Patents by Inventor Jun-voung Lee

Jun-voung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060103984
    Abstract: Provided is a flexible printed circuit including a circuit layer with a desired circuit formed thereon, a base layer supporting the circuit layer, a conductive metal layer positioned on at least one side of the base layer, and an insulation film interposed between the base layer and the conductive metal layer. A hole is formed on the circuit layer and the base layer through punching work, and the insulation film covers one end of the hole.
    Type: Application
    Filed: October 28, 2005
    Publication date: May 18, 2006
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-chul Shin, Jeong-seon Kim, Severinets Georgiy, Jun-voung Lee