Patents by Inventor Jun Takasou

Jun Takasou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laser diode drive circuit
    Patent number: 7457336
    Abstract: A laser diode drive circuit includes a first transistor having a collector connected to an anode of a laser diode; a second transistor having a collector connected to a cathode of the laser diode; a constant current circuit connected between a ground point and emitters of the first and second transistors; a first high-pass filter connected between the base and the collector of the first transistor; and a second high-pass filter connected between the base and the collector of the second transistor.
    Type: Grant
    Filed: October 17, 2006
    Date of Patent: November 25, 2008
    Assignee: Mitsubishi Electric Corporation
    Inventors: Jun Takasou, Norio Higashisaka
  • Molded semiconductor package
    Patent number: 7414300
    Abstract: A molded semiconductor package has a lead frame to which an LSI is bonded, inner lead frames located on opposing sides of the lead frame, and wires. Each wire is connected between the LSI and a corresponding one of the inner lead frames. A distance between an edge of the lead frame (or an edge of the molded semiconductor package) and an end of inner lead frame is larger than a distance between another edge of the lead frame (or another edge of the molded semiconductor package) and an edge of an inner lead frame to minimize the length of wires connected to the lead frame.
    Type: Grant
    Filed: March 24, 2006
    Date of Patent: August 19, 2008
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Jun Takasou, Katsumi Miyawaki
  • LASER DIODE DRIVE CIRCUIT
    Publication number: 20070263685
    Abstract: A laser diode drive circuit includes a first transistor having a collector connected to an anode of a laser diode; a second transistor having a collector connected to a cathode of the laser diode; a constant current circuit connected between a ground point and emitters of the first and second transistors; a first high-pass filter connected between the base and the collector of the first transistor; and a second high-pass filter connected between the base and the collector of the second transistor.
    Type: Application
    Filed: October 17, 2006
    Publication date: November 15, 2007
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Jun TAKASOU, Norio HIGASHISAKA
  • Molded semiconductor package
    Publication number: 20070069343
    Abstract: A molded semiconductor package has a lead frame to which an LSI is bonded, inner lead frames located on opposing sides of the lead frame, and wires. Each wire is connected between the LSI and a corresponding one of the inner lead frames. A distance between an edge of the lead frame (or an edge of the molded semiconductor package) and an end of inner lead frame is larger than a distance between another edge of the lead frame (or another edge of the molded semiconductor package) and an edge of an inner lead frame to minimize the length of wires connected to the lead frame.
    Type: Application
    Filed: March 24, 2006
    Publication date: March 29, 2007
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Jun Takasou, Katsumi Miyawaki