Patents by Inventor Jun Woo Yang
Jun Woo Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240143114Abstract: A driving circuit includes: a display driver to generate a horizontal synchronization signal and a vertical synchronization signal according to a first clock signal of a first oscillator; a sensor driver to generate a touch signal according to a second clock signal of a second oscillator; and a determination circuit to detect a cycle of at least one of the horizontal synchronization signal or the vertical synchronization signal according to the second clock signal, and output a detection signal when the cycle is out of a range. The determination circuit is a part of the display driver or the sensor driver.Type: ApplicationFiled: June 26, 2023Publication date: May 2, 2024Inventors: Jun Young KO, Tae Hyeon YANG, Han Su CHO, Tae Joon KIM, Hyun Wook CHO, Jae Woo CHOI
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Publication number: 20240072428Abstract: The present disclosure in at least one embodiment provides a wireless communication device, comprising a lower case, an upper radome, coupled to the lower case, creating a storage space between the lower case and the upper radome, an antenna disposed in the storage space, and a plurality of internal substrates, disposed between the antenna and the lower case in the storage space, of which one of the plurality of internal substrates is connected to the antenna, wherein each internal substrate of the plurality of internal substrates is disposed along a first direction parallel to a surface of the lower case facing the plurality of internal substrates.Type: ApplicationFiled: November 7, 2023Publication date: February 29, 2024Applicant: KMW INC.Inventors: Min Sik PARK, Jun Woo YANG, Bung Chul KIM, In Ho KIM
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Patent number: 11855344Abstract: The present disclosure in at least one embodiment provides a wireless communication device, comprising a lower case, an upper radome, coupled to the lower case, creating a storage space between the lower case and the upper radome, an antenna disposed in the storage space, and a plurality of internal substrates, disposed between the antenna and the lower case in the storage space, of which one of the plurality of internal substrates is connected to the antenna, wherein each internal substrate of the plurality of internal substrates is disposed along a first direction parallel to a surface of the lower case facing the plurality of internal substrates.Type: GrantFiled: July 30, 2021Date of Patent: December 26, 2023Assignee: KMW INC.Inventors: Min Sik Park, Jun Woo Yang, Bung Chul Kim, In Ho Kim
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Patent number: 11398665Abstract: The present disclosure relates to a heat-radiating mechanism for an antenna device, and particularly, includes: a plurality of communication elements generating predetermined heat upon electrical operation, a heat-radiating combined case having the plurality of communication elements accommodated in one surface thereof and a plurality of heat-radiating ribs integrally formed on the other surface thereof, and an antenna board mounted with the plurality of communication elements on one surface of the heat-radiating combined case, in which the plurality of heat-radiating ribs are formed such that the rising airflow formed by being heat-radiated from the relatively lower portion of the heat-radiating combined case is exhausted to be inclined upward to the left and right outsides of the heat-radiating combined case in the width direction from the relatively upper position, thereby improving the heat-radiating performance of the antenna device.Type: GrantFiled: November 28, 2020Date of Patent: July 26, 2022Assignee: KMW, INC.Inventors: Chang Woo Yoo, Min Sik Park, Jun Woo Yang
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Patent number: 11324106Abstract: A cooling apparatus for an electronic element is provided. The cooling apparatus includes a printed circuit board, a housing main body, an additional cooling part, and a heat transfer part. The printed circuit board includes one surface and another surface. A plurality of electronic elements are provided on the one surface of the printed circuit board. The housing main body includes an inner surface and an outer surface. The another surface of the printed circuit board is attached to the inner surface of the housing main body, and the outer surface of the housing main body has a plurality of first cooling ribs provided to protrude therefrom. The additional cooling part is disposed to be spaced apart from the outer surface of the housing main body, and dissipates heat transferred from the housing main body.Type: GrantFiled: June 5, 2020Date of Patent: May 3, 2022Assignee: KMW INC.Inventors: Duk Yong Kim, Jun Woo Yang, Jin Soo Yeo, Chang Woo Yoo, Min Sik Park, Hye Yeon Kim
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Patent number: 11266041Abstract: A printed circuit board includes one surface on which a plurality of electronic elements are mounted, at least one of the plurality of electronic elements generating heat during its operation, a board case which accommodates the printed circuit board, a cooling cover which has an inner surface and an outer surface, and a plurality of radial cooling bodies each formed to extend from the outer surface of the cooling cover so as to be inclined upward and configured to receive the heat generated from the printed circuit board to dissipate the heat externally. The inner surface of the cooling cover is in close contact with another surface of the printed circuit board while covering the board case. Each of the plurality of radial cooling bodies includes a unit heat pipe.Type: GrantFiled: June 4, 2020Date of Patent: March 1, 2022Assignee: KMW INC.Inventors: Duk Yong Kim, Jun Woo Yang, Jin Soo Yeo, Chang Woo Yoo, Min Sik Park, Hye Yeon Kim
