Abstract: Provided is a stacked electrode assembly including: a lowermost electrode arranged on a lowermost portion of the stacked electrode assembly; an uppermost electrode arranged on an uppermost portion of the stacked electrode assembly; at least one unit stacked body arranged between the lowermost electrode and the uppermost electrode and including a positive electrode, a negative electrode, and a separator, the separator being arranged between the positive electrode and the negative electrode; and a separator arranged between the lowermost electrode and the at least one unit stacked body, and between the at least one unit stacked body and the uppermost electrode. A capacity and energy density of a lithium battery may be improved by employing an electrode including a mesh electrode current collector as the lowermost electrode or the uppermost electrode of the stacked electrode assembly.

Abstract: An image sensor with improved performance is provided. The image sensor includes a substrate, a prism structure on the substrate, the prism structure including at least one nanopattern, and an anti-reflection structure on the prism structure, the anti-reflection structure including at least one opening array, the opening array including a plurality of spaced-apart openings.

Abstract: An organic compound, an organic photoelectric device, an image sensor, and an electronic device, the organic compound being represented by Chemical Formula 1: wherein, in Chemical Formula 1, R1, R2, R3, R4, R5, and R6 are each independently a hydrogen atom, a substituted or unsubstituted C1-C4 alkyl group, a substituted or unsubstituted C1-C4 alkoxy group, or a substituted or unsubstituted C1-C4 alkylthio group, and A is a functional group including a heteroaryl group that includes at least one sulfur atom.

Abstract: An organic photoelectric conversion device and an image sensor, the organic photoelectric conversion device including an upper electrode; a lower electrode; and an active layer between the upper electrode and the lower electrode, wherein the active layer includes bis-(4-dimethylaminodithiobenzyl)-Ni(II) (BDN) and [6,6]-Phenyl-C71-butyric acid methyl ester (PC70BM).

Abstract: An organic compound, an organic photoelectric device, an image sensor, and an electronic device, the organic compound being represented by Chemical Formula 1: wherein, in Chemical Formula 1, R1, R2, R3, R4, R5, and R6 are each independently a hydrogen atom, a substituted or unsubstituted C1-C4 alkyl group, a substituted or unsubstituted C1-C4 alkoxy group, or a substituted or unsubstituted C1-C4 alkylthio group, and A is a functional group including a heteroaryl group that includes at least one sulfur atom.

Abstract: A method of manufacturing a semiconductor package, the method including forming a hole that penetrates an interconnect substrate; providing a first carrier substrate below the interconnect substrate; providing a semiconductor chip in the hole; forming a molding layer by coating a molding composition on the semiconductor chip and the interconnect substrate; adhering a second carrier substrate onto the molding layer with an adhesive layer; removing the first carrier substrate to expose a bottom surface of the semiconductor chip and a bottom surface of the interconnect substrate; forming a redistribution substrate below the semiconductor chip and the interconnect substrate; detaching the second carrier substrate from the adhesive layer; and removing the adhesive layer.

Abstract: A method of manufacturing a semiconductor package, the method including forming a hole that penetrates an interconnect substrate; providing a first carrier substrate below the interconnect substrate; providing a semiconductor chip in the hole; forming a molding layer by coating a molding composition on the semiconductor chip and the interconnect substrate; adhering a second carrier substrate onto the molding layer with an adhesive layer; removing the first carrier substrate to expose a bottom surface of the semiconductor chip and a bottom surface of the interconnect substrate; forming a redistribution substrate below the semiconductor chip and the interconnect substrate; detaching the second carrier substrate from the adhesive layer; and removing the adhesive layer.

Abstract: The inventive concepts provide methods of purifying a block copolymer and methods of forming a pattern using the same. The purifying method is performed using a first adsorbent. The first adsorbent has adsorbability with respect to a first polymer block having a molecular weight equal to or greater than a first average molecular weight. The purifying method further includes purifying a synthesized polymer using a second adsorbent. The second adsorbent interacts with a second polymer block.