Abstract: Provided are a heat dissipation device, a heat dissipation module, and an antenna apparatus including the same. The heat dissipation device includes heat receiving parts that collect heat generated from heating substances, and a heat discharging part that exchanges heat collected from the heating substances with outside air, wherein at least one of the heat receiving parts is coupled through a heat collection part, and is coupled to a housing body provided with the heating substances. The heat collection part includes: a heat transfer member for coupling formed with a plurality of fixed slits into which a part of at least one of the heat receiving parts is inserted; and a shielding cover coupled to the heat transfer member for coupling to form a predetermined refrigerant-filled space therein, and sealing the refrigerant-filled space.

Abstract: Provided are a heat dissipation device, a heat dissipation module, and an antenna apparatus including the same. The heat dissipation device includes a heat receiving part that collects heat generated from heating substances and a heat discharging part that performs heat exchange by diffusing the heat collected by the heat receiving part and is formed to occupy a part of a heat exchange region in such a manner that at least a tip of the heat discharging part extends to the heat exchange region on an outer side of the housing body provided with the heating substances, thereby enabling active heat exchange in the heat exchange region and facilitating expanded design of a heat dissipation surface area and thus providing the advantage of improving heat dissipation performance.

Abstract: The present disclosure relates to an active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space in which a refrigerant is stored and flows, the refrigerant flow space being formed in the thermal conduction panel body, in which the refrigerant flow space includes a first refrigerant flow path positioned to be adjacent to a press-fitting portion provided on a rear surface portion of a heat dissipation housing main body that is a heat dissipation target, the first refrigerant flow path having a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase, and a plurality of second refrigerant flow paths provided in a condensation zone provided in a portion other than the first refrigerant flow path and configured to guide a flow of a liquid refrigerant to the vaporization zone, and in which the second refrigerant flow paths protrude in the refrigerant flow space and have surfaces that adjoin one another and are in surface contact with

Abstract: The present disclosure relates to an active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space in which a refrigerant is stored and flows, in which the refrigerant flow space includes a first refrigerant flow path including a press-fitting end positioned adjacent to a press-fitting portion provided on a rear surface portion of a heat dissipation housing main body that is a heat dissipation target, the first refrigerant flow path having upper and lower ends coupled in a gravitational direction or coupled to be inclined with respect to the gravitational direction with respect to the press-fitting portion to define a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase, and a plurality of strength reinforcement portions formed in a condensation zone other than the first refrigerant flow path and disposed and spaced apart from one another in a predetermined pattern to guide a flow of a liquid refrigerant condensed in the conden

Abstract: The present disclosure relates to an active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space in which a refrigerant is stored and flows, in which the refrigerant flow space includes a first refrigerant flow path having a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase, and a plurality of second refrigerant flow paths provided in a condensation zone provided in a portion other than the first refrigerant flow path and configured to guide a flow of a liquid refrigerant to the vaporization zone, and in which the second refrigerant flow paths form independent flow paths for the liquid refrigerant by a plurality of inclined guides, which protrude in the refrigerant flow space, have surfaces that adjoin one another and are in surface contact with one another, and are provided straight and inclined toward the first refrigerant flow path so as to be physically separated from the adjacent second refrigerant flow path, and by a

Abstract: The present disclosure relates to an active heat dissipation apparatus and a method of manufacturing the same, and an active heat dissipation apparatus according to the present disclosure includes a thermal conduction panel body having therein a refrigerant flow space having a predetermined thickness, and a refrigerant with which the refrigerant flow space of the thermal conduction panel body is filled, in which the thermal conduction panel body is made of a metallic material capable of transferring heat into the refrigerant flow space from the outside, and in which the refrigerant is water that is changed in phase from a liquid state to a gaseous state or from a gaseous state to a liquid state by thermal conductivity of the thermal conduction panel body, thereby significantly improving heat dissipation performance.

