Patents by Inventor Jun Woo Yang

Jun Woo Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200305270
    Abstract: The present disclosure relates to a cooling apparatus for an electronic element, and particularly, includes a printed circuit board which has a plurality of electronic elements provided on one surface thereof as a unit heat-generating element, a housing main body which has the other surface of the printed circuit board accommodated to be in close contact therewith, and has a plurality of first cooling ribs provided to protrude from the outer surface thereof, an additional cooling part which is disposed to be spaced apart from the outer surface of the housing main body, and dissipates heat transferred from the housing main body, and a heat transfer part which has one end connected to the outer surface of the housing main body and the other end connected to the additional cooling part to transfer heat generated from the electronic element to the additional cooling part, thereby improving cooling performance.
    Type: Application
    Filed: June 5, 2020
    Publication date: September 24, 2020
    Applicant: KMW INC.
    Inventors: Duk Yong Kim, Jun Woo Yang, Jin Soo Yeo, Chang Woo Yoo, Min Sik Park, Hye Yeon Kim
  • Publication number: 20200305308
    Abstract: The present disclosure relates to a cooling apparatus for an electronic element, and includes a printed circuit board which has a plurality of electronic elements mounted on one surface, at least one of the plurality of electronic elements generating heat at operation, a board case which accommodates the printed circuit board, a cooling cover which has the inner surface in close contact with the other surface of the printed circuit board while covering the board case, and a plurality of radial cooling bodies which have at least one provided to protrude from the outer surface of the cooling cover, are each formed to extend to be inclined upward, and receive heat generated from the printed circuit board to dissipate the heat outward, thereby increasing an effective cooling area on a limited cooling portion to largely improve cooling performance.
    Type: Application
    Filed: June 4, 2020
    Publication date: September 24, 2020
    Applicant: KMW INC.
    Inventors: Duk Yong Kim, Jun Woo Yang, Jin Soo Yeo, Chang Woo Yoo, Min Sik Park, Hye Yeon Kim
  • Publication number: 20200295433
    Abstract: The present disclosure relates to a multiple-input and multiple-output antenna apparatus, and particularly, includes a housing, a ray dome which is coupled to the top of one side of the housing in a longitudinal direction, and has an antenna assembly disposed between the ray dome and the housing, a PCB assembly which is disposed at the bottom of the antenna assembly, a top cooling part which is coupled to the top of the other side of the housing in the longitudinal direction, has a battery and an FPGA assembly disposed between the top cooling part and the housing, and dissipates upward the heat discharged from the FPGA assembly, and a side cooling part which is coupled to protrude to one side in a width direction between the housing and the top cooling part and the other side in the width direction therebetween, and moves and dissipates the heat generated from the FPGA assembly to one side and the other side of the housing in the width direction, thereby improving cooling performance.
    Type: Application
    Filed: June 3, 2020
    Publication date: September 17, 2020
    Applicant: KMW INC.
    Inventors: Duk Yong Kim, Jun Woo Yang, Jin Soo Yeo, Chang Woo Yoo, Min Sik Park, Hye Yeon Kim
  • Publication number: 20200157344
    Abstract: Provided is a binder composition including polylysine and at least one reducing sugar or a derivative thereof, wherein the polylysine has, in a 1H NMR spectrum thereof, a first peak at 3.2 ppm to 3.4 ppm and a second peak at 3.8 ppm to 4.0 ppm, wherein a ratio (A:B) of an area of the first peak (A) to an area of the second peak (B) is 70:30 to 98:2.
    Type: Application
    Filed: April 13, 2018
    Publication date: May 21, 2020
    Inventors: Ji Eun KIM, Chang Suk LEE, Jun Ok MOON, Young Lyeol YANG, Chang Yub OH, Hang Duk ROH, Do Yong SIM, Kwang Myung CHO, Jin Woo CHOI
  • Publication number: 20190169325
    Abstract: A high-density ethylene-based polymer is provided. The high-density ethylene-based polymer contains an ethylene homopolymer or a copolymer of ethylene and at least one comonomer selected from the group consisting of an ?-olefin, a cyclic olefin, and a straight, branched and cyclic diene. The high-density polyethylene resin has a wide molecular weight distribution and excellent comonomer distribution characteristics, has excellent melt flowability due to a long chain branched structure, and has excellent mechanical characteristics since the comonomer distribution is concentrated in a high-molecular-weight body. The high-density ethylene polymer has excellent molding processability during processing such as extrusion, compression, injection and rotational molding by having excellent mechanical characteristics and melt flowability.
    Type: Application
    Filed: February 10, 2017
    Publication date: June 6, 2019
    Applicant: HANWHA CHEMICAL CORPORATION
    Inventors: In Jun LEE, Won Jun KANG, Dong Ok KIM, Song Hee YANG, Sung Woo LEE, Dong Wook JEONG, Ui Gab JOUNG
  • Publication number: 20190169323
    Abstract: The present invention relates to a high-density ethylene-based polymer comprising an ethylene homopolymer or a copolymer of ethylene and at least one comonomer selected from the group consisting of an ?-olefin, a cyclic olefin, and a straight, branched and cyclic diene. According to the present invention, the high-density polyethylene resin has a wide molecular weight distribution and excellent comonomer distribution characteristics, has excellent melt flowability due to a long chain branched structure, and has excellent mechanical characteristics since the comonomer distribution is concentrated in a high-molecular-weight body. The high-density ethylene polymer of the present invention has excellent molding processability during processing such as extrusion, compression, injection and rotational molding by having excellent mechanical characteristics and melt flowability.
    Type: Application
    Filed: April 7, 2017
    Publication date: June 6, 2019
    Applicant: HANWHA CHEMICAL CORPORATION
    Inventors: In Jun LEE, Won Jun KANG, Dong Ok KIM, Song Hee YANG, Sung Woo LEE, Dong Wook JEONG, Ui Gab JOUNG
  • Patent number: 10293705
    Abstract: A vehicle may include a first battery to output power of a first voltage, a second battery to output power of a second voltage, a DC-DC converter to convert the first voltage of the first battery into the second voltage, and to supply the power of the second voltage to the second battery. The DC-DC converter may include a transformer to convert the first voltage into the second voltage, a first switch to control first current input to the transformer from the first battery, a current sensor to measure a value of second current output to the second battery from the transformer, and a controller to turn on/off the first switch based on a set turning-on/off frequency. The controller may delay turning-on/off of the first switch based on the measured value of the second current.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: May 21, 2019
    Assignee: HYUNDAI MOTOR COMPANY
    Inventors: Dae Woo Lee, Woo Young Lee, Jun Ho Kim, Taejong Ha, JaeEun Cha, Jin Myeong Yang, Inyong Yeo