Abstract: The present invention relates to a surface acoustic wave device package and a method of manufacturing the same, and more specifically, to a method of manufacturing a miniaturized surface acoustic wave device package.

Abstract: The present invention relates to a surface acoustic wave device package and a method of manufacturing the same, and more specifically, to a method of manufacturing a miniaturized surface acoustic wave device package.

Abstract: A wafer level package includes a substrate including bonding pads and a first protection dam and having a plurality of circuit pattern units disposed on a side; a printed circuit board having a plurality of connection pads, a second protection dam and via holes disposed thereon; and a connection unit connected to some of the plurality of connection pads and the second protection dam disposed on the printed circuit board. Freedom of design can be improved through the wafer level package and the manufacturing method thereof, and reliability of the wafer level package can be improved. The manufacturing process can be simplified as the bridge process is omitted when wiring is designed, and the size of an element may be reduced.

Abstract: A wafer level package includes: a substrate having a circuit pattern unit, a pad spaced apart from the circuit pattern unit, a bonding pad disposed on a side of the pad, and a first protection dam; and a printed circuit board having a connection pad and a second protection dam, where the substrate and the printed circuit board are attached through the bonding and connection pads and the first and second protection dams. A method of manufacturing a wafer level package includes: forming a circuit pattern unit on a substrate; disposing a pad spaced apart from the circuit pattern unit; forming a secondary film on a side of the pad; forming a protection film, excluding some of the pads where the secondary film is formed; disposing a bonding pad and a protection dam on a side of the pad; attaching the manufactured substrate and printed circuit board to each other.

Abstract: A wafer level package includes a substrate including bonding pads and a first protection dam and having a plurality of circuit pattern units disposed on a side; a printed circuit board having a plurality of connection pads, a second protection dam and via holes disposed thereon; and a connection unit connected to some of the plurality of connection pads and the second protection dam disposed on the printed circuit board. Freedom of design can be improved through the wafer level package and the manufacturing method thereof, and reliability of the wafer level package can be improved. The manufacturing process can be simplified as the bridge process is omitted when wiring is designed, and the size of an element may be reduced.