Abstract: The present disclosure relates to an active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space in which a refrigerant is stored and flows, the refrigerant flow space being formed in the thermal conduction panel body by bending or joining at least one metal panel member, in which the refrigerant flow space includes a first refrigerant flow path positioned adjacent to a press-fitting portion provided in a rear surface portion of a heat dissipation housing main body that is a heat dissipation target, the first refrigerant flow path having a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase, and a plurality of strength reinforcement portions formed in a condensation zone excluding the vaporization zone of the first refrigerant flow path and configured to reinforce rigidity of the thermal conduction panel body configured to define one side surface and the other side surface of the refrigerant flow space, thereby significantly

Abstract: The present disclosure relates to an active heat dissipation apparatus and a method of manufacturing the same, the active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space with which a refrigerant is filled, in which the refrigerant flow space includes a first refrigerant flow path in which the thermal conduction panel body is supplied with heat from a heat generation element that is a heat dissipation target, and a plurality of second refrigerant flow paths connected to the first refrigerant flow path and configured such that a liquid refrigerant in the refrigerant, which is condensed into a liquid state from a gaseous state, is uniformly supplied to the first refrigerant flow path, thereby significantly improving heat dissipation performance.

Abstract: A heat sink structure according to the present invention comprises: a cover plate having one surface on which a printed circuit board provided with a heat generating element is mounted to receive heat from the heat generating element; and a heat sink body part having an inner space divided, by the cover plate, into a receiving space, in which the printed circuit board is received, and a refrigerant chamber in which a refrigerant is filled, wherein a plurality of refrigerant condensation grooves, in which a gaseous refrigerant thermally exchanged with the cover plate is condensed while flowing, are formed on at least one surface of the refrigerant chamber so that a gaseous refrigerant thermally exchanged with heat generated by the heat generating element is rapidly condensed and thus the heat generated in the heat generating element can be rapidly dissipated.

Abstract: The present disclosure in at least one embodiment provides a wireless communication device, comprising a lower case, an upper radome, coupled to the lower case, creating a storage space between the lower case and the upper radome, an antenna disposed in the storage space, and a plurality of internal substrates, disposed between the antenna and the lower case in the storage space, of which one of the plurality of internal substrates is connected to the antenna, wherein each internal substrate of the plurality of internal substrates is disposed along a first direction parallel to a surface of the lower case facing the plurality of internal substrates.

Abstract: The present disclosure relates to an active heat dissipation apparatus and a method of manufacturing the same, and the active heat dissipation apparatus includes a thermal conduction panel body having a refrigerant flow space configured to provide a space in which gas-liquid circulation is performed so that a refrigerant dissipates heat while changing phases in a closed space having an interior filled with the refrigerant, in which the refrigerant flow space includes a first refrigerant flow path that is a vaporization zone in which the thermal conduction panel body is supplied with heat from a heat generation element that is a heat dissipation target, and a second refrigerant flow path configured to serve as a route through which a liquid refrigerant in the refrigerant, which is condensed into a liquid state from a gaseous state, flows toward the first refrigerant flow path by surface tension or gravity.

Abstract: A wireless communication apparatus is disclosed. According to at least one embodiment of the present disclosure, a wireless communication apparatus including a main case; a random disposed on a front surface of the main case and forming an accommodation space therein; a heat dissipation portion disposed at a rear surface of the random; an upper screen disposed in contact with a rear end of an upper surface of the main case and having a plurality of first through holes formed therein; and a cover portion disposed on a rear surface of the main case, configured to be opened and closed, and having a plurality of second through holes formed therein.

Abstract: The present disclosure relates to an electronic device, and more specifically, to an electronic device including a printed circuit board including a heat-generating element arranged on one surface thereof, and a heat transfer coin provided such that one surface of the heat transfer coin comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated from the heat-generating element. Accordingly, the present disclosure provides an advantage of improving heat dissipation performance without increasing the thickness of the printed circuit board.

