Patents by Inventor Jun Sung MA

Jun Sung MA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method for semiconductor package including filling member and membrane member
    Patent number: 11450535
    Abstract: A semiconductor package comprising a fan-out structure and a manufacturing method therefor are disclosed. A semiconductor package according to an embodiment of the present invention comprises: a wiring unit comprising an insulation layer and a wiring layer; a semiconductor chip mounted on the wiring unit and coupled to the wiring layer by flip-chip bonding; a filling member for filling a gap between the semiconductor chip and the wiring unit; and a film member for performing coating so as to cover one surface of each of the semiconductor chip, the filling member, and the wiring unit.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: September 20, 2022
    Assignee: NEPES CO., LTD.
    Inventors: Yong-Tae Kwon, Jun-Kyu Lee, Si Woo Lim, Dong-Hoon Oh, Jun-Sung Ma, Tae-Won Kim
  • SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
    Publication number: 20190122899
    Abstract: A semiconductor package comprising a fan-out structure and a manufacturing method therefor are disclosed. A semiconductor package according to an embodiment of the present invention comprises: a wiring unit comprising an insulation layer and a wiring layer; a semiconductor chip mounted on the wiring unit and coupled to the wiring layer by flip-chip bonding; a filling member for filling a gap between the semiconductor chip and the wiring unit; and a film member for performing coating so as to cover one surface of each of the semiconductor chip, the filling member, and the wiring unit.
    Type: Application
    Filed: April 3, 2017
    Publication date: April 25, 2019
    Applicant: NEPES CO., LTD.
    Inventors: Yong-Tae KWON, Jun-Kyu LEE, Si Woo LIM, Dong Hoon OH, Jun Sung MA, Tae-Won KIM