Patents by Inventor Jun-Wen Teng

Jun-Wen Teng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190090367
    Abstract: An electronic device casing includes a main casing and a flexible member. The main casing includes a first surface and a second surface opposite to each other, an opening passing through the first surface and the second surface, and a fixing member located near the opening and protruding from the second surface. The flexible member and the main casing are integrally formed by double injection molding. The flexible member is disposed on the second surface and covers the opening. The fixing member passes through the flexible member. A manufacturing method of electronic device casing is further provided.
    Type: Application
    Filed: November 9, 2017
    Publication date: March 21, 2019
    Applicant: Lite-On Technology Corporation
    Inventors: Jun-Wen Teng, Chieh-Hung Chen
  • Patent number: D838716
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: January 22, 2019
    Assignee: Lite-On Technology Corporation
    Inventors: Jun-Wen Teng, Chieh-Hung Chen