattern to intersect the first fin pattern, a second gate which is formed on the second field insulating layer, and a third gate which is formed on the third field insulating layer, wherein upper surfaces of the second and third field insulating layers protrude further upward than an upper surface of the first field insulating layer, and a distance between the first gate and the second gate is equal to a distance between the second gate and the third gate.

Abstract: Provided are a semiconductor device and a method for fabricating the same. The semiconductor device includes an active fin protruding upwardly from a substrate and extending in a first direction and a gate structure extending in a second direction intersecting to cross the active fin, where a first width of a lower portion of the gate structure that contacts the active fin is greater than a second width of the lower portion of the gate structure that is spaced apart from the active fin.

Abstract: A semiconductor device includes a plurality of semiconductor chips vertically stacked and electrically coupled to one another through TSVs (Through-Silicon Vias) a plurality of semiconductor elements formed in each of the semiconductor chips, a plurality of nodes suitable for coupling the semiconductor elements to one another, and a node control device suitable for being provided in each of the nodes, deciding whether to couple the node to a communication path based on a temperature of the node, and setting a shortest communication path among the semiconductor elements.

Abstract: A semiconductor device includes an interlayer insulating film formed on a substrate, the insulating layer including a trench. A gate insulating layer is formed on a bottom surface of the trench and a reaction prevention layer is formed on the gate insulating layer on the bottom surface of the trench. A replacement metal gate structure is formed on the reaction prevention layer of the trench to fill the trench.

Abstract: A semiconductor device includes an interlayer insulating film formed on a substrate, the insulating layer including a trench. A gate insulating layer is formed on a bottom surface of the trench and a reaction prevention layer is formed on the gate insulating layer on the bottom surface of the trench. A replacement metal gate structure is formed on the reaction prevention layer of the trench to fill the trench.