Patents by Inventor Jun Tsukakoshi

Jun Tsukakoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8324714
    Abstract: A semiconductor device includes a semiconductor substrate having a main surface in which a semiconductor element region where a plurality of functional elements are formed is formed; a multilevel wiring layer disposed on the main surface of the semiconductor substrate; a first organic insulating material layer disposed on the multilevel wiring layer; a groove that penetrates the multilevel wiring layer on a scribe region that surrounds the semiconductor element region; and an organic insulating material that is spaced from the first organic insulating material layer and disposed in the groove.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: December 4, 2012
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Jun Tsukakoshi, Yoshitaka Aiba
  • Publication number: 20110127647
    Abstract: A semiconductor device includes a semiconductor substrate having a main surface in which a semiconductor element region where a plurality of functional elements are formed is formed; a multilevel wiring layer disposed on the main surface of the semiconductor substrate; a first organic insulating material layer disposed on the multilevel wiring layer; a groove that penetrates the multilevel wiring layer on a scribe region that surrounds the semiconductor element region; and an organic insulating material that is spaced from the first organic insulating material layer and disposed in the groove.
    Type: Application
    Filed: November 30, 2010
    Publication date: June 2, 2011
    Applicant: FUJITSU SEMICONDUCTOR LIMITED
    Inventors: Jun TSUKAKOSHI, Yoshitaka AIBA