Abstract: A substrate treating method includes a temperature stabilizing step for stabilizing a temperature of the substrate to a process temperature in a treating space for treating a substrate, a pressure stabilizing step for stabilizing a pressure of a plasma space for generating a plasma and a pressure of the treating space to a process, the plasma space fluid communicating with the treating space, and a treating step for generating the plasma at the plasma space and treating the substrate using the plasma.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having an inner space; a plate separating the inner space into a first space which is above and a second space which is below and having a plurality of through holes; a first gas supply unit configured to supply a first gas to the first space; a plasma source for generating a plasma at the first space or the second space; and a monitoring unit installed at the plate and configured to monitor a characteristic of the plasma generated at the first space or the second space.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing defining a treating space; a chuck supporting a substrate at the treating space and providing a bottom electrode for generating a plasma at the treating space; a top electrode; and an ion blocker positioned between the top electrode and the treating space.

Abstract: An embodiment of the present invention provides a substrate cleaning method including: supplying of a liquid cleaning solution containing a thermoreactive polymer resin in a solvent to a substrate; trapping of particles by gelling the liquid cleaning solution by phase transition through first heat treatment; liquefying of the gel-state cleaning solution with the particle trapped therein by phase transition through second heat treatment; and removing of the liquefied cleaning solution by supplying a rinse solution.

Abstract: An embodiment of the present invention provides a substrate cleaning method including: supplying of a liquid cleaning solution containing a thermoreactive polymer resin in a solvent to a substrate; trapping of particles by gelling the liquid cleaning solution by phase transition through first heat treatment; liquefying of the gel-state cleaning solution with the particle trapped therein by phase transition through second heat treatment; and removing of the liquefied cleaning solution by supplying a rinse solution.