Abstract: The present invention relates to a signal shielding apparatus and an antenna apparatus including same, and in particular, comprises a shield cover which is stacked and disposed on a printed board assembly (hereinafter, abbreviated to “PBA”), in which a plurality of signal-related components are mounted on one side thereof to prevent leakage of a signal from the plurality of signal-related components, wherein a grooved shield cover seating groove is formed in one surface of the PBA, and an insertion end insertably seated in the shield cover seating groove is integrally formed in the other surface from among one surface and the other surface of the shield cover, the other surface facing the one surface of the PBA, thereby providing advantages in that an increase in the manufacturing cost may be prevented, EMI shielding may be facilitated, and heat dissipation performance may be significantly improved.

Abstract: The present disclosure in at least one embodiment provides a wireless communication device, comprising a lower case, an upper radome, coupled to the lower case, creating a storage space between the lower case and the upper radome, an antenna disposed in the storage space, and a plurality of internal substrates, disposed between the antenna and the lower case in the storage space, of which one of the plurality of internal substrates is connected to the antenna, wherein each internal substrate of the plurality of internal substrates is disposed along a first direction parallel to a surface of the lower case facing the plurality of internal substrates.

Abstract: The present disclosure in at least one embodiment provides a wireless communication device, comprising a lower case, an upper radome, coupled to the lower case, creating a storage space between the lower case and the upper radome, an antenna disposed in the storage space, and a plurality of internal substrates, disposed between the antenna and the lower case in the storage space, of which one of the plurality of internal substrates is connected to the antenna, wherein each internal substrate of the plurality of internal substrates is disposed along a first direction parallel to a surface of the lower case facing the plurality of internal substrates.

Abstract: The present disclosure relates to a heat-radiating mechanism for an antenna device, and particularly, includes: a plurality of communication elements generating predetermined heat upon electrical operation, a heat-radiating combined case having the plurality of communication elements accommodated in one surface thereof and a plurality of heat-radiating ribs integrally formed on the other surface thereof, and an antenna board mounted with the plurality of communication elements on one surface of the heat-radiating combined case, in which the plurality of heat-radiating ribs are formed such that the rising airflow formed by being heat-radiated from the relatively lower portion of the heat-radiating combined case is exhausted to be inclined upward to the left and right outsides of the heat-radiating combined case in the width direction from the relatively upper position, thereby improving the heat-radiating performance of the antenna device.

Abstract: A cooling apparatus for an electronic element is provided. The cooling apparatus includes a printed circuit board, a housing main body, an additional cooling part, and a heat transfer part. The printed circuit board includes one surface and another surface. A plurality of electronic elements are provided on the one surface of the printed circuit board. The housing main body includes an inner surface and an outer surface. The another surface of the printed circuit board is attached to the inner surface of the housing main body, and the outer surface of the housing main body has a plurality of first cooling ribs provided to protrude therefrom. The additional cooling part is disposed to be spaced apart from the outer surface of the housing main body, and dissipates heat transferred from the housing main body.

Abstract: A printed circuit board includes one surface on which a plurality of electronic elements are mounted, at least one of the plurality of electronic elements generating heat during its operation, a board case which accommodates the printed circuit board, a cooling cover which has an inner surface and an outer surface, and a plurality of radial cooling bodies each formed to extend from the outer surface of the cooling cover so as to be inclined upward and configured to receive the heat generated from the printed circuit board to dissipate the heat externally. The inner surface of the cooling cover is in close contact with another surface of the printed circuit board while covering the board case. Each of the plurality of radial cooling bodies includes a unit heat pipe.

Abstract: The present disclosure relates to a multiple-input and multiple-output antenna apparatus, and particularly, includes a housing, a ray dome which is coupled to the top of one side of the housing in a longitudinal direction, and has an antenna assembly disposed between the ray dome and the housing, a PCB assembly which is disposed at the bottom of the antenna assembly, a top cooling part which is coupled to the top of the other side of the housing in the longitudinal direction, has a battery and an FPGA assembly disposed between the top cooling part and the housing, and dissipates upward the heat discharged from the FPGA assembly, and a side cooling part which is coupled to protrude to one side in a width direction between the housing and the top cooling part and the other side in the width direction therebetween, and moves and dissipates the heat generated from the FPGA assembly to one side and the other side of the housing in the width direction, thereby improving cooling performance.