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Patent number: 11233308Abstract: The present disclosure relates to a multiple-input and multiple-output antenna apparatus, and particularly, includes a housing, a ray dome which is coupled to the top of one side of the housing in a longitudinal direction, and has an antenna assembly disposed between the ray dome and the housing, a PCB assembly which is disposed at the bottom of the antenna assembly, a top cooling part which is coupled to the top of the other side of the housing in the longitudinal direction, has a battery and an FPGA assembly disposed between the top cooling part and the housing, and dissipates upward the heat discharged from the FPGA assembly, and a side cooling part which is coupled to protrude to one side in a width direction between the housing and the top cooling part and the other side in the width direction therebetween, and moves and dissipates the heat generated from the FPGA assembly to one side and the other side of the housing in the width direction, thereby improving cooling performance.Type: GrantFiled: June 3, 2020Date of Patent: January 25, 2022Assignee: KMW INC.Inventors: Duk Yong Kim, Jun Woo Yang, Jin Soo Yeo, Chang Woo Yoo, Min Sik Park, Hye Yeon Kim
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Publication number: 20210359400Abstract: The present disclosure in at least one embodiment provides a wireless communication device, comprising a lower case, an upper radome, coupled to the lower case, creating a storage space between the lower case and the upper radome, an antenna disposed in the storage space, and a plurality of internal substrates, disposed between the antenna and the lower case in the storage space, of which one of the plurality of internal substrates is connected to the antenna, wherein each internal substrate of the plurality of internal substrates is disposed along a first direction parallel to a surface of the lower case facing the plurality of internal substrates.Type: ApplicationFiled: July 30, 2021Publication date: November 18, 2021Applicant: KMW INC.Inventors: Min Sik PARK, Jun Woo YANG, Bung Chul KIM, In Ho KIM
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Publication number: 20210083356Abstract: The present disclosure relates to a heat-radiating mechanism for an antenna device, and particularly, includes: a plurality of communication elements generating predetermined heat upon electrical operation, a heat-radiating combined case having the plurality of communication elements accommodated in one surface thereof and a plurality of heat-radiating ribs integrally formed on the other surface thereof, and an antenna board mounted with the plurality of communication elements on one surface of the heat-radiating combined case, in which the plurality of heat-radiating ribs are formed such that the rising airflow formed by being heat-radiated from the relatively lower portion of the heat-radiating combined case is exhausted to be inclined upward to the left and right outsides of the heat-radiating combined case in the width direction from the relatively upper position, thereby improving the heat-radiating performance of the antenna device.Type: ApplicationFiled: November 28, 2020Publication date: March 18, 2021Applicant: KMW INC.Inventors: Chang Woo YOO, Min Sik PARK, Jun Woo YANG
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Publication number: 20200305308Abstract: The present disclosure relates to a cooling apparatus for an electronic element, and includes a printed circuit board which has a plurality of electronic elements mounted on one surface, at least one of the plurality of electronic elements generating heat at operation, a board case which accommodates the printed circuit board, a cooling cover which has the inner surface in close contact with the other surface of the printed circuit board while covering the board case, and a plurality of radial cooling bodies which have at least one provided to protrude from the outer surface of the cooling cover, are each formed to extend to be inclined upward, and receive heat generated from the printed circuit board to dissipate the heat outward, thereby increasing an effective cooling area on a limited cooling portion to largely improve cooling performance.Type: ApplicationFiled: June 4, 2020Publication date: September 24, 2020Applicant: KMW INC.Inventors: Duk Yong Kim, Jun Woo Yang, Jin Soo Yeo, Chang Woo Yoo, Min Sik Park, Hye Yeon Kim
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Publication number: 20200305270Abstract: The present disclosure relates to a cooling apparatus for an electronic element, and particularly, includes a printed circuit board which has a plurality of electronic elements provided on one surface thereof as a unit heat-generating element, a housing main body which has the other surface of the printed circuit board accommodated to be in close contact therewith, and has a plurality of first cooling ribs provided to protrude from the outer surface thereof, an additional cooling part which is disposed to be spaced apart from the outer surface of the housing main body, and dissipates heat transferred from the housing main body, and a heat transfer part which has one end connected to the outer surface of the housing main body and the other end connected to the additional cooling part to transfer heat generated from the electronic element to the additional cooling part, thereby improving cooling performance.Type: ApplicationFiled: June 5, 2020Publication date: September 24, 2020Applicant: KMW INC.Inventors: Duk Yong Kim, Jun Woo Yang, Jin Soo Yeo, Chang Woo Yoo, Min Sik Park, Hye Yeon Kim
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Publication number: 20200295433Abstract: The present disclosure relates to a multiple-input and multiple-output antenna apparatus, and particularly, includes a housing, a ray dome which is coupled to the top of one side of the housing in a longitudinal direction, and has an antenna assembly disposed between the ray dome and the housing, a PCB assembly which is disposed at the bottom of the antenna assembly, a top cooling part which is coupled to the top of the other side of the housing in the longitudinal direction, has a battery and an FPGA assembly disposed between the top cooling part and the housing, and dissipates upward the heat discharged from the FPGA assembly, and a side cooling part which is coupled to protrude to one side in a width direction between the housing and the top cooling part and the other side in the width direction therebetween, and moves and dissipates the heat generated from the FPGA assembly to one side and the other side of the housing in the width direction, thereby improving cooling performance.Type: ApplicationFiled: June 3, 2020Publication date: September 17, 2020Applicant: KMW INC.Inventors: Duk Yong Kim, Jun Woo Yang, Jin Soo Yeo, Chang Woo Yoo, Min Sik Park, Hye Yeon Kim